Abstract:
An improved connector terminal has a profile which facilitates insertion into engagement holes on a circuit board. The terminals may be part of an assembly which includes a series of terminals arranged in a spaced-apart array. Each has a solder tail portion defined by a straight edge proximate to the centerline and a slanted edge which diagonally extends from the other side and which traverses the centerline to intersect with the first side to thereby form an acute angle at the tip of the terminal near the centerline to provide comparable positioning allowances on the opposite sides of the centerline to facilitate mounting of the terminals on a circuit board. The acute angle point is advantageous to the optical measurement of terminal intervals for the quality control.
Abstract:
A contact tail (272) for an electronic component compatible with surface mount manufacturing techniques. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. High precision in the contact tails in turn provides more reliable solder joints across an array of contact tails in an electronic component. Further, the contact tail may be shaped to reduce the propensity for solder to wick from the attachment area during a reflow operation. Reducing the propensity of solder to wick reduces the chance that solder will interfere with the operation of the electronic component. Additionally, reducing the propensity for solder to wick allows pads (302) to which the contact tail is attached to be positioned over vias (304), thereby increasing the density with which contacts may be attached to a substrate. The reliability with which electronic assemblies incorporating components using the contact tail is also increased when the contact tail is used in self-centering arrays.
Abstract:
A contact tail for an electronic component compatible with surface mount manufacturing techniques. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. High precision in the contact tails in turn provides more reliable solder joints across an array of contact tails in an electronic component. Further, the contact tail may be shaped to reduce the propensity for solder to wick from the attachment area during a reflow operation. Reducing the propensity of solder to wick reduces the chance that solder will interfere with the operation of the electronic component. Additionally, reducing the propensity for solder to wick allows pads to which the contact tail is attached to be positioned over vias, thereby increasing the density with which contacts may be attached to a substrate. The reliability with which electronic assemblies incorporating components using the contact tail is also increased when the contact tail is used in self-centering arrays.