Abstract:
A method of connecting an end of an electrically conductive lead (7) to a surface of an electrically conductive bump (4) formed on a contact of a die, wherein the end is stitch bonded to the surface of the bump (4).
Abstract:
An integrated circuit is formed having an array of memory cells located in the dielectric stack above a semiconductor substrate. Each memory cell has an adjustable resistor and a heating element. A dielectric material separates the heating element from the adjustable resistor. The heating element alters the resistance of the resistor by applying heat thereto. The magnitude of the resistance of the adjustable resistor represents the value of data stored in the memory cell.
Abstract:
A semiconductor package is disclosed. The package includes a substrate; a semiconductor die attached to the substrate; a housing part attached to the substrate and arranged to surround the semiconductor die; and solidified moulding material arranged around the housing and adhering to the substrate to secure the housing in position on the substrate. A method of manufacturing the package is also disclosed.
Abstract:
The present disclosure is directed to a thin film resistor (102) having a first resistor layer (103a) having a first temperature coefficient of resistance and a second resistor layer (103b) on the first resistor layer, the second resistor layer having a second temperature coefficient of resistance different from the first temperature coefficient of resistance. The first temperature coefficient of resistance may be positive while the second temperature coefficient of resistance is negative. The first resistor layer may have a thickness in the range of 5-15 nm and the second resistor layer may have a thickness in the range of 2-5 nm.
Abstract:
A camera module lens cap is provided to protect camera modules in mobile devices where the camera modules are exposed. The lens cap has an overhanging lip and a central transparent portion.