Abstract:
Microelectronic light-emitting device (10) made with dual lateral thin-film emitters (35, 40) parallel to substrate (20). Each emitter has an emitting blade edge (110, 115). Opposed emitters for two opposite sign carriers are provided. Phosphor region (50) extends between the two emitters and contacts them. When a bias voltage is applied, electrons are injected into the phosphor from one emitter and holes are injected from the other. In the fabrication process these steps are performed: an insulating substrate is provided (S1, S2); an ultra-thin conductive emitter film is deposited and patterned (S3); an insulating layer is deposited over the emitter film (S4); conductive contacts are made through the insulating layer to the emitter film (S5, S6); a trench opening is etched through the insulating layer and emitter film, thus forming two emitting edges of two emitters (S7); phosphor is deposited into the trench opening and planarized (S8, S9); means are provided for applying an electrical bias to the two emitter contacts (S10).
Abstract:
A lateral field-emission device (10) has a lateral emitter (100) substantially parallel to a substrate (20) and has a simplified anode structure (70). The anode's top surface is precisely spaced apart from the plane of the lateral emitter and receives electrons emitted by field emission from the edge of the lateral emitter cathode, when a suitable bias voltage is applied. The device may be configured as a diode, or as a triode, tetrode, etc. having control electrodes (140) positioned to allow control of current from the emitter to the anode by an electrical signal applied to the control electrode.
Abstract:
Phosphor compositions are prepared by treating metal oxides or mixed-metal oxides with refractory metals to form cathodoluminescent phosphors stimulatable by electrons of very low energy. The phosphors comprise 90 % to 100 % of a mixed metal oxide MxTyOz (where M is a metal selected from Zn, Sn, In, Cu, and combinations thereof; T is a refractory metal selected from Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, and combinations thereof; and O is Oxygen, x, y, and z being chosen such that z is at most stoichiometric for MxTyOz) and 0 % to 10 % of a dopant comprising a substance selected from a rare earth element of the lanthanide series, Mn, Cr, and combinations thereof, or stoichiometrically excess Zn, Cu, Sn, or In. A blue-light-emitting phosphor based on ZnO treated with Ta2O5 or Ta to form Ta2Zn3O8 is characterized by CIE 1931 chromaticity values x and y, where x is between about 0.14 and 0.20 and y is between about 0.05 and 0.15. In preferred embodiments, a process is specially adapted for forming the phosphor in an electrically-conductive thin-film or surface-layer form in situ during fabrication of displays. A preferred in situ process has an integrated etch stop, which precisely defines the depth of an opening in a field-emission display structure utilizing the low-energy-electron excited phosphor. A field-emission display comprises cells, each having a field-emission cathode and an anode comprising at least one cathodoluminescent phosphor. Arrangements of various color phosphors may be made by selective deposition of suitable dopants. The display cell structures may also have gate elements for controlling electron current flowing to the anode and its phosphor when suitable voltages are applied.
Abstract translation:通过用难熔金属处理金属氧化物或混合金属氧化物以形成可由非常低能量的电子刺激的阴极发光荧光体来制备荧光体组合物。 荧光体包含90%至100%的混合金属氧化物MxTyOz(其中M是选自Zn,Sn,In,Cu及其组合的金属; T是选自Ti,Zr,Hf,V,Nb ,Ta,Cr,Mo,W及其组合; O是选择氧,x,y和z,使得z对于M x T y O z为至多化学计量),并且0%至10%的掺杂剂包含选自 镧系稀土元素,Mn,Cr及其组合,或化学计量过量的Zn,Cu,Sn或In。 基于用Ta 2 O 5或Ta处理以形成Ta 2 Zn 3 O 8的ZnO的蓝色发光荧光体的特征在于CIE 1931色度值x和y,其中x在约0.14和0.20之间,y在约0.05和0.15之间。 在优选实施例中,一种工艺特别适用于在制造显示器期间在原位形成导电薄膜或表面层形式的荧光体。 优选的原位工艺具有集成的蚀刻停止件,其利用低能电子激发的荧光体在场发射显示结构中精确地限定开口的深度。 场致发射显示器包括每个具有场致发射阴极和包括至少一个阴极发光荧光体的阳极的单元。 可以通过选择性沉积合适的掺杂剂来制备各种颜色的磷光体的布置。 当施加合适的电压时,显示单元结构还可以具有用于控制流向阳极的电子电流的栅极元件及其荧光体。
Abstract:
Microelectronic field emission device (10) has an ultra-thin emitter electrode (30) extending parallel to substrate (20) and an anode (40). A control electrode (70) having a lateral dimension a small fraction of the emitter-to-anode gap width and a height dimension a small fraction of the anode height is spaced from the emitter by insulator (60). The control electrode may substantially surround the anode. A small capacitance between the electrodes allows high switching speeds. Plural control electrodes may be formed. A fabrication process (S1-S18) uses two sacrificial materials (150 and 160), one of which forms a temporary mandrel, and uses a conformal conductive layer to form each control electrode with small, precise dimensions and alignment.
Abstract:
A device useful as a display element has an electron emitter and an anode disposed to receive electrons emitted from the emitter. The anode has surface portions differing in resistivity, providing an electron sink portion at the surface portion of lowest resistivity. A preferred embodiment has a lateral field-emission electron emitter and has an anode formed by processes specially adapted to provide anode portions of differing resistivity, including the electron sink portion. The electron sink portion is preferably disposed at a position laterally spaced apart from the emitting tip of the device's electron emitter. In a particularly preferred fabrication process, the anode is formed by depositing a base layer, depositing and patterning an etch-stop layer with an opening to define the electron-sink portion, forming an opening by etching overlying layers down to the etch-stop layer, and heating the base layer and etch-stop layer to form an anode surface that includes both an integral electron-sink portion and a cathodoluminescent phosphor for emitting light. The fabrication process provides for fabricating a plurality of display element devices to make a flat panel display.
Abstract:
A lateral-emitter electron field-emission display device structure (10) incorporates a thin-film emitter (100) having an emitting edge (110) in direct contact with a non-conducting or very high resistivity phosphor (75), thereby eliminating a gap between the emitter and the phosphor. Such a gap has been a part of all field-emission display devices in the prior art. The ultra-thin-film lateral emitter (100) of the structure is deposited in a plane parallel to the device's substrate (20) and has an inherently small radius of curvature at its emitting edge, which may extend into phosphor (75). A fabrication process specially adapted to make the structure includes a directional trench etch (S15), which both defines the emitting edge and provides an opening (160) to receive a non-conducting phosphor (75). This phosphor covers an anode (70) and is automatically aligned in contact with the emitter edge (110). When an electrical bias voltage is applied between the emitter and anode, electrons are injected directly into the phosphor material from the emitter edge, exciting cathodoluminescence in the phosphor to emit light which is visible in a wide range of viewing angles. With minor variations in the fabrication process, a lateral-emitter electron field emission display device may be made with an extremely small emitter-phosphor gap, having a width less than 100 times the thickness of the ultra-thin emitter (100) or preferably zero gap width. Triode or tetrode embodiments include control electrodes (140).
Abstract:
A lateral-emitter field-emission device includes a thin-film emitter cathode (50) of thickness less than several hundred angstrom and has an edge or tip (110) with small radius of curvature. In the display cell structure, a cathodoluminescent phosphor anode (60), allowing a large portion of the phosphor anode's top surface to emit light in a desired direction. An anode contact layer contacts the phosphor anode (60) from below to form a buried anode contact (90) which does not interfere with light emission. The anode phosphor is precisely spaced apart form the cathode edge or tip and receives electrons emitted by the field emission from the edge or tip of the lateral-emitter cathode, when a small bias voltage is applied. The device may be configured as diode, triode, or tetrode, etc. having one or more control electrodes (140) and/or (170) positioned to allow control of current from the emitter to the phosphor anode by an electrical signal applied to the control electrode.
Abstract:
A lateral-emitter electron field emission device (10) includes a thin-film laminar composite emitter structure (50) including two or more films (70, 80, 90) composed of materials having different etch rates. The simplest emitter consists of two ultra-thin layers (70 and 80 or 90) etched differentially so that a salient remaining portion of the more etch-resistant layer (70) protrudes beyond the less etch-resistant layer (80 or 90) to form a small-radius tip (100). Preferably, the most etch-resistant layer (70) is N-doped diamond which has a nearly zero work function. The emitter structure may be a three-layer structure with upper and/or lower layers (80, 90) acting as a physical supporting and integral electrical conducting medium. In a preferred process for fabricating the device, the laminar composite emitter (50) is first patterned by a directional trench etch. During or after fabrication of the trench (140), the laminar composite emitter (50) is differentially etched as described above by chemical or electro-chemical etch, differential electropolishing, or differential ablation, leaving a protruding ultra-thin emitter tip (100).
Abstract:
A process for fabricating, in a planar substrate, a hermetically sealed chamber for a field-emission cell or the like, allows operating the device in a vacuum or a low pressure inert gas. The process includes methods of covering an opening (160), enclosing the vacuum or gas, and methods of including an optional quantity of gettering material. An example of a device using such a hermetically sealed chamber is a lateral-emitter field-emission device (10) having a lateral emitter (100) parallel to a substrate (20) and having a simplified anode structure (70). In one simple embodiment, a control electrode (140) is positioned in a plane above the emitter edge (110) and automatically aligned to that edge. The simplified devices are specially adapted for field emission display arrays. An overall fabrication process uses steps (S1-S18) to produce the devices and arrays. Various embodiments of the fabrication process allow the use of conductive or insulating substrates (20), allow fabrication of devices having various functions and complexity, and allow covering a trench opening (160) etched through the emitter and insulator, thus enclosing the hermetically sealed chamber.
Abstract:
An ultra-high-frequency vacuum-channel field-effect microelectronic device (VFED or IGVFED) has a lateral field-emission source (60), a drain (150), and one or more insulated gates (40, 160). The insulated gate(s) are preferably disposed to extend in overlapping alignment with the emitting edge (85) of the lateral field-emission source and with a portion of the vacuum-channel region (120). If the gate(s) are omitted, the device performs as an ultra-high speed diode. A preferred fabrication process for the device uses a sacrificial material temporarily deposited in a trench for the vacuum-channel region which is covered with an insulating cover. An access hole in the cover allows removal of the sacrificial material. As part of a preferred fabrication process, the drain preferably acts also as a sealing plug, plugging the access hole and sealing the vacuum-channel region after the vacuum-channel region is evacuated.