Abstract:
Embodiments including systems, methods, and apparatuses associated with reordering data retrieved from a dynamic random access memory (DRAM). A memory controller may be configured to receive an instruction from a central processing unit (CPU) and, based on the instruction, retrieve a sequential data from a DRAM. The memory controller may then be configured to reorder the sequential data and place the reordered data in one or more locations of a vector register file.
Abstract:
A refresh voltage control engine selectively applies different high voltages to use in refresh operations. The control engine can detect that a portion of a memory device needs to be refreshed, and determine that the refresh cycle time is too short for a state of the portion of the memory device. The memory device typically has an associated refresh cycle time or time between refreshes based on the device and system architecture. The control engine can generate one or more control signals to cause the system to apply an overcharge refresh to overcharge the portion of the memory device with a refresh operation to extend the refresh cycle time for the portion of the memory device.
Abstract:
A wheel bearing arrangement with first rolling elements, which are capable of rolling on a first inner ring, wherein the rolling elements are guided by a first roller bearing cage, and an axial spacer element is provided for spacing apart the first inner ring from a bearing element, wherein the bearing element can in particular be a second inner ring. The intention is to facilitate the complex installation of the individual parts in wheel bearings for utility vehicles. The first rolling element cage forms, together with the axial spacer element, an axial form-fitting connection. The spacer element can be fixed to at least one of the inner rings via the form-fitting connection to the cage prior to tightening the wheel hub, together with the wheel bearing preinstalled thereon.
Abstract:
Disclosed embodiments may include an apparatus having a segment wordline enable coupled to logic to selectively disable ones of a number of segment wordline drivers. The logic may partition a page of the apparatus to reduce power consumed through activation of the disabled ones of the number of segment wordlines. Other embodiments may be disclosed.
Abstract:
Resonant clocking for three-dimensional stacked devices. An embodiment of an apparatus includes a stack including integrated circuit dies; and through silicon vias through at least one of the dies, wherein at least a first through silicon via of the through silicon vias includes a capacitive structure or an inductive structure, the first through silicon via being formed in a first die of the plurality of dies. The apparatus includes a resonant circuit, the first through silicon via used as a first circuit element of the resonant circuit.
Abstract:
A mechanism is described for facilitating write tracking for following data eye movements across changing thermal conditions in memory systems according to one embodiment of the invention. A method of embodiments of the invention includes monitoring movements of a valid data eye associated with a memory device of a plurality of memory devices of a memory system at a computing system. The monitoring may include initiating write commands during one or more refresh periods associated with the valid data eye. The method may include determining drifting in the movement of the data eye, and correcting the drifting based on adjusting one or more existing phase interpolator values associated with the movements of the data eye.
Abstract:
A voltage regulator for one or more dies in a multi-stack integrated circuit includes an inductor located on a die, a voltage controller that is electrically coupled to the inductor and is also located on the die, and a capacitor that is electrically coupled to the inductor and the voltage controller and is also located on the die. The inductor defines an interior space and the voltage controller and the capacitor are located within the interior space of the inductor. The inductor can be a lateral inductor or a through layer via inductor. The multi-stack integrated circuit may have multiple dies. A voltage controller may be electrically coupled to each of the dies, although it may be located on only one of the dies. Alternatively, separate voltage controllers may be electrically coupled to each of the multiple dies and may be located on each of the respective dies.
Abstract:
Dynamic operations for operations for a stacked memory with interface providing offset interconnects. An embodiment of memory device includes a system element and a memory stack coupled with the system element, the memory stack including one or more memory die layers. Each memory die layer includes first face and a second face, the second face of each memory die layer including an interface for coupling data interface pins of the memory die layer with data interface pins of a first face of a coupled element. The interface of each memory die layer includes connections that provide an offset between each of the data interface pins of the memory die layer and a corresponding data interface pin of the data interface pins of the coupled element.
Abstract:
A system monitors and dynamically changes memory mapping in a runtime of a computing system. The computing system has various memory resources, and multiple possible mappings that indicate how data is to be stored in and subsequently accessed from the memory resources. The performance of each memory mapping may be different under different runtime or load conditions of the computing device. A memory controller can monitor runtime performance of the current memory mapping and dynamically change memory mappings at runtime based on monitored or observed performance of the memory mappings. The performance monitoring can be modified for any of a number of different granularities possible within the system, from the byte level to memory channel.