公开(公告)号：US4064356A

公开(公告)日：1977-12-20

申请号：US666096

申请日：1976-03-11

Applicant: Norman O. Marler, Jr. ,  Benjamin M. Mikulis, Jr.

Inventor： Norman O. Marler, Jr. ,  Benjamin M. Mikulis, Jr.

IPC: H01L23/495 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K1/00

CPC classification number: H05K3/3426 ,  H01L23/49555 ,  H01L24/01 ,  H05K3/363 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/10681 ,  H05K2201/10772 ,  H05K3/4092 ,  Y02P70/613

Abstract: A soldered joint between a thin flat conductive lead and a flat conductive pad in which the lead is "rippled," that is, formed with undulations each of which engages the surface of the pad so that during soldering, the molten solder fills the spaces between the pad and the lead and then solidifies forming the soldered joint.

Abstract translation: 在薄平面导电引线和平坦导电焊盘之间的焊接接头，其中引线“波纹化”，即形成有波纹，每个引脚接合焊盘的表面，使得在焊接期间，熔融焊料填充 焊盘和引线，然后固化形成焊接接头。