Abstract:
Provided is a thermoplastic resin molded article excellent in bending strength, flexural modulus and Charpy impact strength, on which the plated layer may be formed in a successful manner. The thermoplastic resin composition for laser direct structuring comprising, per 100 parts by weight of the thermoplastic resin, 10 to 150 parts by weight of an inorganic fiber and 1 to 30 parts by weight of a laser direct structuring additive, the laser direct structuring additive containing at least one of copper, antimony and tin, and having a Mohs hardness 1.5 or more smaller than the Mohs hardness of the inorganic fiber.
Abstract:
The present invention relates to a polymer composition comprising the following components: a) 76.6-99.49 mass % of aromatic polycarbonate, b) 0.5-20 mass % of laser direct structuring additive, c) 0-2.4 mass % of rubber like polymer, and d) 0.01-1 mass % of acid and/or acid salt wherein the mass % is calculated relative to the sum of a), b), c) and d). The invention also relates to a moulded part containing this composition, to a circuit carrier containing such moulded part and to a process for producing such circuit carrier.
Abstract:
A composition comprises a polyester-polycarbonate polymer comprising isophthalate-terephthalate-resorcinol ester units and carbonate units, a first polyester comprising repeating units derived from cyclohexane dicarboxylic acid or a chemical equivalent thereof, and a C2-8 aliphatic diol or a chemical equivalent thereof, and a second polyester comprising units derived from isophthalic and/or terephthalic acid and a chemical equivalent thereof, and a C2-8 aliphatic diol or a chemical equivalent thereof. The composition can be extruded into pellets that are clear and colorless. The composition can further be molded into articles having a percent haze value less than or equal to 10 percent, and total luminous transmittance value of greater than or equal to 70 percent, measured in accordance with ASTM D1003-00. Also disclosed is a method for forming the compositions, and articles prepared therefrom.
Abstract:
Provided is a thermoplastic resin molded article excellent in bending strength, flexural modulus and Charpy impact strength, on which the plated layer may be formed in a successful manner. The thermoplastic resin composition for laser direct structuring comprising, per 100 parts by weight of the thermoplastic resin, 10 to 150 parts by weight of an inorganic fiber and 1 to 30 parts by weight of a laser direct structuring additive, the laser direct structuring additive containing at least one of copper, antimony and tin, and having a Mohs hardness 1.5 or more smaller than the Mohs hardness of the inorganic fiber.
Abstract:
A process for producing a circuit carrier, including providing a moulded part containing a thermoplastic composition including a) a thermoplastic resin and b) a laser direct structuring additive in an amount of at least 1 wt % with respect to the weight of the total composition, the laser direct structuring additive containing tin or copper comprising antimony-doped tin oxide and having a CIELab colour value L* of at least 45 and irradiating areas of the part on which conductive tracks are to be formed with laser radiation, and subsequently metalizing the irradiated areas.
Abstract:
An optically clear thermoplastic resin composition consisting essentially of: structural units derived at least one substituted or unsubstituted polycarbonate, at least greater than 30 weight percent of a substituted or unsubstituted polyester, a modified polycarbonate, an impact modifier having a refractive index in the range between about 1.51 and about 1.56 and an additive is disclosed. The composition possess good optical properties, flow, stability and mechanical property. Also disclosed is a process to prepare these compositions and articles therefrom.
Abstract:
A composition comprises a polyester-polycarbonate polymer comprising isophthalate-terephthalate-resorcinol ester units and carbonate units, a first polyester comprising repeating units derived from cyclohexane dicarboxylic acid or a chemical equivalent thereof, and a C2-8 aliphatic diol or a chemical equivalent thereof, and a second polyester comprising units derived from isophthalic and/or terephthalic acid and a chemical equivalent thereof, and a C2-8 aliphatic diol or a chemical equivalent thereof. The composition can be extruded into pellets that are clear and colorless. The composition can further be molded into articles having a percent haze value less than or equal to 10 percent, and total luminous transmittance value of greater than or equal to 70 percent, measured in accordance with ASTM D1003-00. Also disclosed is a method for forming the compositions, and articles prepared therefrom.
Abstract:
Specific thermoplastic compositions containing a polyester or a blend of polyester and polycarbonate, an impact modifier and a block copolyestercarbonate are provided that remain ductile at or below freezing exhibiting an impact energy at or below 0° C. of greater than 25 kjoules/m2.
Abstract:
A composition comprises a polyester-polycarbonate polymer comprising isophthalate-terephthalate-resorcinol ester units and carbonate units, a first polyester selected from poly(ethylene terephthalate), poly(ethylene isophthalate), or a combination thereof, and a second polyester comprising butylene terephthalate units, cyclohexanedimethylene terephthalate units, or a combination of cyclohexanedimethylene terephthalate units and ethylene terephthalate units. The composition can be extruded into pellets that are clear and colorless. The composition can further be molded into articles having a percent haze value less than or equal to 10 percent, and total luminous transmittance value of greater than or equal to 70 percent, measured in accordance with ASTM D1003-00. Also disclosed is a method for forming the compositions, and articles prepared therefrom.
Abstract:
The present invention relates to a polymer composition comprising the following components: a) 76.6-99.49 mass % of aromatic polycarbonate, b) 0.5-20 mass % of laser direct structuring additive, c) 0-2.4 mass % of rubber like polymer, and d) 0.01-1 mass % of acid and/or acid salt wherein the mass % is calculated relative to the sum of a), b), c) and d). The invention also relates to a moulded part containing this composition, to a circuit carrier containing such moulded part and to a process for producing such circuit carrier.