Abstract:
A method and device for determining whether an animal is infected with West Nile Virus (WN-V), or is either not infected or vaccinated with a WNV vaccine. The method includes contacting a biological sample from the subject with a first WNV polypeptide that is not an element of the WNV vaccine, and detecting whether antibodies in the sample bind to the WNV polypeptide. If the antibodies in the sample bind to the WNV polypeptide, it can be determined that the animal is naturally infected with WNV and if the antibodies do not bind to the polypeptide, it can be determined that the animal is either vaccinated or not infected.
Abstract:
A method and device for detecting a West Nile Virus (WNV) infection including contacting a biological sample from a subject with an anti-IgM antibody and a recombinant WNV E polypeptide and detecting whether the polypeptide substantially binds to an antibody in the sample. The invention also includes a method and device for determining whether an animal is infected with West Nile Virus (WNV), or is either not infected or is vaccinated with a WNV vaccine.
Abstract:
A method and device for determining whether an animal is infected with West Nile Virus (WN-V), or is either not infected or vaccinated with a WNV vaccine. The method includes contacting a biological sample from the subject with a first WNV polypeptide that is not an element of the WNV vaccine, and detecting whether antibodies in the sample bind to the WNV polypeptide. If the antibodies in the sample bind to the WNV polypeptide, it can be determined that the animal is naturally infected with WNV and if the antibodies do not bind to the polypeptide, it can be determined that the animal is either vaccinated or not infected.
Abstract:
An assembly of substrate packages interconnected with flex cables and a method of fabrication of the substrate package. The assembly allows input/output (I/O) signals to be speedily transmitted between substrate packages via flex cable and without being routed through the motherboard. Embodiments relate to a substrate package providing separable inter-package flex cable connection. Hermetically-sealed guiding through holes are provided on the substrate package as a mechanical alignment feature to guide connection between flex cables and high speed I/O contact pads on the substrate package. Embodiments of the method of fabrication relate to simultaneously forming hermetically-sealed guiding through holes and I/O contact pads.
Abstract:
An assembly of substrate packages interconnected with flex cables and a method of fabrication of the substrate package. The assembly allows input/output (I/O) signals to be speedily transmitted between substrate packages via flex cable and without being routed through the motherboard. Embodiments relate to a substrate package providing separable inter-package flex cable connection. Hermetically-sealed guiding through holes are provided on the substrate package as a mechanical alignment feature to guide connection between flex cables and high speed I/O contact pads on the substrate package. Embodiments of the method of fabrication relate to simultaneously forming hermetically-sealed guiding through holes and I/O contact pads.