公开(公告)号：US07768131B1

公开(公告)日：2010-08-03

申请号：US12493171

申请日：2009-06-27

Applicant: Jun-Chung Hsu ,  Chen-Lin Li

Inventor： Jun-Chung Hsu ,  Chen-Lin Li

IPC: H01L23/48

CPC classification number: H05K3/341 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/10175 ,  H01L2224/16 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01078 ,  H05K3/3436 ,  H05K2201/0373 ,  H05K2201/09745 ,  H05K2201/099 ,  Y02P70/613 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A package structure preventing solder overflow on substrate solder pads includes a plurality of die pins, a plurality of solders and a plurality of substrate solder pads. The die pins are located under a die. The substrate solder pads are formed on an upper surface of a substrate by copper plating or etching. Each of the substrate solder pads has at least one solder pad connection point. The solders connect the die pins with the corresponding solder pad connection points, respectively. Each of the solder pad connection points has a pair of solder pad ridges or a pair of solder pad grooves. The solder pad ridges and the solder pad grooves filled with the solder or a resin can prevent the solder overflow problem.

Abstract translation: 防止衬底焊盘上的焊料溢出的封装结构包括多个管芯引脚，多个焊料和多个衬底焊盘。 模具销位于模具下方。 通过镀铜或蚀刻在衬底的上表面上形成衬底焊盘。 每个衬底焊盘具有至少一个焊盘连接点。 焊料将管芯引脚分别与相应的焊盘连接点相连。 每个焊盘连接点具有一对焊盘凸脊或一对焊盘凹槽。 焊料焊盘脊和填充有焊料或树脂的焊盘凹槽可以防止焊料溢出问题。