GAS-LIQUID PHASE TRANSITION METHOD AND APPARATUS FOR CLEANING OF SURFACES IN SEMICONDUCTOR MANUFACTURING
    4.
    发明申请
    GAS-LIQUID PHASE TRANSITION METHOD AND APPARATUS FOR CLEANING OF SURFACES IN SEMICONDUCTOR MANUFACTURING 审中-公开
    气相液相转移方法及其在半导体制造过程中清洗表面的方法

    公开(公告)号:WO2012024131A2

    公开(公告)日:2012-02-23

    申请号:PCT/US2011047299

    申请日:2011-08-10

    Abstract: A method (500) for cleaning an article such as a EUV (extreme ultraviolet) lithography reticle is provided. The method includes evacuating a cleaning chamber and loading the article to be cleaned into the cleaning chamber (510); preparing the environment of the chamber (520) by connecting the cleaning chamber to a vapor source while controlling pressure in the cleaning chamber to a predetermined pressure; controlling a temperature of the article relative to a temperature of the vapor source so as to form a liquid film (530) over the article and over particles present on the article; isolating the cleaning chamber from the vapor source; evaporating the liquid film (540) by exposing the cleaning chamber to one or more condensing surfaces whose temperature is lower than that of the article, the evaporating liquid transporting at least a portion of the particles away from the article, which is then unloaded from the chamber (560). The cleaning steps (520) to (540) can be repeated (550) as desired. An electrostatic trap may be provided to capture particles released by the evaporation. The cleaning technique can be used in a lithographic apparatus and in manufacturing a device having critical surfaces, such as a wafer, a semiconductor film, or surface of an apparatus employed in the manufacture of a semiconductor device.

    Abstract translation: 提供了用于清洁诸如EUV(极紫外)光刻掩模版的物品的方法(500)。 该方法包括抽空清洁室并将待清洁的物品装载到清洁室(510)中; 通过在将清洁室中的压力控制到预定压力的同时将清洁室连接到蒸气源来准备室(520)的环境; 控制所述物品相对于所述蒸气源的温度的温度,以便在所述物品上形成液体膜(530)并且在所述物品上存在上述颗粒; 将清洁室与蒸气源隔离; 通过将清洁室暴露于温度低于物品的一个或多个冷凝表面来蒸发液体膜(540),蒸发液体将至少一部分颗粒运送到物品上,然后将其从 室(560)。 清洗步骤(520)至(540)可根据需要重复(550)。 可以提供静电捕获器来捕获通过蒸发释放的颗粒。 清洁技术可以用于光刻设备中,并且可用于制造具有临界表面的器件,例如晶片,半导体膜或用于制造半导体器件的器件的表面。

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