Abstract:
A lithographic apparatus comprises: an illumination system; a support structure; a substrate table; a projection system and a heating system. The illumination system is configured to condition a radiation beam. The support structure is constructed to support a reticle and pellicle assembly for receipt of the radiation beam conditioned by the illumination system. The substrate table is constructed to support a substrate. The projection system is configured to receive the radiation beam from the reticle - pellicle assembly and to project it onto the substrate. The heating system is operable to heat a pellicle of the reticle - pellicle assembly supported by the support structure. A method for using a reticle - pellicle assembly comprises: illuminating the reticle - pellicle assembly with a radiation beam so as to form a patterned image on a substrate; and heating the pellicle of the reticle - pellicle assembly using a separate heat source.
Abstract:
An apparatus for measuring a parameter of a structure related to a semiconductor manufacturing process. The apparatus comprises a source assembly configured to provide measurement radiation having one or more first wavelengths for irradiating the structure on a substrate. The apparatus further comprises a filter arranged to receive scattered measurement radiation that has scattered from the structure, wherein the filter is configured to transmit the scattered measurement radiation at the one or more first wavelengths and filter out radiation at one or more second wavelengths. The filter comprises a film with a curvature in at least one direction. The apparatus further comprises a plurality of detectors, located downstream of the filter, configured to detect the filtered scattered radiation configured to measure the parameter of the structure.
Abstract:
A method (500) for cleaning an article such as a EUV (extreme ultraviolet) lithography reticle is provided. The method includes evacuating a cleaning chamber and loading the article to be cleaned into the cleaning chamber (510); preparing the environment of the chamber (520) by connecting the cleaning chamber to a vapor source while controlling pressure in the cleaning chamber to a predetermined pressure; controlling a temperature of the article relative to a temperature of the vapor source so as to form a liquid film (530) over the article and over particles present on the article; isolating the cleaning chamber from the vapor source; evaporating the liquid film (540) by exposing the cleaning chamber to one or more condensing surfaces whose temperature is lower than that of the article, the evaporating liquid transporting at least a portion of the particles away from the article, which is then unloaded from the chamber (560). The cleaning steps (520 to 540) can be repeated (550) as desired.
Abstract:
A method (500) for cleaning an article such as a EUV (extreme ultraviolet) lithography reticle is provided. The method includes evacuating a cleaning chamber and loading the article to be cleaned into the cleaning chamber (510); preparing the environment of the chamber (520) by connecting the cleaning chamber to a vapor source while controlling pressure in the cleaning chamber to a predetermined pressure; controlling a temperature of the article relative to a temperature of the vapor source so as to form a liquid film (530) over the article and over particles present on the article; isolating the cleaning chamber from the vapor source; evaporating the liquid film (540) by exposing the cleaning chamber to one or more condensing surfaces whose temperature is lower than that of the article, the evaporating liquid transporting at least a portion of the particles away from the article, which is then unloaded from the chamber (560). The cleaning steps (520) to (540) can be repeated (550) as desired. An electrostatic trap may be provided to capture particles released by the evaporation. The cleaning technique can be used in a lithographic apparatus and in manufacturing a device having critical surfaces, such as a wafer, a semiconductor film, or surface of an apparatus employed in the manufacture of a semiconductor device.