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    LEADED MULTI-LAYER CERAMIC CAPACITOR WITH LOW ESL AND LOW ESR
    1.
    发明申请
    LEADED MULTI-LAYER CERAMIC CAPACITOR WITH LOW ESL AND LOW ESR 审中-公开
    领先的多层陶瓷电容器，具有低ESL和低ESR

    公开(公告)号：WO2010111575A3

    公开(公告)日：2011-01-13

    申请号：PCT/US2010028800

    申请日：2010-03-26

    Applicant: KEMET ELECTRONICS CORP ,  MCCONNELL JOHN E ,  PHILLIPS REGGIE ,  WEBSTER ALAN P ,  BULTITUDE JOHN ,  LAPS MARK R ,  JONES LONNIE G ,  RENNER GARRY

    Inventor： MCCONNELL JOHN E ,  PHILLIPS REGGIE ,  WEBSTER ALAN P ,  BULTITUDE JOHN ,  LAPS MARK R ,  JONES LONNIE G ,  RENNER GARRY

    IPC: H01G4/12 ,  H01G4/005

    CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/232 ,  H05K3/3426

    Abstract: A multi-layered ceramic capacitor with at least one chip and with first base metal plates in a parallel spaced apart relationship and second base metal plates in a parallel spaced apart relationship wherein the first plates and second plates are interleaved. A dielectric is between the first base metal plates and said second base metal plates and the dielectric has a first coefficient of thermal expansion. A first termination is in electrical contact with the first plates and a second termination is in electrical contact with the second plates. Lead frames are attached to, and in electrical contact with, the terminations wherein the lead frames have a second coefficient of thermal expansion and the second coefficient of thermal expansion is higher than said first coefficient of thermal expansion. The lead frame is a non-ferrous material.

    Abstract translation: 一种多层陶瓷电容器，其具有至少一个芯片，并且具有平行隔开的关系的第一基底金属板和平行隔开的关系的第二基底金属板，其中第一板和第二板被交错。 电介质位于第一基底金属板和第二基底金属板之间，电介质具有第一热膨胀系数。 第一端接件与第一板电接触，第二端接件与第二板电接触。 引线框架连接到端子处并与其接触，其中引线框架具有第二热膨胀系数，并且第二热膨胀系数高于所述第一热膨胀系数。 引线框架是有色金属材料。

    VEHICLE UNIVERSAL DOCKING STATION AND ELECTRONIC FEATURE MODULES
    2.
    发明申请
    VEHICLE UNIVERSAL DOCKING STATION AND ELECTRONIC FEATURE MODULES 审中-公开
    车辆通用对接站和电子特征模块

    公开(公告)号：WO0232722A3

    公开(公告)日：2002-08-01

    申请号：PCT/US0132280

    申请日：2001-10-15

    Applicant: LEAR CORP ,  MCCONNELL JOHN E ,  MAASS MICHAEL N ,  JAROCHA WILLIAM M ,  KYRTSOS CHRISTOS T ,  SLEBODA PAWEL W

    Inventor： MCCONNELL JOHN E ,  MAASS MICHAEL N ,  JAROCHA WILLIAM M ,  KYRTSOS CHRISTOS T ,  SLEBODA PAWEL W

    IPC: B60R11/00 ,  B60R11/02 ,  B60R16/02 ,  B60R25/00

    CPC classification number: B60R11/02 ,  B60R2011/0003 ,  B60R2011/0028 ,  B60R2011/0036 ,  B60R2011/0045 ,  B60R2011/0073 ,  B60R2011/0288 ,  B60R2011/0294

    Abstract: A smart, universal vehicle docking station (10) is provided for receiving one or more plug-in- feature modules (17). The docking station includes a personality module arranged to receive the feature modules. The feature modules are of uniform dimensions and include a standardized docking station coupler. Some of the feature modules can be operated separately from the docking station, and are completely interchangeable within the docking station. The personality module is removable so that an entire personality module can be removed from a vehicle for security reasons, as well as to transplanted from one vehicle to another to provide immediate vehicle customization. A gateweay located in the docking station allows integration and appropriate signal translation of signals between the modules and a vehicle irrespective of make or model of the vehicle. The present invention allows different features to be easily added or upgraded in a vehicle.

    Abstract translation: 提供智能的通用车辆对接站（10）用于接收一个或多个插入式特征模块（17）。 对接站包括布置成接收特征模块的个性模块。 特征模块具有统一的尺寸，并包括一个标准化的对接站耦合器。 某些功能模块可以与扩展坞分开操作，并且可以在扩展坞内完全互换。 个性化模块是可拆卸的，因此出于安全原因可将整个个性化模块从车辆上移除，以及从一个车辆移植到另一个车辆以提供即时的车辆定制。 位于扩展坞中的gateweay允许模块和车辆之间的信号的整合和适当的信号转换，而不管车辆的品牌或型号如何。 本发明允许在车辆中容易地添加或升级不同的特征。

    LEADED MULTI-LAYER CERAMIC CAPACITOR WITH LOW ESL AND LOW ESR
    5.
    发明申请
    LEADED MULTI-LAYER CERAMIC CAPACITOR WITH LOW ESL AND LOW ESR 审中-公开
    领先的多层陶瓷电容器，具有低ESL和低ESR

    公开(公告)号：WO2010111575A2

    公开(公告)日：2010-09-30

    申请号：PCT/US2010/028800

    申请日：2010-03-26

    Applicant: KEMET ELECTRONICS CORPORATION ,  MCCONNELL, John E. ,  PHILLIPS, Reggie ,  WEBSTER, Alan P. ,  BULTITUDE, John ,  LAPS, Mark R. ,  JONES, Lonnie G. ,  RENNER, Garry

    Inventor： MCCONNELL, John E. ,  PHILLIPS, Reggie ,  WEBSTER, Alan P. ,  BULTITUDE, John ,  LAPS, Mark R. ,  JONES, Lonnie G. ,  RENNER, Garry

    IPC: H01G4/12 ,  H01G4/005

    CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/232 ,  H05K3/3426

    Abstract: A multi-layered ceramic capacitor with at least one chip and with first base metal plates in a parallel spaced apart relationship and second base metal plates in a parallel spaced apart relationship wherein the first plates and second plates are interleaved. A dielectric is between the first base metal plates and said second base metal plates and the dielectric has a first coefficient of thermal expansion. A first termination is in electrical contact with the first plates and a second termination is in electrical contact with the second plates. Lead frames are attached to, and in electrical contact with, the terminations wherein the lead frames have a second coefficient of thermal expansion and the second coefficient of thermal expansion is higher than said first coefficient of thermal expansion. The lead frame is a non-ferrous material.

    Abstract translation: 一种多层陶瓷电容器，其具有至少一个芯片，并且具有平行隔开的关系的第一基底金属板和平行隔开的关系的第二基底金属板，其中第一板和第二板被交错。 电介质位于第一基底金属板和第二基底金属板之间，电介质具有第一热膨胀系数。 第一端接件与第一板电接触，第二端接件与第二板电接触。 引线框架连接到端子处并与其接触，其中引线框架具有第二热膨胀系数，并且第二热膨胀系数高于所述第一热膨胀系数。 引线框架是有色金属材料。

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