公开(公告)号：WO2011150246A3

公开(公告)日：2012-02-23

申请号：PCT/US2011038197

申请日：2011-05-26

Applicant: KEMET ELECTRONICS CORP ,  MCCONNELL JAMES E ,  BULTITUDE JOHN ,  PHILLIPS REGGIE ,  HILL ALLEN ,  RENNER GARRY L ,  LESSNER PHILIP M ,  CHACKO ANTONY P ,  BELL JEFFREY ,  BROWN KEITH

Inventor： MCCONNELL JAMES E ,  BULTITUDE JOHN ,  PHILLIPS REGGIE ,  HILL ALLEN ,  RENNER GARRY L ,  LESSNER PHILIP M ,  CHACKO ANTONY P ,  BELL JEFFREY ,  BROWN KEITH

IPC: H01G4/12 ,  B23K31/02 ,  H01G4/30

CPC classification number: H01G4/2325 ,  B23K1/0016 ,  B23K1/0053 ,  B23K1/008 ,  B23K1/203 ,  B23K35/0227 ,  B23K35/3613 ,  B23K2201/42 ,  H01G4/005 ,  H01G4/30 ,  H01L2224/83825 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/1461 ,  Y10T29/435 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2924/00

Abstract: A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes and at least one of the external terminations comprises a material selected from a polymer solder and a transient liquid phase sintering adhesive.

Abstract translation: 电容器具有与第一外部端子电接触的第一平面内部电极。 第二平面内部电极与第一平面内部电极交错，其中第二平面内部电极与第二外部端子电接触。 电介质在第一平面内部电极和第二平面内部电极之间，并且至少一个外部端子包括选自聚合物焊料和瞬态液相烧结粘合剂的材料。

公开(公告)号：WO2008048338A3

公开(公告)日：2008-07-31

申请号：PCT/US2007001605

申请日：2007-01-22

Applicant: KEMET ELECTRONICS CORP ,  MELODY ANITA ,  CHACKO ANTONY P ,  CHEN QINGPING ,  HAHN RANDY S ,  KINARD JOHN T ,  LESSNER PHILIP M

Inventor： CHACKO ANTONY P ,  CHEN QINGPING ,  HAHN RANDY S ,  KINARD JOHN T ,  LESSNER PHILIP M ,  MELODY BRIAN J

IPC: H01G9/012 ,  H01G9/008 ,  H01G9/042

CPC classification number: H01G9/012 ,  H01G9/028 ,  H01G9/0425 ,  H01G9/08 ,  Y10T29/417 ,  Y10T29/435

Abstract: An improved capacitor with an anode (11) with an anode wire and an oxide layer (12) on the surface of the anode (11). A cathode layer is exterior to the oxide layer. A carbon conductive layer (14) is exterior to the cathode layer wherein the cathode layer comprises 5-75 wt% resin and 25-95 wt% conductor. The conductor has carbon nanotubes. An anode lead is in electrical contact with the anode wire and a cathode lead is in electrical contact with the carbon conductive layer (14).

Abstract translation: 一种具有阳极（11）的改进电容器，阳极（11）具有阳极导线和阳极（11）表面上的氧化物层（12）。 阴极层在氧化物层的外部。 碳导电层（14）在阴极层的外部，其中阴极层包含5-75重量％的树脂和25-95重量％的导体。 该导体具有碳纳米管。 阳极引线与阳极导线电接触并且阴极引线与碳导电层（14）电接触。

公开(公告)号：WO2007075714A3

公开(公告)日：2007-12-21

申请号：PCT/US2006048472

申请日：2006-12-19

Applicant: MOTOROLA INC ,  KEMET ELECTRONICS CORP ,  DUNN GREGORY J ,  CHELINI REMY J ,  CROSWELL ROBERT T ,  LESSNER PHILIP M ,  PREVALLET MICHAEL D ,  PRYMAK JOHN D

Inventor： DUNN GREGORY J ,  CHELINI REMY J ,  CROSWELL ROBERT T ,  LESSNER PHILIP M ,  PREVALLET MICHAEL D ,  PRYMAK JOHN D

IPC: H01G9/00

CPC classification number: H01G9/045 ,  H01G9/0032 ,  H01G9/055 ,  H01G9/15 ,  H05K1/162 ,  H05K3/383 ,  H05K3/429 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09718 ,  H05K2203/0315

Abstract: Embedded capacitors comprise a bimetal foil (500) that includes a first copper layer (205) and an aluminum layer (210) on the first copper layer. The aluminum layer has a smooth side adjacent the first copper layer and a high surface area textured side (215) opposite the first copper layer. The bimetal foil further includes an aluminum oxide layer (305) on the high surface area textured side of the aluminum layer, a conductive polymer layer (420) on the aluminum oxide layer, and a second copper layer (535) overlying the aluminum oxide layer. The bimetal foil may be embedded in a circuit board (700) to form high value embedded capacitors.

Abstract translation: 嵌入式电容器包括在第一铜层上包括第一铜层（205）和铝层（210）的双金属箔（500）。 铝层具有邻近第一铜层的平滑侧面和与第一铜层相对的高表面积纹理化侧面（215）。 双金属箔还包括在铝层的高表面积纹理化侧的氧化铝层（305），氧化铝层上的导电聚合物层（420）和覆盖氧化铝层的第二铜层（535） 。 双金属箔可以嵌入在电路板（700）中以形成高价值的嵌入式电容器。

公开(公告)号：WO2014039545A1

公开(公告)日：2014-03-13

申请号：PCT/US2013/058042

申请日：2013-09-04

Applicant: KEMET ELECTRONICS CORPORATION ,  HUSSEY, Steven, C. ,  FREEMAN, Yuri ,  LESSNER, Philip, M. ,  CHEN, Qingping ,  QAZI, Javaid

Inventor： HUSSEY, Steven, C. ,  FREEMAN, Yuri ,  LESSNER, Philip, M. ,  CHEN, Qingping ,  QAZI, Javaid

IPC: H01G9/15

CPC classification number: H01G13/00 ,  B23K2201/38 ,  H01G9/012 ,  H01G9/028 ,  H01G9/0425 ,  H01G9/06 ,  H01G9/08 ,  H01G9/15

Abstract: A process for providing an improved hermetically sealed capacitor which includes the steps of applying a solder and a flux to an interior surface of a case; flowing the solder onto the interior surface; remove flux thereby forming a flux depleted solder; inserting the capacitive element into the casing; reflowing the flux depleted solder thereby forming a solder joint between the case and the solderable layer; and sealing the case.

Abstract translation: 一种用于提供改进的密封电容器的方法，包括以下步骤：将焊料和助焊剂施加到壳体的内表面; 将焊料流到内表面上; 去除焊剂，从而形成焊剂耗尽的焊料; 将电容元件插入壳体中; 回流焊剂消耗的焊料，从而在外壳和可焊层之间形成焊接接头; 并密封外壳。

公开(公告)号：WO2012112680A3

公开(公告)日：2012-12-13

申请号：PCT/US2012025238

申请日：2012-02-15

Applicant: KEMET ELECTRONICS CORP ,  CHEN QINGPING ,  ZHANG HONG ,  CHACKO ANTONY P ,  LESSNER PHILIP M ,  HAHN RANDOLPH S ,  QIU YONGJIAN ,  BRENNEMAN KEITH R

Inventor： CHEN QINGPING ,  ZHANG HONG ,  CHACKO ANTONY P ,  LESSNER PHILIP M ,  HAHN RANDOLPH S ,  QIU YONGJIAN ,  BRENNEMAN KEITH R

IPC: H01G9/042 ,  H01G9/008

CPC classification number: H01G9/0032 ,  B05D1/185 ,  B82Y99/00 ,  H01G9/0036 ,  H01G9/028 ,  H01G9/0425 ,  H01G9/052 ,  H01G9/15 ,  Y10S977/948 ,  Y10T29/417 ,  Y10T29/43

Abstract: A process for preparing a solid electrolytic capacitor comprising application of a non-ionic polyol prior to application of a conducting polymer layer.

Abstract translation: 一种制备固体电解电容器的方法，包括在施加导电聚合物层之前施加非离子多元醇。

公开(公告)号：WO2012112676A2

公开(公告)日：2012-08-23

申请号：PCT/US2012/025231

申请日：2012-02-15

Applicant: KEMET ELECTRONICS CORPORATION ,  CHACKO, Antony, P. ,  CHEN, Qingping ,  JIN, Yang ,  LESSNER, Philip, M. ,  HAHN, Randolph, S. ,  QIU, Yongjian ,  BRENNEMAN, Keith, R.

Inventor： CHACKO, Antony, P. ,  CHEN, Qingping ,  JIN, Yang ,  LESSNER, Philip, M. ,  HAHN, Randolph, S. ,  QIU, Yongjian ,  BRENNEMAN, Keith, R.

IPC: H01G9/042 ,  H01G9/008

CPC classification number: H01G9/0032 ,  B05D1/185 ,  B82Y99/00 ,  H01G9/0036 ,  H01G9/028 ,  H01G9/0425 ,  H01G9/052 ,  H01G9/15 ,  Y10S977/948 ,  Y10T29/417 ,  Y10T29/43

Abstract: A process for preparing a solid electrolytic capacitor comprising application of coverage enhancing catalyst followed by application of a conducting polymer layer. Coverage enhancing catalyst is removed after coating and curing.

Abstract translation: 制备固体电解电容器的方法，其包括施加覆盖增强催化剂，然后施加导电聚合物层。 覆盖增强催化剂在涂布和固化后被除去。

公开(公告)号：WO2009140274A3

公开(公告)日：2009-11-19

申请号：PCT/US2009/043623

申请日：2009-05-12

Applicant: KEMET ELECTRONICS CORPORATION ,  FREEMAN, Yuri ,  LESSNER, Philip, M. ,  POLTORAK, Jeffrey ,  HUSSEY, Steven, C.

Inventor： FREEMAN, Yuri ,  LESSNER, Philip, M. ,  POLTORAK, Jeffrey ,  HUSSEY, Steven, C.

IPC: H01G4/005 ,  H01G4/228

Abstract: A method for treating anodes of refractory valve metals by deoxidizing the anodes using Mg in an oven, prior to sintering. The process limits free oxygen in the metal compact and improves performance of a capacitor, especially with regards to rated voltage.

公开(公告)号：WO2009140274A2

公开(公告)日：2009-11-19

申请号：PCT/US2009043623

申请日：2009-05-12

Applicant: KEMET ELECTRONICS CORP ,  FREEMAN YURI ,  LESSNER PHILIP M ,  POLTORAK JEFFREY ,  HUSSEY STEVEN C

Inventor： FREEMAN YURI ,  LESSNER PHILIP M ,  POLTORAK JEFFREY ,  HUSSEY STEVEN C

IPC: H01G4/005 ,  H01G4/228

CPC classification number: H01G9/052 ,  B22F7/08 ,  B22F2999/00 ,  H01G9/15 ,  Y10T29/417 ,  B22F3/10 ,  B22F2201/40 ,  B22F2207/17

Abstract: A method for treating anodes of refractory valve metals by deoxidizing the anodes using Mg in an oven, prior to sintering. The process limits free oxygen in the metal compact and improves performance of a capacitor, especially with regards to rated voltage.

Abstract translation: 在烧结之前，通过烘箱中的Mg使阳极脱氧来处理耐火阀金属的阳极的方法。 该工艺限制了金属结构中的游离氧，并改善了电容器的性能，特别是在额定电压方面。

公开(公告)号：WO2009079026A3

公开(公告)日：2009-11-05

申请号：PCT/US2008063830

申请日：2008-05-16

Applicant: KEMET ELECTRONICS CORP ,  CHEN QINGPING ,  BRENNEMAN KEITH R ,  MA YUHONG ,  QIU YONGJIAN ,  LESSNER PHILIP M ,  HAHN RANDY S

Inventor： CHEN QINGPING ,  BRENNEMAN KEITH R ,  MA YUHONG ,  QIU YONGJIAN ,  LESSNER PHILIP M ,  HAHN RANDY S

IPC: H01B1/12

CPC classification number: H01G9/0036 ,  H01G9/15

Abstract: A process for forming a capacitor. The process includes providing an anode; providing a dielectric on the anode; exposing the anode to a polymer precursor solution comprising monomer, conjugated oligomer and optionally solvent and polymerizing the polymer precursor. The ratio between monomer and conjugated oligomer ranges from 99.9/0.1 to 75/25 b y weight. The solvent content in the polymer precursor solution is from 0 to 99 % by weight.

Abstract translation: 形成电容器的过程。 该工艺包括提供阳极; 在阳极上提供电介质; 将阳极暴露于包含单体，共轭低聚物和任选溶剂的聚合物前体溶液中并使聚合物前体聚合。 单体与共轭低聚物之间的比例范围为99.9 / 0.1至75/25重量％。 聚合物前体溶液中的溶剂含量为0-99重量％。

公开(公告)号：WO2012112676A3

公开(公告)日：2012-11-15

申请号：PCT/US2012025231

申请日：2012-02-15

Applicant: KEMET ELECTRONICS CORP ,  CHACKO ANTONY P ,  CHEN QINGPING ,  JIN YANG ,  LESSNER PHILIP M ,  HAHN RANDOLPH S ,  QIU YONGJIAN ,  BRENNEMAN KEITH R

Inventor： CHACKO ANTONY P ,  CHEN QINGPING ,  JIN YANG ,  LESSNER PHILIP M ,  HAHN RANDOLPH S ,  QIU YONGJIAN ,  BRENNEMAN KEITH R

IPC: H01G9/042 ,  H01G9/008

CPC classification number: H01G9/0032 ,  B05D1/185 ,  B82Y99/00 ,  H01G9/0036 ,  H01G9/028 ,  H01G9/0425 ,  H01G9/052 ,  H01G9/15 ,  Y10S977/948 ,  Y10T29/417 ,  Y10T29/43

Abstract: A process for preparing a solid electrolytic capacitor comprising application of coverage enhancing catalyst followed by application of a conducting polymer layer. Coverage enhancing catalyst is removed after coating and curing.

Abstract translation: 一种制备固体电解电容器的方法，包括应用覆盖增强催化剂，然后施加导电聚合物层。 涂层和固化后除去覆盖增强催化剂。