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    3.
    发明专利
    未知

    公开(公告)号：FR2874807B1

    公开(公告)日：2006-11-10

    申请号：FR0451969

    申请日：2004-09-03

    Applicant: MEMSCAP SA

    Inventor： LAURENS PAUL ,  RANSCH PASCAL

    IPC: A61B5/103 ,  A61B5/00 ,  H04N5/272

    Abstract: A chip card for analyzing physicochemical properties of a cutaneous surface includes at least one body sensor which can deliver a signal representing a measurement of a physicochemical property of the cutaneous surface, and a processing unit used to treat signals delivered by the body sensor and an optional environment sensor and to then store signals in a storage unit on the card. An electrical energy source on the card provides electrical power to the body sensor and the processing unit.

    DISPOSITIF D'ANALYSE DES PROPRIETES PHYSICO-CHIMIQUES DE LA PEAU
    4.
    发明专利
    DISPOSITIF D'ANALYSE DES PROPRIETES PHYSICO-CHIMIQUES DE LA PEAU 未知

    公开(公告)号：FR2874807A1

    公开(公告)日：2006-03-10

    申请号：FR0451969

    申请日：2004-09-03

    Applicant: MEMSCAP SA

    Inventor： LAURENS PAUL ,  RANSCH PASCAL

    IPC: A61B5/103 ,  A61B5/00 ,  H04N5/272

    Abstract: Dispositif d'analyse des propriétés physico-chimiques d'une surface cutanée se présentant sous la forme d'une carte à puce (1) et comportant :- au moins un capteur (2) apte à délivrer un signal représentatif d'une mesure de la propriété physico-chimique ;- une unité de traitement (3) apte à conditionner le signal délivré par le capteur (2) et à le mémoriser dans une unité de stockage (4) ;une source d'énergie électrique (5) pour alimenter ledit capteur (2) et l'unité de traitement

    ACCELEROMETRE PENDULAIRE ET PROCEDE DE FABRICATION DE CELUI-CI
    5.
    发明专利
    ACCELEROMETRE PENDULAIRE ET PROCEDE DE FABRICATION DE CELUI-CI 未知

    公开(公告)号：FR2924813A1

    公开(公告)日：2009-06-12

    申请号：FR0759753

    申请日：2007-12-11

    Applicant: MEMSCAP SA

    Inventor： WENK BEATRICE ,  VENEAU JEAN FRANCOIS ,  HAMES GREG

    IPC: G01P15/02

    Abstract: L'invention concerne un accéléromètre pendulaire, comprenant une électrode pendulaire (20) formée dans un substrat (12), au moins une contre-électrode (32) et un capot d'encapsulation (22), caractérisé en ce que la au moins une contre-électrode (32) est formée sous le capot (22), et en ce qu'il comprend des entretoises (52) positionnées entre le capot (22) et le substrat (12).

    7.
    发明专利
    未知

    公开(公告)号：DE60038422D1

    公开(公告)日：2008-05-08

    申请号：DE60038422

    申请日：2000-04-06

    Applicant: MEMSCAP SA

    Inventor： HILL EDWARD A ,  DHULER VIJAYAKUMAR R

    IPC: H01H1/00 ,  H01H61/06

    Abstract: Microelectromechanical system (MEMS) structures and arrays that provide movement in one, two, and/or three dimensions in response to selective thermal actuation. Significant amounts of scalable displacement are provided. In one embodiment, pairs of thermal arched beams are operably interconnected and thermally actuated to create structures and arrays capable of moving in a plane parallel to the underlying substrate in one and/or two dimensions. One embodiment provides an arched beam operably connected to a crossbeam such that the medial portion arches and alters its separation from the crossbeam when thermally actuated. In another embodiment, at least one thermal arched beam is arched in a nonparallel direction with respect to the plane defined by the underlying substrate. In response to thermal actuation, the medial portion of the arched beam is arched to a greater degree than the end portions of the thermal arched beam, thereby altering the separation of the medial portion from the underlying substrate. One embodiment combines first and second thermal arched beams having medial portions arched in opposed nonparallel directions with respect to the plane defined by the underlying substrate by even greater amounts. In response to thermal actuation, the medial portions thereof arch in opposite nonparallel directions with respect to the underlying substrate, thereby altering the separation of the medial portions from the underlying substrate. Hybrid thermally actuated structures are provided that combine arrays capable of moving in-plane and out of plane, such that motion in all three dimensions may be achieved in response to selective thermal actuation.

    8.
    发明专利
    未知

    公开(公告)号：DE60027532D1

    公开(公告)日：2006-06-01

    申请号：DE60027532

    申请日：2000-08-07

    Applicant: MEMSCAP SA

    Inventor： DHULER R

    IPC: H01H1/00 ,  H01H59/00 ,  H01H61/02 ,  H01H61/04

    Abstract: A microelectromechanical (MEMS) device is provided that includes a microelectronic substrate, a microactuator disposed on the substrate and formed of a single crystalline material, and at least one metallic structure disposed on the substrate adjacent the microactuator such that the metallic structure is on substantially the same plane as the microactuator and is actuated thereby. For example, the MEMS device may be a microrelay. As such, the microrelay may include a pair of metallic structures that are controllably brought into contact by selective actuation of the microactuator. While the MEMS device can include various microactuators, one embodiment of the microactuator is a thermally actuated microactuator which advantageously includes a pair of spaced apart supports disposed on the substrate and at least one arched beam extending therebetween. By heating the at least one arched beam of the microactuator, the arched beams will further arch. In an alternate embodiment, the microactuator is an electrostatic microactuator which includes a stationary stator and a movable shuttle. Imposing an electrical bias between the stator and the shuttle causes the shuttle to move with respect to the stator. Thus, on actuation, the microactuator moves between a first position in which the microactuator is spaced apart from the at least one metallic structure to a second position in which the microactuator operably engages the at least one metallic structure. Several advantageous methods for fabricating a MEMS device having both single crystal components and metallic components are also provided.

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