公开(公告)号：WO2005119633A1

公开(公告)日：2005-12-15

申请号：PCT/US2005/009302

申请日：2005-03-17

Applicant: ONSCREE TECHNOLOGIES, INC. ,  RAOS, Robert, Bogdan ,  DESAI, Nilesh, Thakor ,  FLANK, Steven

Inventor： RAOS, Robert, Bogdan ,  DESAI, Nilesh, Thakor ,  FLANK, Steven

IPC: G09F9/33

CPC classification number: G09F9/33 ,  G09F13/20 ,  H05K1/0209 ,  H05K3/28 ,  H05K2201/064 ,  H05K2201/0989 ,  H05K2201/10106 ,  H05K2201/1056 ,  H05K2203/081 ,  H05K2203/1178

Abstract: A light emitting diode (LED) assembly with a vented (22) printed circuit board (2) is disclosed. A printed circuit board assembly may include a plurality of LED modules (4) disposed in an array with a multilayered substrate and a plurality of vents (22). The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules (4) for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules (4) for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.

Abstract translation: 公开了具有通气（22）印刷电路板（2）的发光二极管（LED）组件。 印刷电路板组件可以包括多个设置在具有多层衬底和多个通风口（22）的阵列中的LED模块（4）。 多层基板可以包括与用于散热的LED模块（4）热连通的热冷却层。 多层基板可以包括与LED模块（4）电连通以用于激励LED的一个或多个电功率层。 多层衬底可以具有外部绝缘层，该外部绝缘层包括被配置为与热冷却层流体连通的多个流体孔。