PROFILED EXTRUSION REPLICATION
    1.
    发明申请
    PROFILED EXTRUSION REPLICATION 审中-公开
    型材挤压复制

    公开(公告)号:WO2011126713A3

    公开(公告)日:2012-04-19

    申请号:PCT/US2011029169

    申请日:2011-03-21

    Abstract: A profiled extrusion replication process is disclosed that includes steps of (a) extruding a molten material through an extrusion die having at least one profiled die lip to form a molten extrudate having first and second major extrudate surfaces and having a first structural feature in the first major extrudate surface; (b) bringing the molten extrudate into contact with a tool surface comprising one or more second structural features so as to cause a portion of the first structural feature in the first major extrudate surface to contact the one or more second structural features on the tool surface; and (c) cooling the molten extrudate to provide the structured film. Structured films and apparatus for making structured films are also disclosed.

    Abstract translation: 公开了一种异型挤出复制方法,其包括以下步骤:(a)将熔融材料挤出通过具有至少一个成型模唇的挤出模具,以形成具有第一和第二主要挤出物表面的熔融挤出物,并且具有第一结构特征 主要挤出物表面; (b)使熔融挤出物与包括一个或多个第二结构特征的工具表面接触,以使得第一主要挤出物表面中的第一结构特征的一部分与工具表面上的一个或多个第二结构特征接触 ; 和(c)冷却熔融挤出物以提供结构化膜。 还公开了用于制造结构薄膜的结构薄膜和设备。

    SILVER THICK FILM PASTE HERMETICALLY SEALED BY SURFACE THIN FILM MULTILAYER
    4.
    发明申请
    SILVER THICK FILM PASTE HERMETICALLY SEALED BY SURFACE THIN FILM MULTILAYER 审中-公开
    表面薄膜多层密封的银膜薄膜

    公开(公告)号:WO2015048808A1

    公开(公告)日:2015-04-02

    申请号:PCT/US2014/058471

    申请日:2014-09-30

    CPC classification number: H05K1/115 H05K3/4629 H05K2201/0338

    Abstract: A ceramic substrate comprises a plurality of ceramic sheets, a plurality of inner conductive layers, a plurality of vias, and an upper conductive layer. The ceramic sheets are stacked one on top of another and include a top ceramic sheet. The inner conductive layers include electrically conductive material that forms electrically conductive features on an upper surface of each ceramic sheet excluding the top ceramic sheet. The vias are formed in each of the ceramic sheets with each via being filled with electrically conductive material. The upper conductive layer includes electrically conductive material that forms electrically conductive features on an upper surface of the top ceramic sheet. The upper conductive layer is constructed from a stack of four sublayers. A first sublayer is formed from titanium. A second sublayer is formed from copper. A third sublayer is formed from platinum. A fourth sublayer is formed from gold.

    Abstract translation: 陶瓷基板包括多个陶瓷片,多个内导电层,多个通孔和上导电层。 陶瓷片层叠在一起,并且包括顶部陶瓷片。 内部导电层包括导电性材料,其在除了顶部陶瓷片之外的每个陶瓷片的上表面上形成导电特征。 在每个陶瓷片中形成通孔,每个通孔填充有导电材料。 上导电层包括在顶部陶瓷片的上表面上形成导电特征的导电材料。 上导电层由四个子层的堆叠构成。 第一子层由钛形成。 第二子层由铜形成。 第三子层由铂形成。 第四子层由金形成。

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