公开(公告)号：WO2006007248A2

公开(公告)日：2006-01-19

申请号：PCT/US2005/019077

申请日：2005-06-01

Applicant: TPL, INC. ,  SLENES, Kirk, M. ,  PERRY, Dale ,  LABANOWSKI, Christopher ,  PERRY, Hope ,  LUTHER, Erik

Inventor： SLENES, Kirk, M. ,  PERRY, Dale ,  LABANOWSKI, Christopher ,  PERRY, Hope ,  LUTHER, Erik

IPC: C03C10/02

CPC classification number: C08K3/34 ,  H01G4/206 ,  H01L28/40 ,  H05K1/162 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/0269 ,  H05K2203/105

Abstract: The present invention provides a structured, nano-composite, dielectric film. The invention also provides a method for producing the thin composite film. The composite material comprises ceramic dielectric particles, preferably nano-sized particles, and a thermoset polymer system. The composite material exhibits a high energy density.

Abstract translation: 本发明提供一种结构化的纳米复合材料电介质膜。 本发明还提供一种薄复合膜的制造方法。 复合材料包括陶瓷电介质颗粒，优选纳米尺寸颗粒和热固性聚合物体系。 复合材料表现出高的能量密度。

公开(公告)号：WO0239796A8

公开(公告)日：2002-09-26

申请号：PCT/US0151138

申请日：2001-11-09

Applicant: TPL INC ,  HARTMAN WILLIAM F ,  SLENES KIRK M ,  LAW KRISTEN J

Inventor： HARTMAN WILLIAM F ,  SLENES KIRK M ,  LAW KRISTEN J

IPC: H01L21/02 ,  H01L27/08 ,  H05K1/16 ,  H05K3/02

CPC classification number: H01L28/60 ,  H01L27/08 ,  H05K1/16

Abstract: A method of fabricating a passive integrated circuit. The integrated circuitry is fabricated in a single plane, the circuitry including passive components such as capacitors, resistors, and inductors. The method features the steps of forming on a substrate (16) a first pattern (10) of conductive material and a first set of passive component elements, and depositing a patterned dielectric layer (12) onto the substrate. The first pattern of conductive material provides electrical connectivity to the first set of passive component elements. An apparatus fabricated according to method is disclosed.

Abstract translation: 一种制造无源集成电路的方法。 集成电路制造在单个平面中，该电路包括诸如电容器，电阻器和电感器的无源元件。 该方法的特征在于在衬底（16）上形成导电材料的第一图案（10）和第一组无源组件元件，以及将图案化的介电层（12）沉积到衬底上的步骤。 导电材料的第一图案提供与第一组无源元件元件的电连接。 公开了根据方法制造的装置。

公开(公告)号：WO2006007248A3

公开(公告)日：2006-10-05

申请号：PCT/US2005019077

申请日：2005-06-01

Applicant: TPL INC ,  SLENES KIRK M ,  PERRY DALE ,  LABANOWSKI CHRISTOPHER ,  PERRY HOPE ,  LUTHER ERIK

Inventor： SLENES KIRK M ,  PERRY DALE ,  LABANOWSKI CHRISTOPHER ,  PERRY HOPE ,  LUTHER ERIK

IPC: C08K3/22

CPC classification number: C08K3/34 ,  H01G4/206 ,  H01L28/40 ,  H05K1/162 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/0269 ,  H05K2203/105

Abstract: The present invention provides a structured, nano-composite, dielectric film. The invention also provides a method for producing the thin composite film. The composite material comprises ceramic dielectric particles, preferably nano-sized particles, and a thermoset polymer system. The composite material exhibits a high energy density.

Abstract translation: 本发明提供了一种结构化的纳米复合电介质膜。 本发明还提供了一种制造该薄复合膜的方法。 该复合材料包含陶瓷介电颗粒，优选纳米尺寸的颗粒和热固性聚合物体系。 该复合材料表现出高能量密度。