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    Overmolded electronic assembly
    1.
    发明授权
    Overmolded electronic assembly 有权
    包覆成型的电子组件

    公开(公告)号：US07462077B2

    公开(公告)日：2008-12-09

    申请号：US11604575

    申请日：2006-11-27

    Applicant: Kin Yean Chow ,  Ching Meng Fang ,  Larry M. Mandel ,  Sim Ying Yong

    Inventor： Kin Yean Chow ,  Ching Meng Fang ,  Larry M. Mandel ,  Sim Ying Yong

    IPC: H01R12/24

    CPC classification number: H01R13/5202 ,  H01R13/6658 ,  H01R43/24 ,  H05K5/0034 ,  H05K5/065

    Abstract: A partially overmolded component having a precisely defined overmolding edge includes a component having a protruding elongate rib and the overmolding having a terminal edge abutting the protruding elongate rib. The rib defines surfaces that provide a greater area of contact between the component and an overmolding tool and a more tortuous flow path to bleed-through.

    Abstract translation: 具有精确限定的包覆成型边缘的部分包覆成型的部件包括具有突出的细长肋的部件，并且包覆成型具有邻接突出的细长肋的末端边缘。 肋限定了在组件和包覆成型工具之间提供更大的接触面积的表面，以及更曲折的流动通路。

    Overmolded electronic assembly with metal seal ring
    2.
    发明授权
    Overmolded electronic assembly with metal seal ring 有权
    包覆成型电子组件带金属密封圈

    公开(公告)号：US07455552B1

    公开(公告)日：2008-11-25

    申请号：US12069036

    申请日：2008-02-06

    Applicant: Ching Meng Fang ,  Kin Yean Chow ,  Larry M. Mandel ,  Sim Ying Yong

    Inventor： Ching Meng Fang ,  Kin Yean Chow ,  Larry M. Mandel ,  Sim Ying Yong

    IPC: H01R13/58

    CPC classification number: H05K3/284 ,  H05K5/0034 ,  H05K5/064 ,  H05K2201/10189 ,  H05K2201/2018 ,  H05K2203/1316

    Abstract: An improved overmolded electronic assembly includes a backplate, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, a metal ring on an outer side of a thermoplastic wall member of the electrical connector, and an overmold body. The metal ring circumscribes external connector pins of the electrical connector, and the overmold body together with the backplate and thermoplastic wall member of the electrical connector sealingly encase the circuit substrate and the circuit device defined on the substrate, with the overmold body having a peripheral edge in adhesive contact with the metal ring. The invention avoids delamination problems associate with similar arrangements which do not incorporate a metal ring.

    Abstract translation: 一种改进的包覆成型电子组件包括背板，背板上的电路基板，安装在电路基板上的至少一个电子部件，电路基板上的导电迹线，电子元件与电子部件一起限定电路装置，电连接器 ，电连接器的热塑性壁构件的外侧上的金属环和包覆成型体。 金属环围绕电连接器的外部连接器引脚，并且包覆模体与电连接器的背板和热塑性壁构件一起密封地包围电路基板和限定在基板上的电路装置，其中包覆模体具有外围边缘 与金属环粘合。 本发明避免了与不结合金属环的类似装置相关联的分层问题。

    Interlocking overmold for electronic assembly
    6.
    发明申请
    Interlocking overmold for electronic assembly 审中-公开
    用于电子组装的联锁包覆成型

    公开(公告)号：US20090197478A1

    公开(公告)日：2009-08-06

    申请号：US12069090

    申请日：2008-02-06

    Applicant: Larry M. Mandel ,  Kin Yean Chow ,  Ching Meng Fang ,  Sim Ying Yong

    Inventor： Larry M. Mandel ,  Kin Yean Chow ,  Ching Meng Fang ,  Sim Ying Yong

    IPC: H01R13/405

    CPC classification number: H01R13/504 ,  H05K5/0034

    Abstract: An improved overmolded electronic assembly includes a backplate, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector having a thermoplastic body and electrical conducting elements embedded in and extending through the thermoplastic body to define internal and external connectors, and an overmold body that is mechanically interlocked with protuberances integrally formed on the thermoplastic body of the electrical connector. The mechanical interlocking relationship between the overmold body and the thermoplastic body of the electrical connector eliminates or minimizes delamination problems that could otherwise occur during thermal cycling, reduces or eliminates stringent control on cleanliness and texture of surfaces of the thermoplastic body of the electrical connector that interface with the overmold body, and eliminate or reduce costs associated with overcoming problems associated with delamination during thermal cycling.

    Abstract translation: 一种改进的包覆成型电子组件包括背板，背板上的电路基板，安装在电路基板上的至少一个电子部件，电路基板上的导电迹线，电子元件与电子部件一起限定电路装置，电连接器 具有热塑性本体和导电元件，其嵌入并延伸穿过热塑性本体以限定内部和外部连接器，以及包覆成型体，其与整体形成在电连接器的热塑性主体上的突起机械地互锁。 包覆成型体和电连接器的热塑性体之间的机械互锁关系消除或最小化在热循环期间可能发生的分层问题，减少或消除对接口的电连接器的热塑性体的表面的清洁度和质地的严格控制 并且消除或降低与热循环期间分层相关的问题相关的成本。

    Wrap-around overmold for electronic assembly
    7.
    发明授权
    Wrap-around overmold for electronic assembly 有权
    用于电子组装的包装包装

    公开(公告)号：US07616448B2

    公开(公告)日：2009-11-10

    申请号：US11901042

    申请日：2007-09-14

    Applicant: Thomas A. Degenkolb ,  Scott D. Brandenburg ,  Larry M. Mandel ,  Kin Yean Chow ,  Ching Meng Fang ,  Sim Ying Yong

    Inventor： Thomas A. Degenkolb ,  Scott D. Brandenburg ,  Larry M. Mandel ,  Kin Yean Chow ,  Ching Meng Fang ,  Sim Ying Yong

    IPC: H05K5/06

    CPC classification number: H05K3/284 ,  H05K3/0061 ,  H05K3/0064 ,  H05K5/0034 ,  H05K5/065 ,  H05K7/20854 ,  H05K2201/10189 ,  H05K2203/1316

    Abstract: An improved overmolded electronic assembly includes a backplate provided with a recessed edge, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, and an overmold body that has peripheral edges that wrap around sides of the backplate and onto the edge recesses. The resulting over wrap feature eliminates delamination problems that would otherwise occur during thermal cycling of the electronic assembly, improves corrosion resistance at connector-to-backplate interfaces, and enhances securement of the printed circuit board assembly and electrical connector to the assembly.

    Abstract translation: 改进的包覆成型电子组件包括设置有凹入边缘的背板，背板上的电路基板，安装在电路基板上的至少一个电子部件，电路基板上的导电迹线，其与电子部件一起限定电路 装置，电连接器和包覆成型体，其具有围绕背板的侧部并且围绕边缘凹部的周边边缘。 所产生的过度包覆功能消除了在电子组件的热循环期间会发生的分层问题，提高了连接器到背板接口处的耐腐蚀性，并且增强了印刷电路板组件和电连接器到组件的固定。

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