公开(公告)号：US07148554B2

公开(公告)日：2006-12-12

申请号：US11014443

申请日：2004-12-16

Applicant: Chih Kai Nah ,  Morris D Stillabower ,  Binghua Pan ,  Sim Ying Yong ,  Przemyslaw Gromala

Inventor： Chih Kai Nah ,  Morris D Stillabower ,  Binghua Pan ,  Sim Ying Yong ,  Przemyslaw Gromala

IPC: H05K7/10 ,  H05K1/18 ,  H05K5/02 ,  H01L23/48

CPC classification number: H05K1/0206 ,  H05K3/3442 ,  H05K2201/066 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611

Abstract: An electronic component arrangement includes a discrete electronic component having first and second terminals and a centre-exposed pad. A substrate has a first electrical conductor electrically connected to the first terminal, a second electrical conductor electrically connected to the second terminal, and a third electrical conductor. A thermally conductive element is in direct thermal communication with both the centre-exposed pad of the electronic component and the third electrical conductor of the substrate.

Abstract translation: 电子部件装置包括具有第一和第二端子和中心暴露焊盘的分立电子部件。 基板具有电连接到第一端子的第一电导体，与第二端子电连接的第二电导体和第三电导体。 导热元件与电子部件的中心曝光焊盘和基板的第三导电体直接热连通。

公开(公告)号：US06986454B2

公开(公告)日：2006-01-17

申请号：US10616617

申请日：2003-07-10

Applicant: Morris D Stillabower

Inventor： Morris D Stillabower

IPC: B23K31/00 ,  B23K31/02 ,  B23K35/12

CPC classification number: H05K3/3484 ,  H01L2224/16225 ,  H05K3/3442 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/0254 ,  H05K2201/10727 ,  H05K2201/10992 ,  H05K2201/2036 ,  Y02P70/613

Abstract: An electronic package (10) is provided which includes a circuit board (12) having a substrate (14) and circuitry (16) and a surface mount device (22) having a contact terminal (24). A mounting pad (28) is formed on the circuit board (12). The electronic package (10) also includes a solder joint (30) connecting the contact terminal (24) of the surface mount device (22) to the mounting pad (28) on the circuit board (12). The solder joint (30) includes a reflowable solder and a plurality of stand-off members (32 or 42). The stand-off members (32 or 42) provide a separation distance (H) between the circuit board (12) and surface mount device (22) in the range of about 0.01 mm to 0.10 mm.

Abstract translation: 提供一种电子封装（10），其包括具有衬底（14）和电路（16）的电路板（12）和具有接触端子（24）的表面安装器件（22）。 在电路板（12）上形成安装垫（28）。 电子封装（10）还包括将表面安装器件（22）的接触端子（24）连接到电路板（12）上的安装焊盘（28）的焊接接头（30）。 焊接接头（30）包括可回流焊料和多个分离构件（32或42）。 分离构件（32或42）在电路板（12）和表面安装装置（22）之间提供在约0.01mm至0.10mm的范围内的间隔距离（H）。

公开(公告)号：US08360405B2

公开(公告)日：2013-01-29

申请号：US11434947

申请日：2006-05-16

Applicant: Morris D. Stillabower

Inventor： Morris D. Stillabower

IPC: F16F3/00

CPC classification number: F16F3/0876

Abstract: A vibration-sensitive module having a mounting flange is mounted to a vibrational base with a bushing assembly secured to the base, where the mounting flange has cammed surfaces radially adjacent to the bushing assembly that variably engage the radial peripheries of the bushings in response to vibrational movement of the base. The cammed surfaces produce a desired force vs. deflection characteristic of the mounting apparatus, and the bushing material retains its compressibility under load to minimize cross-coupling of vibrational force impulses.

Abstract translation: 具有安装凸缘的振动敏感模块安装到振动基座，其中衬套组件固定到基座，其中安装凸缘具有径向相邻于衬套组件的凸轮表面，其可响应于振动可变地接合衬套的径向外周 底座的运动。 凸轮表面产生了安装装置所需的力与偏转特性，并且衬套材料在负载下保持其可压缩性，以最小化振动力冲击的交叉耦合。

公开(公告)号：US20100055434A1

公开(公告)日：2010-03-04

申请号：US12231244

申请日：2008-08-29

Applicant: Morris D. Stillabower

Inventor： Morris D. Stillabower

IPC: B32B5/00 ,  C25D13/20

CPC classification number: C25D13/20 ,  C25D13/22 ,  Y10T428/266

Abstract: A process for electrophoretically coating an electrically conductive substrate involves providing an electrically conductive substrate that is to be electrophoretically coated, pretreating the substrate surface to increase its asperity, and applying an electrophoretic coating composition to the treated substrate surface. The process allows the use of conventional electrophoretic coating compositions and/or processing equipment to achieve thicker coatings and/or to develop electrically conductive electrophoretically coated surfaces employing conventional electrophoretic coating compositions, processing parameters and/or equipment.

Abstract translation: 用于电泳涂覆导电衬底的方法包括提供待电泳涂覆的导电衬底，预处理衬底表面以增加其粗糙度，以及将电泳涂层组合物施加到经处理的衬底表面。 该方法允许使用常规电泳涂料组合物和/或加工设备来实现更厚的涂层和/或使用常规电泳涂料组合物，加工参数和/或设备来开发导电电泳涂覆的表面。

公开(公告)号：US5119686A

公开(公告)日：1992-06-09

申请号：US695834

申请日：1991-05-06

Applicant: Morris D. Stillabower

Inventor： Morris D. Stillabower

IPC: B21D43/05 ,  F16H37/12

CPC classification number: F16H37/124 ,  B21D43/055 ,  Y10T74/18152 ,  Y10T74/18296 ,  Y10T74/2107

Abstract: A worktool transfer apparatus for moving a worktool along a recirculating path includes a chain moveably supported by two spaced sprockets of equal diameter. A motor rotates one of the sprockets to cause circulating movement of the chain. A constant breadth velocity cam is fixedly attached to one of the chain links so that the rotational center of the velocity cam is aligned with the rotational centers of each of the sprockets as the link to which the velocity cam is attached moves about the periphery of each sprocket. Four rollers extend from the cam and ride along an oval track for maintaining orientation of the velocity cam as it moves with the chain. A cross bearing block is moved linearly back and forth by the velocity cam. A worktool is attached to and moves with the cross bearing block and is independently moveable laterally of the cross bearing block.

Abstract translation: 用于沿着循环路径移动工具的工具工具传送装置包括由相等直径的两个间隔的链轮可移动地支撑的链条。 电机旋转链轮中的一个以引起链条的循环运动。 恒定宽度速度凸轮固定地连接到链节之一，使得速度凸轮的旋转中心与每个链轮的旋转中心对准，因为速度凸轮附接到的链节围绕每个链轮的周边移动 链轮 四个滚轮从凸轮延伸并沿着椭圆形轨道行驶，以保持速度凸轮与链条一起移动时的方位。 十字轴承座由速度凸轮线性地前后移动。 工具工具与十字轴承座连接并移动，并可独立地在横向承载块的侧面移动。

公开(公告)号：US20080259580A1

公开(公告)日：2008-10-23

申请号：US11788702

申请日：2007-04-20

Applicant: Morris D. Stillabower ,  Sathur N. Venkatesan ,  Philip W. Wittmer

Inventor： Morris D. Stillabower ,  Sathur N. Venkatesan ,  Philip W. Wittmer

IPC: H05K3/30 ,  H05K7/00

CPC classification number: H05K3/306 ,  H05K3/305 ,  H05K3/3447 ,  H05K2201/0129 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10037 ,  H05K2201/10454 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10977 ,  H05K2203/1105 ,  Y10T29/4913

Abstract: A process for stabilizing an electrical component having a body and electrical leads projecting from the body and received in through-holes defined in a substrate, while avoiding disadvantages associated with dispensing a hot-melt adhesive during assembly of an electrical package, involves steps of providing a circuit substrate having through-holes for receiving the leads of a leaded electrical component, providing an electrical component having a body and leads extending from the body, positioning a preformed hot-melt adhesive on the circuit substrate or on the electrical component, positioning the electrical component on the circuit substrate so that the leads extend into the through-holes and so that the preformed hot-melt adhesive is positioned between and fills the gap between the body of the electrical component and the substrate, and activating and solidifying the hot-melt adhesive to securely adhere the body of the electrical component to the substrate.

Abstract translation: 一种用于稳定具有主体的电气部件和从主体突出并被接纳在限定在基板中的通孔中的电引线的方法，同时避免了在组装电气封装期间分配热熔粘合剂相关的缺点，包括提供 具有用于接收引线电气部件的引线的通孔的电路基板，提供具有主体的电气部件和从主体延伸的引线，将预成型的热熔粘合剂定位在电路基板上或电气部件上， 电气元件，使得引线延伸到通孔中，使得预成型的热熔性粘合剂位于电气部件的主体和基板之间并填充电气部件的主体之间的间隙，并且激活和固化热 - 熔融粘合剂以将电组件的主体牢固地粘附到基底上。

公开(公告)号：US20070278724A1

公开(公告)日：2007-12-06

申请号：US11434947

申请日：2006-05-16

Applicant: Morris D. Stillabower

Inventor： Morris D. Stillabower

IPC: F16F13/00

CPC classification number: F16F3/0876

Abstract: A vibration-sensitive module having a mounting flange is mounted to a vibrational base with a bushing assembly secured to the base, where the mounting flange has cammed surfaces radially adjacent to the bushing assembly that variably engage the radial peripheries of the bushings in response to vibrational movement of the base. The cammed surfaces produce a desired force vs. deflection characteristic of the mounting apparatus, and the bushing material retains its compressibility under load to minimize cross-coupling of vibrational force impulses.

Abstract translation: 具有安装凸缘的振动敏感模块安装到振动基座，其中衬套组件固定到基座，其中安装凸缘具有径向相邻于衬套组件的凸轮表面，其可响应于振动可变地接合衬套的径向外周 底座的运动。 凸轮表面产生了安装装置所需的力与偏转特性，并且衬套材料在负载下保持其可压缩性，以最小化振动力冲击的交叉耦合。

公开(公告)号：US06790102B2

公开(公告)日：2004-09-14

申请号：US10268327

申请日：2002-10-10

Applicant: Morris D Stillabower ,  Roy A. Visser

Inventor： Morris D Stillabower ,  Roy A. Visser

IPC: H01R1122

CPC classification number: H05K3/368 ,  H01R12/52 ,  H05K1/141 ,  H05K3/3447 ,  H05K2201/10386 ,  H05K2201/10825 ,  H05K2201/10871

Abstract: A flat twisted electrical terminal is provided for connecting a first circuit element to a second circuit element on respective first and second circuit boards. The terminal includes a flat conductive member having a first end for connecting to a first circuit element and a second end for connecting to a second circuit element. The conductive member is axially twisted about its longitudinal axis.