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公开(公告)号：US20060124583A1
公开(公告)日：2006-06-15
申请号：US11348941
申请日：2006-02-06
Applicant: Peter Kukanskis , Dennis Fritz , Frank Durso , Steven Castaldi , David Sawoska
Inventor： Peter Kukanskis , Dennis Fritz , Frank Durso , Steven Castaldi , David Sawoska
CPC classification number: H01C17/24 , H01C17/242 , H05K1/167 , H05K3/027 , H05K3/064 , H05K3/184 , H05K2201/0344 , H05K2203/0315 , H05K2203/107 , H05K2203/1105 , H05K2203/1453 , H05K2203/171
Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
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公开(公告)号：US06585904B2
公开(公告)日：2003-07-01
申请号：US09784242
申请日：2001-02-15
Applicant: Peter Kukanskis , Dennis Fritz , Frank Durso , Steven Castaldi , David Sawoska
Inventor： Peter Kukanskis , Dennis Fritz , Frank Durso , Steven Castaldi , David Sawoska
IPC: H01B1300
CPC classification number: H01C17/24 , H01C17/242 , H05K1/167 , H05K3/027 , H05K3/064 , H05K3/184 , H05K2201/0344 , H05K2203/0315 , H05K2203/107 , H05K2203/1105 , H05K2203/1453 , H05K2203/171
Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
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公开(公告)号：US20070237899A1
公开(公告)日：2007-10-11
申请号：US11398080
申请日：2006-04-05
Applicant: David Sawoska , Andrew Krol , Steven Castaldi
Inventor： David Sawoska , Andrew Krol , Steven Castaldi
CPC classification number: H05K3/061 , B41M5/0047 , B41M5/0058 , C23F1/18 , H05K3/383 , H05K2203/013 , H05K2203/1173
Abstract: A process for printing inks or organic resists using a droplet discharge printing mechanism onto a copper or copper alloy surface with increased resolution is described. The increased resolution is achieved by first preferably microetching the surface and then treating the copper surface with an organic substance which is capable of lowering the surface energy of the copper surface or capable of making the copper surface more hydrophobic prior to printing thereon. The process is useful in the manufacture of electronic circuits.
Abstract translation: 描述了使用液滴喷射印刷机构将印刷油墨或有机抗蚀剂印刷到铜或铜合金表面上的分辨率提高的方法。 通过首先优选对表面进行微蚀刻，然后用能够降低铜表面的能量或能够使铜表面在其上印刷之前更具疏水性的有机物质来处理铜表面来实现增加的分辨率。 该方法在电子电路的制造中是有用的。
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4.发明授权公开(公告)号：US07022464B2
公开(公告)日：2006-04-04
申请号：US10925589
申请日：2004-08-25
Applicant: Peter Kukanskis , Steven Castaldi
Inventor： Peter Kukanskis , Steven Castaldi
CPC classification number: H05K1/167 , H05K3/184 , H05K2201/0209 , H05K2201/0212 , H05K2203/1453
Abstract: An integral plated resistor having an improved range of resistance is produced by uniformly dispersing an effective amount of various particles in an electroless nickel phosphorus plating composition so that the particles are codeposited with the electroless nickel phosphorus plating composition. Preferred particles include, polytetrafluoroethylene, silicon carbide, tungsten carbide, and other particles that fully sinter at a temperature of less than about 170° C. The improved nickel phosphorus plated resistors of the invention demonstrate increased stability during manufacturing press cycles and a greater range of resistance values than have previously been achieved.
Abstract translation: 通过将有效量的各种颗粒均匀分散在无电镀镍磷电镀组合物中，使得颗粒与无电镀镍磷电镀组合物共沉积，从而产生具有改善的电阻范围的整体镀覆电阻。 优选的颗粒包括聚四氟乙烯，碳化硅，碳化钨和在小于约170℃的温度下完全烧结的其它颗粒。本发明的改进的镀镍电阻器在制造压制循环期间表现出增加的稳定性和更大范围的 电阻值比以前已经实现。
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5.发明申请INTEGRAL PLATED RESISTOR AND METHOD FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARDS COMPRISING THE SAME 有权用于制造包含其的印刷电路板的集成电阻器和方法公开(公告)号：US20060046202A1
公开(公告)日：2006-03-02
申请号：US10925589
申请日：2004-08-25
Applicant: Peter Kukanskis , Steven Castaldi
Inventor： Peter Kukanskis , Steven Castaldi
IPC: G03F7/00
CPC classification number: H05K1/167 , H05K3/184 , H05K2201/0209 , H05K2201/0212 , H05K2203/1453
Abstract: An integral plated resistor having an improved range of resistance is produced by uniformly dispersing an effective amount of various particles in an electroless nickel phosphorus plating composition so that the particles are codeposited with the electroless nickel phosphorus plating composition. Preferred particles include, polytetrafluoroethylene, silicon carbide, tungsten carbide, and other particles that fully sinter at a temperature of less than about 170° C. The improved nickel phosphorus plated resistors of the invention demonstrate increased stability during manufacturing press cycles and a greater range of resistance values than have previously been achieved.
Abstract translation: 通过将有效量的各种颗粒均匀分散在无电镀镍磷电镀组合物中，使得颗粒与无电镀镍磷电镀组合物共沉积，从而产生具有改善的电阻范围的整体电镀电阻。 优选的颗粒包括聚四氟乙烯，碳化硅，碳化钨和在小于约170℃的温度下完全烧结的其它颗粒。本发明的改进的镀镍电阻器在制造压制循环期间表现出增加的稳定性和更大范围的 电阻值比以前已经实现。
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Patent Agency Ranking
6.发明授权公开(公告)号：US07279108B2
公开(公告)日：2007-10-09
申请号：US11348941
申请日：2006-02-06
Applicant: Peter Kukanskis , Dennis Fritz , Frank Durso , Steven Castaldi , David Sawoska
Inventor： Peter Kukanskis , Dennis Fritz , Frank Durso , Steven Castaldi , David Sawoska
CPC classification number: H01C17/24 , H01C17/242 , H05K1/167 , H05K3/027 , H05K3/064 , H05K3/184 , H05K2201/0344 , H05K2203/0315 , H05K2203/107 , H05K2203/1105 , H05K2203/1453 , H05K2203/171
Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
Abstract translation: 揭示了一种工艺，其中电阻器可以通过将电阻器电镀到绝缘基板上而与印刷电路板一体制造。 作为用于改善镀覆电阻器的均匀性和一致性的技术，讨论了绝缘衬底通过电镀电阻器的蚀刻和氧化的均匀化。 还公开了修整和烘烤作为用于调节和稳定电镀电阻器的电阻的方法。
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公开(公告)号：US20070138142A1
公开(公告)日：2007-06-21
申请号：US11316010
申请日：2005-12-21
Applicant: Kesheng Feng , Nilesh Kapadia , Steven Castaldi
Inventor： Kesheng Feng , Nilesh Kapadia , Steven Castaldi
CPC classification number: C23F1/18 , C23F1/16 , H01L21/32134 , H05K3/383 , H05K2203/122
Abstract: The present invention is directed to a microetching composition comprising a source of cupric ions, acid, a nitrile compound, and a source of halide ions. Other additive, including organic solvents, a source of molybdenum ions, amines, polyamines, and acrylamides may also be included in the composition of the invention. The present invention is also directed to a method of microetching copper or copper alloy surfaces to increase the adhesion of the copper surface to a polymeric material, comprising the steps of contacting a copper or copper alloy surface with the composition of the invention, and thereafter bonding the polymeric material to the copper or copper alloy surface.
Abstract translation: 本发明涉及包含铜离子源，酸，腈化合物和卤离子源的微蚀刻组合物。 其它添加剂，包括有机溶剂，钼离子源，胺，多胺和丙烯酰胺也可以包括在本发明的组合物中。 本发明还涉及一种使铜或铜合金表面微蚀以增加铜表面与聚合物材料的粘附性的方法，包括以下步骤：使铜或铜合金表面与本发明的组合物接触，然后粘合 聚合物材料到铜或铜合金表面。
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公开(公告)号：US06168836A
公开(公告)日：2001-01-02
申请号：US09183137
申请日：1998-10-30
Applicant: Peter Kukanskis , Steven Castaldi , Andrew Krol
Inventor： Peter Kukanskis , Steven Castaldi , Andrew Krol
IPC: C08F248
CPC classification number: C23C18/1641 , C23C18/1692 , H05K3/38
Abstract: A process is disclosed for plating upon a polymeric surface with improved adhesion and coverage. The process comprises plating a metallic deposit upon a polymeric surface which has not been completely polymerized and then further curing the plated upon surface.
Abstract translation: 公开了一种用于在聚合物表面上电镀以改进附着力和覆盖度的方法。 该方法包括将金属沉积物镀在未完全聚合的聚合物表面上，然后进一步固化表面上的电镀。
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公开(公告)号：US20080041824A1
公开(公告)日：2008-02-21
申请号：US11893068
申请日：2007-08-14
Applicant: Kesheng Feng , Nilesh Kapadia , Steven Castaldi
Inventor： Kesheng Feng , Nilesh Kapadia , Steven Castaldi
CPC classification number: C23F1/18 , H05K3/383 , H05K2203/122
Abstract: The present invention is directed to a microetching composition comprising a source of cupric ions, acid, a nitrile compound, and a source of halide ions. Other additive, including organic solvents, a source of molybdenum ions, amines, polyamines, and acrylamides may also be included in the composition of the invention. The present invention is also directed to a method of microetching copper or copper alloy surfaces to increase the adhesion of the copper surface to a polymeric material, comprising the steps of contacting a copper or copper alloy surface with the composition of the invention, and thereafter bonding the polymeric material to the copper or copper alloy surface.
Abstract translation: 本发明涉及包含铜离子源，酸，腈化合物和卤离子源的微蚀刻组合物。 其它添加剂，包括有机溶剂，钼离子源，胺，多胺和丙烯酰胺也可以包括在本发明的组合物中。 本发明还涉及一种使铜或铜合金表面微蚀以增加铜表面与聚合物材料的粘附性的方法，包括以下步骤：使铜或铜合金表面与本发明的组合物接触，然后粘合 聚合物材料到铜或铜合金表面。
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10.发明申请公开(公告)号：US20080003351A1
公开(公告)日：2008-01-03
申请号：US11899256
申请日：2007-09-04
Applicant: Peter Kukanskis , Dennis Fritz , Frank Durso , Steven Castaldi , David Sawoska
Inventor： Peter Kukanskis , Dennis Fritz , Frank Durso , Steven Castaldi , David Sawoska
IPC: H05K3/06
CPC classification number: H01C17/24 , H01C17/242 , H05K1/167 , H05K3/027 , H05K3/064 , H05K3/184 , H05K2201/0344 , H05K2203/0315 , H05K2203/107 , H05K2203/1105 , H05K2203/1453 , H05K2203/171
Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
Abstract translation: 揭示了一种工艺，其中电阻器可以通过将电阻器电镀到绝缘基板上而与印刷电路板一体制造。 作为用于改善镀覆电阻器的均匀性和一致性的技术，讨论了绝缘衬底通过电镀电阻器的蚀刻和氧化的均匀化。 还公开了修整和烘烤作为用于调节和稳定电镀电阻器的电阻的方法。
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