公开(公告)号：WO2005011343A2

公开(公告)日：2005-02-03

申请号：PCT/US2004/023292

申请日：2004-07-20

Applicant: MOTOROLA, INC. ,  ZOLLO, James, A. ,  ARLEDGE, John, K. ,  BARRON, John, C. ,  BURHANCE, Gary, R. ,  HOLLEY, John ,  LIEBMAN, Henry, F.

Inventor： ZOLLO, James, A. ,  ARLEDGE, John, K. ,  BARRON, John, C. ,  BURHANCE, Gary, R. ,  HOLLEY, John ,  LIEBMAN, Henry, F.

IPC: H05K

CPC classification number: H05K1/185 ,  H05K1/112 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A substrate assembly (10) and method of making same has at least one embedded component (25) in a via (24) of a substrate core (22) and includes a first adhesive layer (20) coupled to the substrate core, and a second adhesive layer (26) on at least portions of a top surface of the substrate core and above portions of the embedded component. The substrate assembly can further include a first conductive layer (18) adhered to the bottom surface of the substrate core and a second conductive layer (28) on the second adhesive layer. The substrate assembly can further include an interconnection (36) between a conductive surface of the embedded component and at least one among the first conductive layer and the second conductive layer. The interconnection can be formed through an opening (34) that at least temporarily exposes at least a conductive surface (32) of the embedded component.

Abstract translation: 衬底组件（10）及其制造方法在衬底芯（22）的通孔（24）中具有至少一个嵌入式部件（25）并且包括第一粘合剂层（20） 耦合到所述衬底核心，以及在所述衬底核心的顶表面的至少部分上以及所述嵌入组件的部分上方的第二粘合剂层（26）。 衬底组件还可以包括粘附到衬底核心的底表面的第一导电层（18）和第二粘附层上的第二导电层（28）。 衬底组件还可以包括在嵌入式部件的导电表面与第一导电层和第二导电层中的至少一个之间的互连（36）。 互连可以通过开口（34）形成，开口（34）至少暂时暴露嵌入式部件的至少一个导电表面（32）。

公开(公告)号：WO2006102175A1

公开(公告)日：2006-09-28

申请号：PCT/US2006/009909

申请日：2006-03-17

Applicant: MOTOROLA, INC. ,  ZOLLO, James, A. ,  ARLEDGE, John, K. ,  DESAI, Nitin, B.

Inventor： ZOLLO, James, A. ,  ARLEDGE, John, K. ,  DESAI, Nitin, B.

IPC: H05K1/03 ,  H05K1/09

CPC classification number: H05K1/184 ,  H05K1/185 ,  H05K3/4046 ,  H05K3/4611 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/41 ,  Y10T29/417 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49137 ,  Y10T29/49139

Abstract: A multilayer substrate assembly (80) includes at least one embedded component (52) within a plurality of stacked pre-processed substrates. Each pre-processed substrate can have a core dielectric (14), patterned conductive surfaces (12 and 16) on opposing sides of the core dielectric, and at least one hole (18) in each of at least two adjacently stacked pre-processed substrates such that at least two holes are substantially aligned on top of each other forming a single hole (19). The assembly further includes a processed adhesive layer (48) between top and bottom surfaces of respective pre-processed substrates. The embedded component is placed in the single hole and forms a gap (67 & 66) between the embedded component and a peripheral wall of the single hole. When the assembly is biased, the processed adhesive layer fills the gap to form the assembly having the embedded component cross-secting the plurality of pre-processed substrates.

Abstract translation: 多层衬底组件（80）包括在多个堆叠的预处理衬底内的至少一个嵌入部件（52）。 每个预处理衬底可以具有芯电介质（14），在芯电介质的相对侧上的图案化导电表面（12和16）以及至少两个相邻堆叠的预处理衬底中的每一个中的至少一个孔（18） 使得至少两个孔基本对准在彼此的顶部上，形成单个孔（19）。 组件还包括在相应的预处理衬底的顶表面和底表面之间的经处理的粘合剂层（48）。 将嵌入式部件放置在单个孔中，并在嵌入部件与单个孔的周围壁之间形成间隙（67＆66）。 当组件偏压时，经处理的粘合剂层填充间隙以形成具有与多个预处理衬底交叉的嵌入部件的组件。

公开(公告)号：WO2005111838A2

公开(公告)日：2005-11-24

申请号：PCT/US2005/014233

申请日：2005-04-26

Applicant: MOTOROLA, INC. ,  NILSEN, Ryan, M. ,  TRACY, James, L. ,  DESAI, Nitin, B. ,  ZOLLO, James, A.

Inventor： NILSEN, Ryan, M. ,  TRACY, James, L. ,  DESAI, Nitin, B. ,  ZOLLO, James, A.

IPC: G06F15/16

CPC classification number: H05K5/0091 ,  A45C2011/002 ,  A45C2011/003 ,  H04M1/0214 ,  H04M1/04 ,  H04M1/185 ,  H04M1/72575 ,  H04M2250/56

Abstract: A multi-purpose product packaging (100, 200) for an electronic host product (250) having its own casing can include an apparatus casing (110, 210) for removably and substantially encasing the electronic host product, circuitry (240) within the apparatus casing for providing at least one function to the electronic host product, and an interface (255) on the apparatus casing for enabling the at least one function to operate in conjunction with the electronic product. The apparatus casing can be made of recyclable products and the interface can form a portion of the circuitry within the apparatus casing. In one embodiment, the electronic host device can be a phone and the circuitry can provide any number of functions including the function of charging a power source within the phone.

Abstract translation: 用于具有其自身壳体的电子主机产品（250）的多用途产品包装（100,200）可以包括用于可移除地和基本上包围电子主机产品的装置壳体（110,210），该设备内的电路（240） 用于向所述电子主机产品提供至少一个功能的外壳，以及所述设备外壳上的用于使所述至少一个功能能够与所述电子产品一起操作的接口（255）。 设备外壳可以由可回收产品制成，并且接口可以在设备外壳内形成电路的一部分。 在一个实施例中，电子主机设备可以是电话，并且电路可以提供任何数量的功能，包括为电话内的电源充电的功能。

公开(公告)号：WO2005011343A3

公开(公告)日：2005-06-02

申请号：PCT/US2004023292

申请日：2004-07-20

Applicant: MOTOROLA INC ,  ZOLLO JAMES A ,  ARLEDGE JOHN K ,  BARRON JOHN C ,  BURHANCE GARY R ,  HOLLEY JOHN ,  LIEBMAN HENRY F

Inventor： ZOLLO JAMES A ,  ARLEDGE JOHN K ,  BARRON JOHN C ,  BURHANCE GARY R ,  HOLLEY JOHN ,  LIEBMAN HENRY F

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/46 ,  H05K3/36 ,  H01K3/10 ,  H05K3/30 ,  H05K7/10

CPC classification number: H05K1/185 ,  H05K1/112 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A substrate assembly (10) and method of making same has at least one embedded component (25) in a via (24) of a substrate core (22) and includes a first adhesive layer (20) coupled to the substrate core, and a second adhesive layer (26) on at least portions of a top surface of the substrate core and above portions of the embedded component. The substrate assembly can further include a first conductive layer (18) adhered to the bottom surface of the substrate core and a second conductive layer (28) on the second adhesive layer. The substrate assembly can further include an interconnection (36) between a conductive surface of the embedded component and at least one among the first conductive layer and the second conductive layer. The interconnection can be formed through an opening (34) that at least temporarily exposes at least a conductive surface (32) of the embedded component.

Abstract translation: 衬底组件（10）及其制造方法在衬底芯（22）的通孔（24）中具有至少一个嵌入组件（25），并且包括耦合到衬底芯的第一粘合剂层（20）和 第二粘合剂层（26）在衬底芯的顶表面的至少部分上和嵌入部件的部分之上。 衬底组件还可以包括粘附到衬底芯的底表面的第一导电层（18）和第二粘合剂层上的第二导电层（28）。 衬底组件还可以包括在嵌入部件的导电表面与第一导电层和第二导电层中的至少一个之间的互连（36）。 互连可以通过至少暂时暴露嵌入式部件的导电表面（32）的开口（34）形成。

公开(公告)号：WO2005111838A3

公开(公告)日：2006-03-23

申请号：PCT/US2005014233

申请日：2005-04-26

Applicant: MOTOROLA INC ,  NILSEN RYAN M ,  TRACY JAMES L ,  DESAI NITIN B ,  ZOLLO JAMES A

Inventor： NILSEN RYAN M ,  TRACY JAMES L ,  DESAI NITIN B ,  ZOLLO JAMES A

IPC: G06F15/16 ,  H04B1/38 ,  H04M1/02 ,  H04M1/04 ,  H04M1/725 ,  H05K7/20 ,  B65D85/00

CPC classification number: H05K5/0091 ,  A45C2011/002 ,  A45C2011/003 ,  H04M1/0214 ,  H04M1/04 ,  H04M1/185 ,  H04M1/72575 ,  H04M2250/56

Abstract: A multi-purpose product packaging (100, 200) for an electronic host product (250) having its own casing can include an apparatus casing (110, 210) for removably and substantially encasing the electronic host product, circuitry (240) within the apparatus casing for providing at least one function to the electronic host product, and an interface (255) on the apparatus casing for enabling the at least one function to operate in conjunction with the electronic product. The apparatus casing can be made of recyclable products and the interface can form a portion of the circuitry within the apparatus casing. In one embodiment, the electronic host device can be a phone and the circuitry can provide any number of functions including the function of charging a power source within the phone.

Abstract translation: 用于具有其自身壳体的电子主机产品（250）的多用途产品包装（100,200）可以包括用于可移除地和基本上包围电子主机产品的装置壳体（110,210），该设备内的电路（240） 用于向所述电子主机产品提供至少一个功能的外壳，以及所述设备外壳上的用于使所述至少一个功能能够与所述电子产品一起操作的接口（255）。 设备外壳可以由可回收产品制成，并且接口可以在设备外壳内形成电路的一部分。 在一个实施例中，电子主机设备可以是电话，并且电路可以提供任何数量的功能，包括为电话内的电源充电的功能。