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公开(公告)号：KR101149766B1
公开(公告)日：2012-06-11
申请号：KR1020100131318
申请日：2010-12-21
Applicant: (주)미래컴퍼니
IPC: H01L31/18 , H01L31/042 , B23K26/36
CPC classification number: Y02E10/50 , H01L31/18 , B23K26/36 , H01L31/042
Abstract: PURPOSE: A multilayer substrate manufacturing apparatus which simultaneously performing edge deletion and isolation processes and a manufacturing method thereof are provided to reduce tact time of entire processes by integrating isolation and edge deletion processes. CONSTITUTION: A support table(30) supports a multilayer substrate(50) transferred into an apparatus through a transport part(40). A P4 processing unit(10) performs an isolation process with respect to the multilayer substrate loaded on the support table. A P5 processing unit(20) performs an edge deletion process with respect to the multilayer substrate loaded on the support table. The transport part supports the lower part of both edge parts of the multilayer substrate. The transport part comprises a transfer roller(42) and a roller support(44) for supporting the transfer roller.
Abstract translation: 目的：提供同时执行边缘删除和隔离处理的多层基板制造装置及其制造方法，以通过集成隔离和边缘删除处理来减少整个处理的节拍时间。 构成：支撑台（30）支撑通过运输部件（40）转移到装置中的多层基板（50）。 P4处理单元（10）相对于载置在支撑台上的多层基板进行隔离处理。 P5处理单元（20）相对于装载在支撑台上的多层基板进行边缘删除处理。 运输部件支撑多层基板的两个边缘部分的下部。 输送部件包括用于支撑转印辊的转印辊（42）和辊支撑（44）。
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公开(公告)号：KR1020120055075A
公开(公告)日：2012-05-31
申请号：KR1020100116577
申请日：2010-11-23
Applicant: (주)미래컴퍼니
IPC: G02F1/1345 , G02F1/13
CPC classification number: G02F1/1309 , G02F2001/136263 , G02F2201/503 , H01L21/76894
Abstract: PURPOSE: A method for repairing a bus line of a liquid crystal panel and a device thereof are provided to precisely repair defects of a gate bus line or a data bus line on a non image area. CONSTITUTION: A laser processing unit(110) irradiates a laser beam wherein the laser beam has a feature which responds to a protective layer. The protective layer is formed on a damaged part of a bus line. The laser processing unit forms a recess area from which the protective layer is removed. A patterning unit(120) coats and hardens conductive ink in the recess area. The patterning unit generates a repair pattern.
Abstract translation: 目的：提供一种用于修复液晶面板的总线的方法及其装置，以精确地修复非图像区域上的栅极总线或数据总线的缺陷。 构成：激光处理单元（110）照射激光束，其中激光束具有响应于保护层的特征。 保护层形成在总线的损坏部分上。 激光处理单元形成凹部，从该区域去除保护层。 图案形成单元（120）在凹陷区域中涂覆和硬化导电油墨。 图案形成单元产生修复图案。
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公开(公告)号：KR101283557B1
公开(公告)日：2013-07-15
申请号：KR1020100047421
申请日：2010-05-20
Applicant: (주)미래컴퍼니
IPC: B23K26/06 , B23K26/064 , H05K3/46 , H01L21/027
Abstract: 여러 층이 적층된 다층기판에 대하여 복수 파장의 레이저빔을 조사하여 가공하는 레이저 가공장치에 있어서, 서로 다른 파장의 레이저빔을 조사하는 복수의 레이저광원과, 일차원 원형 빔 또는 사각형 빔을 조사하여 스테이지에 거치된 다층기판의 일부 층을 1차 가공하고, 1차 가공에 의해 노출된 영역에 일차원 원형 빔 또는 사각형 빔보다 작거나 큰 단면적을 가지는 레이저 빔을 조사하여 다층기판의 동일 지점에 대하여 나머지 층 전부 혹은 일부를 2차 가공하는 빔 조사부를 포함하는 레이저 가공장치가 제공된다. 이에 의하면, 다층기판 가공 중에 사용되는 서로 다른 파장을 가지는 복수의 레이저빔을 동축으로 입사시키는 구조를 가지며, 2회 이상의 반복동작이 요구되던 레이저 가공 과정을 1회로 단순화함으로써 가공시간을 단축시키는 것이 가능하다.
Abstract translation: 目的：提供一种激光加工设备，通过简化激光加工程序来缩短制造时间。 构成：激光加工装置包括第一激光光源（10a），第二激光光源（10b）和光束激发单元。 第一激光光源照射第一波长的激光束。 第二激光光源用具有第一波长的激光束照射具有不同光轴的第二波长的激光束。 光束激光单元改变通道，使得第一波长的激光束具有与第二波长的激光束相同的光轴，并将第一波长的激光束和第二波长的激光束照射在第二波长的激光束中 多层板（1）为同轴。
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公开(公告)号：KR1020120012001A
公开(公告)日：2012-02-09
申请号：KR1020100073796
申请日：2010-07-30
Applicant: (주)미래컴퍼니
IPC: H01L31/18 , H01L31/042 , B23K26/402 , B23K26/08
CPC classification number: Y02E10/50 , Y02P70/521 , H01L31/18 , B23K26/08 , B23K26/402 , H01L31/042
Abstract: PURPOSE: A multilayer substrate processing apparatus which uses a laser beam with a plurality of wavelengths and a multilayer substrate processing method are provided to convert a processing direction without the rotation of a laser processing part using a wavelength plate and a polarization optical system. CONSTITUTION: A transfer table(20) supports a loaded multilayer substrate. The transfer table is able to reciprocate along a first driving axis. A laser processing part(40) changes a polarization property of one laser beam among a plurality of laser beams according to the rotation of a wavelength plate. The laser processing part processes the multilayer substrate along an aligned processing axis. A gantry unit(30) reciprocates the laser processing part along a second driving axis.
Abstract translation: 目的：提供使用具有多个波长的激光束和多层基板处理方法的多层基板处理装置，使用波长板和偏振光学系统不使用激光加工部的旋转来转换处理方向。 构成：转印台（20）支撑装载的多层基板。 传送台能够沿着第一驱动轴往复运动。 激光处理部件（40）根据波长板的旋转改变多个激光束中的一个激光束的偏振特性。 激光加工部件沿着对准的处理轴处理多层基板。 台架单元（30）沿着第二驱动轴往复运动激光加工部件。
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公开(公告)号：KR101214046B1
公开(公告)日：2012-12-20
申请号：KR1020100073793
申请日：2010-07-30
Applicant: (주)미래컴퍼니
IPC: B23K26/16 , B23K26/402 , B23K26/08 , H01L31/18
CPC classification number: Y02P70/521
Abstract: 다층기판을가공하는레이저가공장치가개시된다. 다층기판을지지하는지지테이블과, 지지테이블상에지지되는다층기판에대하여스캐너에의해조정된위치로레이저빔을조사하는레이저가공부와, 제1 주행축을따라왕복이동가능하며, 레이저가공부가제1 주행축과교차하는제2 주행축을따라왕복이동가능하도록결합되는갠트리유닛과, 레이저가공부와다층기판사이에위치하며, 레이저빔에의해다층기판으로부터발생되는분진을집진하는집진부를포함하되, 집진부에는레이저빔이조사되어레이저가공되는가공영역에대응되는형상을가지고레이저빔을관통시키는개구부가형성되어있는것을특징으로하는레이저가공장치에의, 다층기판의레이저가공시 레이저빔이기판을투과하지않고기판에증착된물질과직접반응하여해당물질을제거할때 발생하는분진을집진함에있어서기구물구성을최소화하며, 진공형성을위한집진용량을최소화하고, 집진유량을높임으로써집진효율을극대화할수 있다.
Abstract translation: 公开了一种用于处理多层基板的激光加工设备。 和用于支撑多层基板，支撑激光一个支撑台，研究相对于被支撑在其上照射在由扫描仪的调整后的位置的激光束的表多层基板，第一驱动沿轴线往复运动，并且激光进行了研究 如权利要求位于台架单元之间并且激光进行了研究，其沿着所述第二行进交叉的第一驱动轴，以便往复运动耦合，所述多层基板，包括：灰尘用于通过激光束收集从多层基板所产生的粉尘收集部 其中，集尘单元设置有用于使激光束穿过激光束的开口，所述激光束具有与激光束照射的加工区域对应的形状并且被激光加工。 它将收集当材料直接与沉积在基材上的物质直接反应而不渗透的产生的灰尘的设备结构最小化， 最小化的二进制容量，它可以通过增加的集尘率收集效率最大化。
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Patent Agency Ranking
公开(公告)号：KR1020120079849A
公开(公告)日：2012-07-13
申请号：KR1020100138429
申请日：2010-12-30
Applicant: (주)미래컴퍼니
Abstract: PURPOSE: An apparatus and method for processing a glass substrate using a disc wheel are provided to reduce a tact time with extending the life time of the wheel by finish-cutting the glass substrate. CONSTITUTION: A method for processing a glass substrate stuck on a support table(110) is as follows. A recessed portion(5c) of the glass substrate is firstly cut by a rough cutting unit(120) having a disc wheel(122). The support table rotates at a predetermined angle. The recessed portion of the glass substrate is secondly cut by a finish cutting unit having a grinder wheel.
Abstract translation: 目的：提供一种使用盘轮加工玻璃基板的装置和方法，通过精加工玻璃基板来延长车轮的使用寿命，从而缩短了飞行时间。 构成：用于处理粘贴在支撑台（110）上的玻璃基板的方法如下。 玻璃基板的凹部（5c）首先由具有盘轮（122）的粗切割单元（120）切割。 支撑台以预定角度旋转。 玻璃基板的凹部由具有研磨轮的精加工切割单元二次切割。
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公开(公告)号：KR1020120001871A
公开(公告)日：2012-01-05
申请号：KR1020100062474
申请日：2010-06-30
Applicant: (주)미래컴퍼니
CPC classification number: Y02E10/50 , Y02P70/521 , H01L31/18 , H01L31/04
Abstract: PURPOSE: A device and method for processing a multilayer substrate are provided to shorten process time by performing a laser process in all directions. CONSTITUTION: A transfer table(20) supports a loaded thin film type solar cell board(50). A laser processing unit(40) processes the thin film type solar cell board using one of laser beams with different wavelengths. The laser processing unit includes a first laser source(42a), a second laser source(42b), and a rotation polarization optical system. The rotation polarization optical system branches another optical path according to the rotation of the optical system. A gantry unit(30) reciprocates the laser processing unit along a second driving shaft(36) cross a first driving shaft(24).
Abstract translation: 目的：提供一种用于处理多层基板的装置和方法，以通过在所有方向执行激光处理来缩短处理时间。 构成：转印台（20）支撑装载的薄膜型太阳能电池板（50）。 激光处理单元（40）使用不同波长的激光束之一来处理薄膜型太阳能电池板。 激光处理单元包括第一激光源（42a），第二激光源（42b）和旋转偏振光学系统。 旋转偏振光学系统根据光学系统的旋转分支另一光路。 台架单元（30）沿着穿过第一驱动轴（24）的第二驱动轴（36）使激光加工单元往复运动。
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公开(公告)号：KR101094324B1
公开(公告)日：2011-12-19
申请号：KR1020100039906
申请日：2010-04-29
Applicant: (주)미래컴퍼니
CPC classification number: Y02E10/50 , Y02P70/521
Abstract: 박막형 태양전지의 제조방법 및 레이저 가공장치가 개시된다. 일 실시예에 따른 레이저 가공장치는, 적재된 박막형 태양전지 기판을 지지하면서 제1 주행축을 따라 왕복 이동가능한 이송테이블과, 작업 영역의 일부가 서로 중첩되는 복수의 레이저 유닛을 포함하는 레이저 통합부와, 제1 주행축과 교차하여 형성된 제2 주행축을 따라 레이저 통합부를 왕복 이동시키는 갠트리 유닛을 포함할 수 있으며, 아이솔레이션 공정과 에지 딜리션 공정을 통합하여 하나의 장비에서 수행가능하도록 시스템 통합함으로써 택트 타임을 단축시키고 전체적인 제조 비용을 절감할 수 있다.
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公开(公告)号：KR1020110129321A
公开(公告)日：2011-12-01
申请号：KR1020100073793
申请日：2010-07-30
Applicant: (주)미래컴퍼니
IPC: B23K26/16 , B23K26/402 , B23K26/08 , H01L31/18
CPC classification number: Y02P70/521
Abstract: PURPOSE: A laser processing apparatus for a multilayer substrate is provided to efficiently collect dust because a dust collecting unit is always located directly above a processing area. CONSTITUTION: A laser processing apparatus for a multilayer substrate comprises a support table(40) for supporting a multilayer substrate, a laser processing unit(10) which irradiates a laser beam to a position of the multilayer substrate regulated by a scanner, a gantry unit(30) which reciprocates along a first transfer axis(45) and is mounted with the laser processing unit to reciprocate along a second transfer axis(35) crossing the first transfer axis, and a dust collecting unit(20) which is located between the laser processing unit and the multilayer substrate and collects dust produced from the multilayer substrate by the laser beam.
Abstract translation: 目的：提供一种用于多层基板的激光加工设备，用于有效地收集灰尘，因为灰尘收集单元始终位于处理区域正上方。 构成：用于多层基板的激光加工装置包括用于支撑多层基板的支撑台（40），激光处理单元（10），其将激光束照射到由扫描仪调节的多层基板的位置，台架单元 （30），其沿着第一传送轴线（45）往复运动，并且安装有所述激光加工单元，沿着与所述第一传送轴线交叉的第二传送轴线（35）往复运动;以及集尘单元（20），其位于 激光加工单元和多层基板，并通过激光束收集由多层基板产生的灰尘。
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公开(公告)号：KR1020110127910A
公开(公告)日：2011-11-28
申请号：KR1020100047421
申请日：2010-05-20
Applicant: (주)미래컴퍼니
IPC: B23K26/06 , B23K26/064 , H05K3/46 , H01L21/027
CPC classification number: B23K26/0626 , B23K26/0613 , G03F7/2004 , H01L21/0275 , H05K3/4602
Abstract: PURPOSE: A laser processing apparatus is provided to reducing the manufacturing time by simplifying the laser processing procedure to one time. CONSTITUTION: A laser processing apparatus comprises a first laser light source(10a), a second laser light source(10b) and a beam lasing unit. The first laser light source irradiates the laser beam of a first wave length. The second laser light source irradiates the laser beam of a second wavelength having a different optical axis with the laser beam of the first wave length. The beam lasing unit changes a passage in order that the laser beam of the first wave length have the same optical axis as the laser beam of the second wavelength and irradiates the laser beam of the first wave length and laser beam of the second wavelength in a multi-layer plate(1) as the same axis.
Abstract translation: 目的：提供一种激光加工设备，通过简化激光加工程序来缩短制造时间。 构成：激光加工装置包括第一激光光源（10a），第二激光光源（10b）和光束激发单元。 第一激光光源照射第一波长的激光束。 第二激光光源用具有第一波长的激光束照射具有不同光轴的第二波长的激光束。 光束激光单元改变通道，使得第一波长的激光束具有与第二波长的激光束相同的光轴，并将第一波长的激光束和第二波长的激光束照射在第二波长的激光束中 多层板（1）为同轴。
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