公开(公告)号：WO2023063551A1

公开(公告)日：2023-04-20

申请号：PCT/KR2022/011789

申请日：2022-08-08

Applicant: (주)펨트론

Inventor： 유영웅 ,  조철훈 ,  윤정삼 ,  김용하

IPC: G01N23/046 ,  G01N23/18 ,  G06N3/08

Abstract: 본 발명은 CT 검사 장치에 관한 것으로, 검사 대상에 대해 N 장의 프로젝션 영상을 촬영하는 CT 촬영부와, 상기 CT 촬영부에 의해 촬영된 N장의 상기 프로젝션 영상을 입력받아 상기 검사 대상에 대한 CT 단층 영상을 출력하는 인공지능 기반의 AI 모델을 갖는 CT 영상 생성부를 포함하는 것을 특징으로 한다. 이에 따라, 적은 수의 프로젝션 영상, 예를 들어 4장의 프로젝션 영상의 촬영 만으로 높은 화질과 해상력을 갖는 CT 단층 영상을 생성할 수 있다.

公开(公告)号：KR102172768B1

公开(公告)日：2020-11-02

申请号：KR1020190003058

申请日：2019-01-10

Applicant: (주)펨트론

Inventor： 조철훈 ,  윤정삼

IPC: G01N21/88 ,  G01N21/95 ,  G06T7/00

公开(公告)号：KR101409803B1

公开(公告)日：2014-06-24

申请号：KR1020130071107

申请日：2013-06-20

Applicant: (주)펨트론

Inventor： 조철훈 ,  강상형 ,  윤정삼

IPC: G01B11/24

Abstract: The present invention relates to a method and a device for measuring a surface shape capable of measuring information on the warpage of a substrate. The method for measuring a surface shape according to the present invention comprises a step (a) of measuring a distance to the surface of the substrate through a laser displacement measurement method; a step (b) of measuring the height of objects formed on the surface of the substrate through a Moire′s method; and a step (c) of measuring information on the warpage of the substrate and the surface shape of the objects on the substrate based on the distance to the surface of the substrate and the height of the objects measured at multiple FOV while the step (a) and (b) are performed as a FOV unit by dividing the surface of the substrate into the multiple FOV. The step (b) comprises a step (b1) of obtaining multiple photographing images of the substrate to enable the application of the Moire′s method; a step (b2) of transferring lattices between the processes of obtaining each photographing image during the step (b1); and a step (b3) of measuring the height of the objects by applying the Moire′s method to the multiple photographing images. Herein, SPI equipment of AOI equipment using the Moire′s method can measure the information on the warpage of the substrate as a measured object.

Abstract translation: 本发明涉及一种测量表面形状的方法和装置，该表面形状能够测量关于基板翘曲的信息。 根据本发明的测量表面形状的方法包括通过激光位移测量方法测量到衬底表面的距离的步骤（a）; 步骤（b），通过莫尔氏法测量形成在基底表面上的物体的高度; 以及步骤（c），在步骤（a）中基于到基板表面的距离和在多个FOV测量的物体的高度来测量基板的翘曲和基板上的物体的表面形状的信息 ）和（b）通过将基板的表面划分成多个FOV而作为FOV单元执行。 步骤（b）包括步骤（b1），获得基片的多个拍摄图像，以实现莫尔方法的应用; 在步骤（b1）中在获得每个拍摄图像的处理之间传送格子的步骤（b2）; 以及通过将莫尔氏法应用于多个拍摄图像来测量物体的高度的步骤（b3）。 在这里，使用莫尔方法的AOI设备的SPI设备可以测量作为测量对象的基板翘曲的信息。