公开(公告)号：KR100789360B1

公开(公告)日：2007-12-28

申请号：KR1020060120680

申请日：2006-12-01

Applicant: (주) 알엔투테크놀로지

Inventor： 이효종 ,  성정현 ,  한종희 ,  석창헌 ,  최문석 ,  이병철 ,  김기태

IPC: H01Q11/08 ,  H01Q1/24

Abstract: A ceramic chip antenna is provided to implement miniaturization by inserting a grounding capacitance and a grounding in an inside of the chip antenna. A ceramic chip antenna includes a chip body, a radiation part(200), an input terminal(400), a grounding terminal(500), and a coupling feeding part. The chip body is formed by a dielectric substance having a specific dielectric constant. The radiation part is formed by a conductor of a helical shape in an inside of the chip body. The input terminal is placed at an end of the chip body and receives an external voltage. The grounding terminal is placed at a surface of an end of the chip body and connected with an external ground. The coupling feeding part is connected with the input terminal and the grounding terminal and transmits the external voltage inputted from the input terminal using the capacitance coupling.

Abstract translation: 提供陶瓷芯片天线，通过在芯片天线的内部插入接地电容和接地来实现小型化。 陶瓷芯片天线包括芯片体，辐射部分（200），输入端子（400），接地端子（500）和耦合馈电部分。 芯片体由具有特定介电常数的电介质形成。 辐射部分由芯片体内部的螺旋形导体形成。 输入端子放置在芯片主体的一端并接收外部电压。 接地端子放置在芯片主体的端部的表面并与外部接地连接。 耦合馈电部分与输入端子和接地端子连接，并使用电容耦合传输从输入端子输入的外部电压。