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公开(公告)号：CN1463040A
公开(公告)日：2003-12-24
申请号：CN03103883.2
申请日：2003-02-14
Applicant: 富士通株式会社
CPC classification number: H01L24/48 , H01L23/3128 , H01L23/4334 , H01L23/49822 , H01L23/50 , H01L24/45 , H01L24/49 , H01L24/73 , H01L2224/0401 , H01L2224/05554 , H01L2224/05624 , H01L2224/06135 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4813 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/49109 , H01L2224/4911 , H01L2224/4943 , H01L2224/73207 , H01L2224/73215 , H01L2224/73265 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/0105 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10162 , H01L2924/1433 , H01L2924/15151 , H01L2924/15153 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19042 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: 一种半导体元件具有一个电路形成表面，其中电极端在该表面的外围部分排列。该半导体元件被模制树脂封装在对应于半导体元件的电极的位置具有开孔的基片上。该半导体元件被安装到所述基片上，处于电路形成表面面对该基片和电极端位于该开孔处的状态，并且与半导体元件的电路形成表面相反的背面从模制树脂暴露出来。由金属片所形成的散热部件被提供在与安装有半导体元件的表面相反的基片表面上。该散热部件的表面从模制树脂暴露出来。
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公开(公告)号：CN1271712C
公开(公告)日：2006-08-23
申请号：CN03103883.2
申请日：2003-02-14
Applicant: 富士通株式会社
CPC classification number: H01L24/48 , H01L23/3128 , H01L23/4334 , H01L23/49822 , H01L23/50 , H01L24/45 , H01L24/49 , H01L24/73 , H01L2224/0401 , H01L2224/05554 , H01L2224/05624 , H01L2224/06135 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4813 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/49109 , H01L2224/4911 , H01L2224/4943 , H01L2224/73207 , H01L2224/73215 , H01L2224/73265 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/0105 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10162 , H01L2924/1433 , H01L2924/15151 , H01L2924/15153 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19042 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: 一种半导体元件具有一个电路形成表面，其中电极端在该表面的外围部分排列。该半导体元件被模制树脂封装在对应于半导体元件的电极的位置具有开孔的基片上。该半导体元件被安装到所述基片上，处于电路形成表面面对该基片和电极端位于该开孔处的状态，并且与半导体元件的电路形成表面相反的背面从模制树脂暴露出来。由金属片所形成的散热部件被提供在与安装有半导体元件的表面相反的基片表面上。该散热部件的表面从模制树脂暴露出来。
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公开(公告)号：CN1728371A
公开(公告)日：2006-02-01
申请号：CN200510088554.2
申请日：2003-02-14
Applicant: 富士通株式会社
IPC: H01L23/48
CPC classification number: H01L24/48 , H01L23/3128 , H01L23/4334 , H01L23/49822 , H01L23/50 , H01L24/45 , H01L24/49 , H01L24/73 , H01L2224/0401 , H01L2224/05554 , H01L2224/05624 , H01L2224/06135 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4813 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/49109 , H01L2224/4911 , H01L2224/4943 , H01L2224/73207 , H01L2224/73215 , H01L2224/73265 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/0105 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10162 , H01L2924/1433 , H01L2924/15151 , H01L2924/15153 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19042 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: 一种半导体器件，其中包括：半导体元件，其具有设置在电路形成表面的外围部分上的第一电极、设置在该电路形成表面上形成第一电极的区域内侧的第二电极、以及连接在所述第一电极和所述第二电极之间的金属线；以及电连接到所述第一电极的外部连接端。
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