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公开(公告)号：CN1176496C
公开(公告)日：2004-11-17
申请号：CN01143962.9
申请日：2001-12-27
Applicant: 富士通株式会社
IPC: H01L27/14
CPC classification number: H01L31/0203 , H01L27/14618 , H01L27/14625 , H01L31/02002 , H01L31/02325 , H01L2224/48227 , H01L2924/01322 , H04N5/2253 , H04N5/2254 , H04N2007/145 , H05K1/0284 , H05K3/205 , H05K3/4007 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: 一种半导体装置，包括：装有功能部件的外壳(14、14A、14B、14C)；用导电材料制成并模制在树脂外壳(14、14A、14B、14C)中的线路图案(12a)；从外壳(14、14A、14B、14C)露出的部分线路图案(12a)；与线路图案(12a)连接的电子部件(9)，其中的电子部件(9)是模制在树脂外壳(14、14A、14B、14C)内的；以及连接在外壳(14、14A、14B、14C)露出的部分线路图案(12a)上的半导体单元(10、10A)。
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公开(公告)号：CN1215537C
公开(公告)日：2005-08-17
申请号：CN96114520.X
申请日：1996-11-08
Applicant: 富士通株式会社
CPC classification number: H01L21/4832 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/67138 , H01L21/6833 , H01L23/3107 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L24/97 , H01L25/105 , H01L29/0657 , H01L2224/05554 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/45015 , H01L2224/45144 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48471 , H01L2224/4848 , H01L2224/48599 , H01L2224/49171 , H01L2224/73265 , H01L2224/78301 , H01L2224/7865 , H01L2224/85001 , H01L2224/85051 , H01L2224/85181 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2224/85664 , H01L2224/85986 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2225/1035 , H01L2225/107 , H01L2225/1094 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10158 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/18165 , H01L2924/3011 , H05K1/181 , H05K3/303 , H05K3/305 , H05K3/3436 , H05K3/3442 , H05K2201/09045 , H05K2201/10727 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: 一种元件，它包含以下部分：芯片(111)；封装芯片的树脂封壳(112，151，314)，该树脂封壳的安装面上设有树脂凸部(117，154，318)，树脂凸部上设有相应的金属膜(113，155，315)。芯片的电极焊盘与金属膜由连接部分(118，101，163，245，313，343，342)电连接，每个所述树脂凸部都被所述金属膜整体地覆盖。
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公开(公告)号：CN1079167C
公开(公告)日：2002-02-13
申请号：CN96104519.1
申请日：1996-04-10
Applicant: 富士通株式会社
IPC: H01L21/60
CPC classification number: H01L24/85 , B23K20/004 , B23K2101/40 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/0401 , H01L2224/04042 , H01L2224/05599 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/48479 , H01L2224/48599 , H01L2224/48699 , H01L2224/49109 , H01L2224/4945 , H01L2224/78301 , H01L2224/78302 , H01L2224/85009 , H01L2224/85045 , H01L2224/85051 , H01L2224/85186 , H01L2224/85191 , H01L2224/85205 , H01L2224/85951 , H01L2224/85986 , H01L2924/00014 , H01L2924/01013 , H01L2924/01079 , H01L2924/014 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H01L2224/48227 , H01L2924/00 , H01L2924/00015 , H01L2924/00012 , H01L2224/4554 , H01L2224/85399
Abstract: 一种丝焊方法，包括：第一焊接工序，用来在金属丝中形成第一球形部分并把第一球形部分焊到第一被连接件上；球形部分形成工序，用来引导金属丝离开其被焊到内引线上的位置从而形成一预定的环，以及第二焊接工序，用于在金属丝的预定位置中形成第二球形部分；以及第二焊接工序，用于把第二球形部分焊接到作为第二被连接件的半导体元件的焊盘上。
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公开(公告)号：CN1137173A
公开(公告)日：1996-12-04
申请号：CN96104519.1
申请日：1996-04-10
Applicant: 富士通株式会社
IPC: H01L21/60
CPC classification number: H01L24/85 , B23K20/004 , B23K2101/40 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/0401 , H01L2224/04042 , H01L2224/05599 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48471 , H01L2224/48475 , H01L2224/48479 , H01L2224/48599 , H01L2224/48699 , H01L2224/49109 , H01L2224/4945 , H01L2224/78301 , H01L2224/78302 , H01L2224/85009 , H01L2224/85045 , H01L2224/85051 , H01L2224/85186 , H01L2224/85191 , H01L2224/85205 , H01L2224/85951 , H01L2224/85986 , H01L2924/00014 , H01L2924/01013 , H01L2924/01079 , H01L2924/014 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H01L2224/48227 , H01L2924/00 , H01L2924/00015 , H01L2924/00012 , H01L2224/4554 , H01L2224/85399
Abstract: 一种丝焊方法，包括：第一焊接工序，用来在金属丝中形成第一球形部分并把第一球形部分焊到第一被连接件上；球形部分形成工序，用来引导金属丝离开其被焊到内引线上的位置从而形成一预定的环，以及第二焊接工序，用于在金属丝的预定位置中形成第二球形部分；以及第二焊接工序；用于把第二球形部分焊接到作为第二被连接件的半导体元件的焊盘上。
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公开(公告)号：CN1549317A
公开(公告)日：2004-11-24
申请号：CN200410047635.3
申请日：1996-11-08
Applicant: 富士通株式会社
CPC classification number: H01L21/4832 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/67138 , H01L21/6833 , H01L23/3107 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L24/97 , H01L25/105 , H01L29/0657 , H01L2224/05554 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/45015 , H01L2224/45144 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48471 , H01L2224/4848 , H01L2224/48599 , H01L2224/49171 , H01L2224/73265 , H01L2224/78301 , H01L2224/7865 , H01L2224/85001 , H01L2224/85051 , H01L2224/85181 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2224/85664 , H01L2224/85986 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2225/1035 , H01L2225/107 , H01L2225/1094 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10158 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/18165 , H01L2924/3011 , H05K1/181 , H05K3/303 , H05K3/305 , H05K3/3436 , H05K3/3442 , H05K2201/09045 , H05K2201/10727 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: 一种元件，它包含以下部分：芯片(111)；封装芯片的树脂封壳(112，151，314)，该树脂封壳的安装面上设有树脂凸部(117，154，318)，树脂凸部上设有相应的金属膜(113，155，315)。芯片的电极焊盘与金属膜由连接部分(118，101，163，245，313，343，342)电连接，每个所述树脂凸部都被所述金属膜整体地覆盖。
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Patent Agency Ranking
公开(公告)号：CN1463040A
公开(公告)日：2003-12-24
申请号：CN03103883.2
申请日：2003-02-14
Applicant: 富士通株式会社
CPC classification number: H01L24/48 , H01L23/3128 , H01L23/4334 , H01L23/49822 , H01L23/50 , H01L24/45 , H01L24/49 , H01L24/73 , H01L2224/0401 , H01L2224/05554 , H01L2224/05624 , H01L2224/06135 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4813 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/49109 , H01L2224/4911 , H01L2224/4943 , H01L2224/73207 , H01L2224/73215 , H01L2224/73265 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/0105 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10162 , H01L2924/1433 , H01L2924/15151 , H01L2924/15153 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19042 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: 一种半导体元件具有一个电路形成表面，其中电极端在该表面的外围部分排列。该半导体元件被模制树脂封装在对应于半导体元件的电极的位置具有开孔的基片上。该半导体元件被安装到所述基片上，处于电路形成表面面对该基片和电极端位于该开孔处的状态，并且与半导体元件的电路形成表面相反的背面从模制树脂暴露出来。由金属片所形成的散热部件被提供在与安装有半导体元件的表面相反的基片表面上。该散热部件的表面从模制树脂暴露出来。
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公开(公告)号：CN1152797A
公开(公告)日：1997-06-25
申请号：CN96114520.X
申请日：1996-11-08
Applicant: 富士通株式会社
CPC classification number: H01L21/4832 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/67138 , H01L21/6833 , H01L23/3107 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L24/97 , H01L25/105 , H01L29/0657 , H01L2224/05554 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/45015 , H01L2224/45144 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48471 , H01L2224/4848 , H01L2224/48599 , H01L2224/49171 , H01L2224/73265 , H01L2224/78301 , H01L2224/7865 , H01L2224/85001 , H01L2224/85051 , H01L2224/85181 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2224/85664 , H01L2224/85986 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2225/1035 , H01L2225/107 , H01L2225/1094 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10158 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/18165 , H01L2924/3011 , H05K1/181 , H05K3/303 , H05K3/305 , H05K3/3436 , H05K3/3442 , H05K2201/09045 , H05K2201/10727 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: 一种元件，它包含以下部分：芯片(111)；封装芯片的树脂封壳(112，151，314)，该树脂封壳的安装面上设有树脂凸部(117，154，318)。树脂凸部上设有相应的金属膜(113，155，315)。芯片电极焊盘与金属膜由连接部分(118，101，163，245，313，343，342)接通。
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公开(公告)号：CN1307698C
公开(公告)日：2007-03-28
申请号：CN200410047635.3
申请日：1996-11-08
Applicant: 富士通株式会社
CPC classification number: H01L21/4832 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/67138 , H01L21/6833 , H01L23/3107 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L24/97 , H01L25/105 , H01L29/0657 , H01L2224/05554 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/45015 , H01L2224/45144 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48471 , H01L2224/4848 , H01L2224/48599 , H01L2224/49171 , H01L2224/73265 , H01L2224/78301 , H01L2224/7865 , H01L2224/85001 , H01L2224/85051 , H01L2224/85181 , H01L2224/85205 , H01L2224/85439 , H01L2224/85444 , H01L2224/85455 , H01L2224/85664 , H01L2224/85986 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2225/1035 , H01L2225/107 , H01L2225/1094 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10158 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/18165 , H01L2924/3011 , H05K1/181 , H05K3/303 , H05K3/305 , H05K3/3436 , H05K3/3442 , H05K2201/09045 , H05K2201/10727 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: 一种元件，它包含以下部分：芯片(111)；封装芯片的树脂封壳(112，151，314)，该树脂封壳的安装面上设有树脂凸部(117，154，318)，树脂凸部上设有相应的金属膜(113，155，315)。芯片的电极焊盘与金属膜由连接部分(118，101，163，245，313，343，342)电连接，每个所述树脂凸部都被所述金属膜整体地覆盖。
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公开(公告)号：CN1271712C
公开(公告)日：2006-08-23
申请号：CN03103883.2
申请日：2003-02-14
Applicant: 富士通株式会社
CPC classification number: H01L24/48 , H01L23/3128 , H01L23/4334 , H01L23/49822 , H01L23/50 , H01L24/45 , H01L24/49 , H01L24/73 , H01L2224/0401 , H01L2224/05554 , H01L2224/05624 , H01L2224/06135 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4813 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/49109 , H01L2224/4911 , H01L2224/4943 , H01L2224/73207 , H01L2224/73215 , H01L2224/73265 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/0105 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10162 , H01L2924/1433 , H01L2924/15151 , H01L2924/15153 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19042 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: 一种半导体元件具有一个电路形成表面，其中电极端在该表面的外围部分排列。该半导体元件被模制树脂封装在对应于半导体元件的电极的位置具有开孔的基片上。该半导体元件被安装到所述基片上，处于电路形成表面面对该基片和电极端位于该开孔处的状态，并且与半导体元件的电路形成表面相反的背面从模制树脂暴露出来。由金属片所形成的散热部件被提供在与安装有半导体元件的表面相反的基片表面上。该散热部件的表面从模制树脂暴露出来。
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公开(公告)号：CN1728371A
公开(公告)日：2006-02-01
申请号：CN200510088554.2
申请日：2003-02-14
Applicant: 富士通株式会社
IPC: H01L23/48
CPC classification number: H01L24/48 , H01L23/3128 , H01L23/4334 , H01L23/49822 , H01L23/50 , H01L24/45 , H01L24/49 , H01L24/73 , H01L2224/0401 , H01L2224/05554 , H01L2224/05624 , H01L2224/06135 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4813 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/49109 , H01L2224/4911 , H01L2224/4943 , H01L2224/73207 , H01L2224/73215 , H01L2224/73265 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/0105 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10162 , H01L2924/1433 , H01L2924/15151 , H01L2924/15153 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19042 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: 一种半导体器件，其中包括：半导体元件，其具有设置在电路形成表面的外围部分上的第一电极、设置在该电路形成表面上形成第一电极的区域内侧的第二电极、以及连接在所述第一电极和所述第二电极之间的金属线；以及电连接到所述第一电极的外部连接端。
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