-
公开(公告)号：CN100446205C
公开(公告)日：2008-12-24
申请号：CN200580010547.9
申请日：2005-01-12
Applicant: 日本电气株式会社
IPC: H01L21/60
CPC classification number: H01L24/32 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/10175 , H01L2224/13021 , H01L2224/13099 , H01L2224/16111 , H01L2224/16225 , H01L2224/16237 , H01L2224/27013 , H01L2224/29036 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/75251 , H01L2224/81191 , H01L2224/81192 , H01L2224/81193 , H01L2224/812 , H01L2224/81801 , H01L2224/83051 , H01L2224/83101 , H01L2224/83192 , H01L2224/83385 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H05K3/305 , H05K3/3436 , H05K3/3452 , H05K2201/0191 , H05K2201/0989 , H05K2201/10674 , H05K2201/10977 , Y02P70/613 , H01L2924/01083 , H01L2924/00 , H01L2224/13111 , H01L2924/0665 , H01L2224/29099 , H01L2224/81805 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: 本发明在将半导体元件和布线基板的间隙进行树脂密封而形成的半导体装置和其制造方法中，实现高可靠性的电连接。在布线基板(1)的上面设置电极焊盘(5)和阻焊膜(7)，在阻焊膜(7)上形成开口部(7a)以使电极焊盘(5)露出，在半导体元件(2)的下面设置电极(4)。并且，经由凸块(3)将电极(4)连接在电极焊盘(5)上。进而，在布线基板(1)和半导体元件(2)之间的空间中除了凸块(3)和阻焊膜(7)的部分上，设置由树脂构成的底部填充树脂(6)。并且，使得在布线基板(1)和半导体元件(2)之间，阻焊膜(7)的厚度(B)为阻焊膜(7)上的底部填充树脂(6)的厚度(A)以上。另外，使凸块(3)的体积(Vb)小于开口部(7a)的容积(Vs)。
-
公开(公告)号：CN1938839A
公开(公告)日：2007-03-28
申请号：CN200580010547.9
申请日：2005-01-12
Applicant: 日本电气株式会社
IPC: H01L21/60
CPC classification number: H01L24/32 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/10175 , H01L2224/13021 , H01L2224/13099 , H01L2224/16111 , H01L2224/16225 , H01L2224/16237 , H01L2224/27013 , H01L2224/29036 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/75251 , H01L2224/81191 , H01L2224/81192 , H01L2224/81193 , H01L2224/812 , H01L2224/81801 , H01L2224/83051 , H01L2224/83101 , H01L2224/83192 , H01L2224/83385 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H05K3/305 , H05K3/3436 , H05K3/3452 , H05K2201/0191 , H05K2201/0989 , H05K2201/10674 , H05K2201/10977 , Y02P70/613 , H01L2924/01083 , H01L2924/00 , H01L2224/13111 , H01L2924/0665 , H01L2224/29099 , H01L2224/81805 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: 本发明在将半导体元件和布线基板的间隙进行树脂密封而形成的半导体装置和其制造方法中，实现高可靠性的电连接。在布线基板(1)的上面设置电极焊盘(5)和阻焊膜(7)，在阻焊膜(7)上形成开口部(7a)以使电极焊盘(5)露出，在半导体元件(2)的下面设置电极(4)。并且，经由凸块(3)将电极(4)连接在电极焊盘(5)上。进而，在布线基板(1)和半导体元件(2)之间的空间中除了凸块(3)和阻焊膜(7)的部分上，设置由树脂构成的底部填充树脂(6)。并且，使得在布线基板(1)和半导体元件(2)之间，阻焊膜(7)的厚度(B)为阻焊膜(7)上的底部填充树脂(6)的厚度(A)以上。另外，使凸块(3)的体积(Vb)小于开口部(7a)的容积(Vs)。
-
Search Results
2
records
(took 0.028 seconds)
