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Patent Agency Ranking
公开(公告)号：CN1148794C
公开(公告)日：2004-05-05
申请号：CN99803194.1
申请日：1999-02-25
Applicant: 时至准钟表股份有限公司
IPC: H01L21/60
CPC classification number: H01L24/10 , H01L24/03 , H01L24/05 , H01L24/13 , H01L2224/0401 , H01L2224/13 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01037 , H01L2924/01049 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/00
Abstract: 借助于用溅射法形成的铝层构成半导体装置的凸状端子，使其高度比别的部位充分地高，而且，用透明导电膜等的防止氧化的导电膜覆盖其最为突出的端面。
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公开(公告)号：CN1135611C
公开(公告)日：2004-01-21
申请号：CN00800037.9
申请日：2000-01-27
Applicant: 时至准钟表股份有限公司
Inventor： 渡边真
IPC: H01L21/60 , H01L21/311 , H05K3/32
CPC classification number: H01L24/83 , H01L24/29 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/2939 , H01L2224/294 , H01L2224/2989 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/83095 , H01L2224/83101 , H01L2224/83192 , H01L2224/83851 , H01L2224/83862 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01061 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H05K3/323 , H05K3/3494 , H05K2201/09781 , H05K2201/10674 , H05K2203/1476 , H05K2203/166 , H01L2924/00 , H01L2924/00012
Abstract: 一种使用各向异性导电粘接剂的半导体装置的安装方法，把各向异性导电粘接剂(13)配置到电路基板(17)上边，使设置在半导体装置(16)上的突起电极(14)与电路基板(17)上边的布线图形(15)进行位置对准后，把半导体装置(16)载置到电路基板(17)上边，用加压加热夹具(18)，用比各向异性导电粘接剂(13)的粘接剂树脂(11)的硬化温度还低的温度边加热边加压，把半导体装置(16)临时加压附着到电路基板(17)上，然后，用使粘接剂树脂(11)硬化的温度加热粘接剂树脂(11)使之硬化，把临时加压附着上的半导体装置(16)粘接到电路基板(17)上边。
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公开(公告)号：CN1293823A
公开(公告)日：2001-05-02
申请号：CN00800037.9
申请日：2000-01-27
Applicant: 时至准钟表股份有限公司
Inventor： 渡边真
IPC: H01L21/60 , H01L21/311 , H05K3/32
CPC classification number: H01L24/83 , H01L24/29 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/2939 , H01L2224/294 , H01L2224/2989 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/83095 , H01L2224/83101 , H01L2224/83192 , H01L2224/83851 , H01L2224/83862 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01061 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H05K3/323 , H05K3/3494 , H05K2201/09781 , H05K2201/10674 , H05K2203/1476 , H05K2203/166 , H01L2924/00 , H01L2924/00012
Abstract: 把各向异性导电粘接剂(13)配置到电路基板(17)上边,使设置在半导体装置(16)上的突起电极(14)与电路基板(17)上边的布线图形(15)进行位置对准后,把半导体装置(16)载置到电路基板(17)上边,用加压加热夹具(18),用比各向异性导电粘接剂(13)的粘接剂树脂(11)的硬化温度还低的温度边加热边加压,把半导体装置(16)临时加压附着到电路基板(17)上,然后,用使粘接剂树脂(11)硬化的温度加热粘接剂树脂(11)使之硬化,把临时加压附着上的半导体装置(16)粘接到电路基板(17)上边。
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公开(公告)号：CN1291348A
公开(公告)日：2001-04-11
申请号：CN99803194.1
申请日：1999-02-25
Applicant: 时至准钟表股份有限公司
IPC: H01L21/60
CPC classification number: H01L24/10 , H01L24/03 , H01L24/05 , H01L24/13 , H01L2224/0401 , H01L2224/13 , H01L2224/13099 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01037 , H01L2924/01049 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/00
Abstract: 借助于用溅射法形成的铝层构成半导体装置的凸状端子,使其高度比别的部位充分地高,而且,用透明导电膜等的防止氧化的导电膜覆盖其最为突出的端面。
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公开(公告)号：CN1267395A
公开(公告)日：2000-09-20
申请号：CN98808360.4
申请日：1998-08-21
Applicant: 时至准钟表股份有限公司
IPC: H01L21/60
CPC classification number: H01L24/16 , H01L21/563 , H01L24/11 , H01L24/12 , H01L24/29 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/05001 , H01L2224/05022 , H01L2224/05166 , H01L2224/05184 , H01L2224/05572 , H01L2224/05666 , H01L2224/05684 , H01L2224/114 , H01L2224/116 , H01L2224/11822 , H01L2224/1329 , H01L2224/133 , H01L2224/16225 , H01L2224/16227 , H01L2224/29111 , H01L2224/2929 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/29444 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/81191 , H01L2224/81801 , H01L2224/83192 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0781 , H01L2924/13091 , H01L2924/15788 , H01L2924/1579 , H01L2924/00012 , H01L2924/00 , H01L2924/00014 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05671 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05171
Abstract: 在半导体芯片(1a)上边,在其多个输入输出端子用电极焊盘(2)上,形成具有开口部分(3a)的绝缘膜(3),在该绝缘膜(3)上边,分别设置多个连接电极(4),使得通过开口部分(3a)与各个电极焊盘(2)接触。在该各个连接电极(4)上边设置热可塑性的树脂(5),使该树脂(5)附着或含有多个(理想的是10个以上)的导电性粒子(9),构成半导体装置(1)。在把该半导体装置装配到已形成了布线图形的基板是之际,当把该半导体装置定位为使连接电极(4)与规定的布线相对,压接到已涂敷上绝缘性树脂的基板上进行加热时,连接电极(4)和布线,借助于夹持在其间的多个导电性粒子(9)而导通。
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