Patent search ap:("欧姆龙株式会社") AND inv:"佐藤宪章" Page 1

1.

发明授权
电子元件模块和电磁可读数据载体的制造方法失效

公开(公告)号：CN1270363C

公开(公告)日：2006-08-16

申请号：CN200310123787.2

申请日：2003-12-17

Applicant: 欧姆龙株式会社

Inventor： 川井若浩 , 佐藤宪章

IPC: H01L21/50 , G06K19/07 , G09F3/00 , G08B13/24 , G11B7/24

CPC classification number: H01L23/49855 , G06K19/07745 , G06K19/0775 , H01L21/563 , H01L24/81 , H01L24/83 , H01L2223/6677 , H01L2224/136 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/29388 , H01L2224/73204 , H01L2224/81191 , H01L2224/81205 , H01L2224/81395 , H01L2224/8183 , H01L2224/83102 , H01L2224/83192 , H01L2224/83194 , H01L2224/83851 , H01L2224/83862 , H01L2224/8388 , H01L2224/83885 , H01L2224/9211 , H01L2224/92125 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/15151 , H01L2924/15311 , H01L2924/1532 , H01L2924/19041 , H05K3/061 , H05K3/305 , H05K3/328 , H05K2201/0209 , H05K2201/0212 , H05K2201/10674 , H05K2201/10977 , H05K2203/0571 , H05K2203/1189 , H01L2224/81 , H01L2224/83 , H01L2924/05442 , H01L2924/0665 , H01L2224/0401

Abstract: 本发明涉及电子元件模块和电磁可读数据载体的制造方法。使用超声波将半导体载体芯片的引脚加热至高温，从上面按压到布线板上，这样就使半导体载体芯片的引脚穿透热塑性树脂膜和热塑性树脂膜，从而将引脚的顶端部分绑定到电极区上。其中的布线板包括：布线图，用于在所述的布线图上覆盖电极区并分布和包括有绝缘粒子的热固性树脂膜，以及覆盖所述的热固性树脂膜的热塑性树脂膜。

2.

发明公开
电子元件模块和电磁可读数据载体的制造方法失效

公开(公告)号：CN1521821A

公开(公告)日：2004-08-18

申请号：CN200310123787.2

申请日：2003-12-17

Applicant: 欧姆龙株式会社

Inventor： 川井若浩 , 佐藤宪章

IPC: H01L21/50 , G06K19/07 , G09F3/00 , G08B13/24 , G11B7/24

CPC classification number: H01L23/49855 , G06K19/07745 , G06K19/0775 , H01L21/563 , H01L24/81 , H01L24/83 , H01L2223/6677 , H01L2224/136 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/29388 , H01L2224/73204 , H01L2224/81191 , H01L2224/81205 , H01L2224/81395 , H01L2224/8183 , H01L2224/83102 , H01L2224/83192 , H01L2224/83194 , H01L2224/83851 , H01L2224/83862 , H01L2224/8388 , H01L2224/83885 , H01L2224/9211 , H01L2224/92125 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/15151 , H01L2924/15311 , H01L2924/1532 , H01L2924/19041 , H05K3/061 , H05K3/305 , H05K3/328 , H05K2201/0209 , H05K2201/0212 , H05K2201/10674 , H05K2201/10977 , H05K2203/0571 , H05K2203/1189 , H01L2224/81 , H01L2224/83 , H01L2924/05442 , H01L2924/0665 , H01L2224/0401

Abstract: 本发明涉及电子元件模块和电磁可读数据载体的制造方法。使用超声波将半导体载体芯片的引脚加热至高温，从上面按压到布线板上，这样就使半导体载体芯片的引脚穿透热塑性树脂膜和热塑性树脂膜，从而将引脚的顶端部分绑定到电极区上。其中的布线板包括：布线图，用于在所述的布线图上覆盖电极区并分布和包括有绝缘粒子的热固性树脂膜，以及覆盖所述的热固性树脂膜的热塑性树脂膜。

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