-
公开(公告)号:CN102150260A
公开(公告)日:2011-08-10
申请号:CN200980132004.2
申请日:2009-07-31
Applicant: 瑞萨电子株式会社
CPC classification number: H01L23/3121 , H01L21/561 , H01L23/3677 , H01L23/552 , H01L23/66 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/165 , H01L2221/68331 , H01L2224/32225 , H01L2224/32227 , H01L2224/45599 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/92 , H01L2224/97 , H01L2924/00014 , H01L2924/014 , H01L2924/12044 , H01L2924/14 , H01L2924/15313 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K1/0206 , H05K1/0218 , H05K3/284 , H05K2201/0715 , H05K2201/0919 , H05K2203/1131 , H05K2203/1316 , H01L2224/83 , H01L2224/85 , H01L2224/92247 , H01L2924/00012 , H01L2924/3512 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
Abstract: 本发明涉及一种同时实现电磁波屏蔽性和搭载电子部件时的加热工序中的可靠性的半导体器件。在半导体器件中,具有搭载在电路基板1主面上的高频率安装部件5、6,将安装部件5、6与电路基板1主面的布线图案4进行电连接,形成绝缘性树脂的封固体7使其密封安装部件5、6,将金属粒子涂布在封固体7的表面,将涂布后的金属粒子烧结,由此形成电磁波屏蔽层2,将电磁波屏蔽层2与电路基板1的接地图案3进行电连接。