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公开(公告)号：KR101239636B1
公开(公告)日：2013-03-11
申请号：KR1020110032913
申请日：2011-04-08
Applicant: 국방과학연구소
CPC classification number: H03H3/0072 , B81B2201/0271 , B81C1/00682 , G01C19/5783 , H03H9/02338 , H03H9/2457 , Y10T29/49117
Abstract: 본 발명은 MEMS 공진기, 이를 구비하는 센서 및 MEMS 공진기의 제조방법에 관한 것으로, 상기 MEMS 공진기는, 일면에서 리세스되는 리세스부를 구비하는 MEMS 공진기의 베이스 기판과, 상기 리세스부의 빈공간을 이용하여 진동하도록 상기 베이스 기판에 장착되고 적어도 일부가 상기 리세스부와 중첩되도록 배치되는 진동자, 및 상기 진동자의 적어도 일부를 지지하여 상기 MEMS 공진기의 고유주파수를 조정하도록 상기 진동자와 베이스 기판에 각각 연결되는 와이어를 포함한다. 이에 의하여 공진기의 고유주파수가 용이하게 조정될 수 있다.
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公开(公告)号：KR101280349B1
公开(公告)日：2013-07-01
申请号：KR1020120020757
申请日：2012-02-29
Applicant: 국방과학연구소
Abstract: PURPOSE: A microelectromechanical system (MEMS) resonator with high performance and a manufacturing method thereof are provided to manufacture the MEMS resonator of high performance by using mechanical properties of quartz while simplifying a complex structure by using silicon and quartz. CONSTITUTION: An MEMS resonator manufacturing method comprises the following steps: a step (S10) for forming a silicon resonator structure with a resonator boundary structure, which is separated from a resonator mass while a cavity is arranged between the resonator mass and the resonator boundary structure, on a silicon substrate; a step (S20) for bonding the silicon substrate, where the silicon resonator structure is formed, with a quartz substrate; a step (S30) of forming a beam-shaped elastic unit which connects a silicon resonator boundary structure and a silicon resonator mass across to the cavity by patterning the quartz substrate; and a step (S40) for performing a chemical mechanical polishing (CMP) process and an etching process for opening the cavity from the rear surface of the silicon substrate. [Reference numerals] (S10) Step of processing a silicon substrate; (S20) Step of bonding the silicon substrate and a quartz substrate; (S30) Step of processing the quartz substrate; (S40) Step of progressing additional processes
Abstract translation: 目的：提供一种具有高性能的微机电系统（MEMS）谐振器及其制造方法，以通过使用石英的机械性能来制造高性能的MEMS谐振器，同时通过使用硅和石英简化复杂结构。 构成：MEMS谐振器制造方法包括以下步骤：步骤（S10），用于形成具有共振器边界结构的硅谐振器结构，该谐振器边界结构与谐振器块分离，同时空腔布置在谐振器块与谐振器边界结构之间 ，在硅衬底上; 用于将形成硅谐振器结构的硅衬底与石英衬底接合的步骤（S20）; 形成通过图案化石英衬底而将硅谐振器边界结构和硅谐振器块连接到空腔的波束形弹性单元的步骤（S30）; 以及用于执行化学机械抛光（CMP）工艺的步骤（S40）和用于从硅衬底的后表面打开空腔的蚀刻工艺。 （附图标记）（S10）处理硅衬底的步骤; （S20）接合硅基板和石英基板的工序; （S30）处理石英基板的工序; （S40）进行附加处理的步骤
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公开(公告)号：KR1020120115013A
公开(公告)日：2012-10-17
申请号：KR1020110032913
申请日：2011-04-08
Applicant: 국방과학연구소
CPC classification number: H03H3/0072 , B81B2201/0271 , B81C1/00682 , G01C19/5783 , H03H9/02338 , H03H9/2457 , Y10T29/49117
Abstract: PURPOSE: An MEMS(Micro Electromechanical System) resonator, a sensor having the same, and a manufacturing method for the MEMS resonator are provided to restore a natural frequency of the MEMS resonator by electrically simply cutting a generated wire. CONSTITUTION: An MEMS resonator(200) comprises a base substrate, a vibrator(212), and a wire. The base substrate of the MEMS resonator includes a recessed recess portion(201a) on one side thereof. The vibrator vibrates using an empty space of the recess portion. The vibrator includes a part which is arranged to be overlapped with the recess portion on the base substrate. The wire is respectively connected to the vibrator and the base substrate to control a natural frequency of the MEMS resonator by supporting at least some part of the vibrator.
Abstract translation: 目的：提供一种MEMS（微机电系统）谐振器，具有该MEMS谐振器的传感器和用于MEMS谐振器的制造方法，以通过电简单地切割所产生的线来恢复MEMS谐振器的固有频率。 构成：MEMS谐振器（200）包括基底基板，振动器（212）和导线。 MEMS谐振器的基底包括在其一侧的凹陷凹部（201a）。 振动器使用凹部的空的空间振动。 振动器包括被布置成与基底基板上的凹部重叠的部分。 导线分别连接到振动器和基底基板，以通过支撑振动器的至少一部分来控制MEMS谐振器的固有频率。
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