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公开(公告)号：KR101391385B1
公开(公告)日：2014-05-07
申请号：KR1020120145601
申请日：2012-12-13
Applicant: 대한소결금속 주식회사
CPC classification number: C21D1/09 , B22F2003/248 , C21D9/0068 , C21D2211/008
Abstract: The present invention obtains a high degree of hardness on a heat treatment portion by forming a dense martensite structure through high energy density of laser and rapid cooling, improves reliability by controlling the temperature on the heat treatment portion, minimizes damage and deformation on a base material, and reduces heat treatment costs which may not require separate maintenance costs. Requirements are satisfied by irradiating a portion to be heat treated on the base material with laser for 0.5 to 5 seconds, wherein the requirements include heat treated depths of 3 to 5 mm, heated widths of 1.5 to 6 mm, and heat treated hardness of 650 mHv or more with respect to fine non-through holes, through holes, stepped non-through hole or stepped through hole having diameters of 10 mm or less and depths of 5mm or less formed on the base material. The laser has the output of 600 to 900W and is emitted on a portion on the upper side of the base material to be heat treated at the angle of 70 to 105°, and then the laser irradiated portion is naturally cooled to complete heat treatment.
Abstract translation: 本发明通过激光的高能量密度和快速冷却形成茂密的马氏体结构，在热处理部分获得高硬度，通过控制热处理部分的温度来提高可靠性，使基材上的损伤和变形最小化 ，并降低热处理成本，这可能不需要单独的维护成本。 通过用激光照射待热处理的部分0.5〜5秒来满足要求，其中要求包括热处理深度为3〜5mm，加热宽度为1.5〜6mm，热处理硬度为650 相对于在基材上形成的直径为10mm以下，深度为5mm以下的微细非贯通孔，通孔，阶梯状非贯通孔或阶梯状通孔，mHv以上。 激光器的输出功率为600〜900W，在基体材料的上侧的部分上以70〜105°的角度进行热处理，然后将激光照射部自然冷却，进行热处理。
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