-
公开(公告)号：KR1020100084031A
公开(公告)日：2010-07-23
申请号：KR1020090003421
申请日：2009-01-15
Applicant: 도레이첨단소재 주식회사
CPC classification number: C09J109/02 , C09J9/00 , C09J11/06 , C09J163/00 , H05K3/10
Abstract: PURPOSE: A thermosetting adhesive composition is provided to control the outflow in pressing, to obtain an adhesive film capable of improving heat resistance to correspond to the temperature of a lead-free soldering reflow furnace, and to have excellent workability and adhesive force. CONSTITUTION: A thermosetting adhesive composition used for a flexible printed circuit board comprises a thermoplastic resin, a thermosetting resin, a hardener, a polyfunctional acylate monomer. The polyfunctional acrylate monomer has divalent ~ hexavalent functional groups. The adhesive composition includes 50-100 parts by weight of the thermosetting resin, 0.01-10 parts by weight of the hardener, and 0.0001-5 parts by weight of the polyfunctional acrylate monomer based on 100.0 parts by weight of the thermoplastic resin.
Abstract translation: 目的：提供一种热固性粘合剂组合物来控制压制流出，获得能够根据无铅焊接回流炉的温度提高耐热性的粘合剂膜，并且具有优异的可加工性和粘合力。 构成：用于柔性印刷电路板的热固性粘合剂组合物包括热塑性树脂，热固性树脂，硬化剂，多官能酰化物单体。 多官能丙烯酸酯单体具有二价〜六价官能团。 基于100.0重量份的热塑性树脂，粘合剂组合物包含50-100重量份的热固性树脂，0.01-10重量份的硬化剂和0.0001-5重量份的多官能丙烯酸酯单体。
-
公开(公告)号：KR1020100092608A
公开(公告)日：2010-08-23
申请号：KR1020090011807
申请日：2009-02-13
Applicant: 도레이첨단소재 주식회사
IPC: C09J125/02 , C09J7/02
CPC classification number: C09J125/02 , C09J7/22 , C09J7/35 , C09J163/00 , C09J2203/326
Abstract: PURPOSE: An adhesive composition for a halogen-free coverlay film, and the coverlay film including thereof are provided to offer the flowage of the coverlay film by miniaturizing a wiring pattern by the densification of an electronic material. CONSTITUTION: An adhesive composition for a halogen-free coverlay film contains the following: nitrile butadiene rubber with 20~40wt% of acrylonitrile and 3~15wt% of carboxyl group; a non-halogen poly functional solid-phase epoxy resin and a liquid epoxy resin; a hardener; a curing accelerator; a non-halogen phosphorous-based flame retardant; and an inorganic particle of aluminum hydroxide, magnesium hydroxide, zinc oxide, magnesium oxide, antimony trioxide, or silica.
Abstract translation: 目的：提供一种用于无卤覆盖膜的粘合剂组合物及其包括的覆盖膜，以通过电子材料的致密化使布线图案小型化来提供覆盖膜的流动。 构成：无卤覆膜的粘合剂组合物含有：丙烯腈20〜40重量％，羧基3〜15重量％的丁腈橡胶; 非卤素多官能固相环氧树脂和液体环氧树脂; 硬化剂 固化促进剂; 无卤磷系阻燃剂; 和氢氧化铝，氢氧化镁，氧化锌，氧化镁，三氧化锑或二氧化硅的无机粒子。
-
公开(公告)号：KR1020090078051A
公开(公告)日：2009-07-17
申请号：KR1020080003819
申请日：2008-01-14
Applicant: 도레이첨단소재 주식회사
IPC: C09J163/00 , C09J113/00 , C09J1/00
CPC classification number: C09J11/06 , C08K5/5313 , C09J9/00 , C09J11/04 , C09J109/00 , C09J163/00 , C09J2203/30 , C09J2205/102 , C09J2479/086
Abstract: An adhesive composition for a halogen-free coverlay film is provided to ensure excellent fire retardant characteristic, adhesive force, heat resistance, bleed out and fluidity required for the cover lay film. An adhesive composition for a halogen-free coverlay film(1) comprises a nitrile butadiene rubber which contains a carboxyl group, has molecular weight of 10,000~200,000 and acrylonitrile content of 20~40 weight%; a non-halogen polyfunctional epoxy resin which has two or more epoxy groups per 1 molecule and molecular weight of 200 ~ 1,000 or less; a hardener; a curing accelerator; a non-halogen phosphorous-based flame retardant which has a phosphorous content of 10 mass % or greater and a thermal decomposition temperature of 300°C or more; and inorganic particles such as aluminium hydroxide, magnesium hydroxide, magnesium oxide, zinc oxide, antimony trioxide or silica.
Abstract translation: 提供了一种无卤覆膜的粘合剂组合物，以确保覆盖膜所需的优异的阻燃特性，粘合力，耐热性，渗流性和流动性。 无卤覆层膜（1）的粘合剂组合物包含含有羧基的丁腈橡胶，分子量为10,000〜200,000，丙烯腈含量为20〜40重量％。 每1分子具有2个以上的环氧基，分子量为200〜1000以下的无卤多官能环氧树脂; 硬化剂 固化促进剂; 磷含量为10质量％以上且热分解温度为300℃以上的无卤磷系阻燃剂， 和无机颗粒如氢氧化铝，氢氧化镁，氧化镁，氧化锌，三氧化锑或二氧化硅。
-
公开(公告)号：KR101074858B1
公开(公告)日：2011-10-19
申请号：KR1020090011807
申请日：2009-02-13
Applicant: 도레이첨단소재 주식회사
IPC: C09J125/02 , C09J7/02
Abstract: 본발명은연성인쇄회로기판의회로보호용커버레이필름의제조에사용되는할로겐프리커버레이필름용접착제조성물및 이를구비하는커버레이필름에관한것으로서, 보다상세하게는커버레이필름에서요구되는난연성, 접착력, 내열성, 및흐름성등의특성을모두충족하는할로겐프리커버레이필름용접착제조성물및 이를구비하는커버레이필름에관한것이다. 이를위해본 발명에따른할로겐프리커버레이필름용접착제조성물은 (1) 카르복실기를포함하고, 중량평균분자량이 10,000 ~ 200,000 사이이며, 아크릴로니트릴함유량이 20 ~ 40 중량%이고카르복실기함유율이 3~15 중량%인니트릴부타디엔고무(NBR), (2) 1분자당 2개이상의에폭시기를가지고, EEW(g/eq)가 100 ~ 1,000 인비할로겐다관능성고상에폭시수지와액상에폭시수지, (3) 경화제, (4) 경화촉진제, (5) 비할로겐인 계난연제및 (6) 수산화알루미늄, 수산화마그네슘, 산화아연, 산화마그네슘, 삼산화안티몬또는실리카등의무기입자를포함하는것을특징으로한다.
-
Patent Agency Ranking
公开(公告)号：KR1020110087760A
公开(公告)日：2011-08-03
申请号：KR1020100007336
申请日：2010-01-27
Applicant: 도레이첨단소재 주식회사
IPC: C09J175/02 , C09J163/00 , C09J175/00 , H05K1/02
CPC classification number: C09J175/02 , C09J9/00 , C09J163/00 , H05K1/02
Abstract: PURPOSE: A thermosetting adhesive composition for a flexible circuit board is provided to ensure strong adhesive force and high heat resistance even if the composition is heated under low pressure for a short time. CONSTITUTION: A thermosetting adhesive composition for a flexible circuit board comprises a silicone-modified epoxy resin and a silicone-modified polyurethane urea resin having the acid value of 3-30 mg KOH/g and the Si content of 500~12,000 ppm wherein the silicone-modified polyurethane urea resin is obtained by reacting an urethane polymer having an isocyanate terminal with a silicone-modified diamine copolymer. The silicone-modified epoxy resin is the copolymer of diamine excluding a silicon group and silicone-modified diamine of chemical formula 1.
Abstract translation: 目的：提供一种用于柔性电路板的热固性粘合剂组合物，以便即使组合物在低压下短时间加热，也能确保强粘合力和高耐热性。 构成：用于柔性电路板的热固性粘合剂组合物包括硅氧烷改性的环氧树脂和酸值为3-30mg KOH / g和Si含量为500〜12,000ppm的硅氧烷改性聚氨酯脲树脂，其中硅氧烷 通过使具有异氰酸酯末端的氨基甲酸酯聚合物与硅氧烷改性的二胺共聚物反应获得改性的聚氨酯脲树脂。 硅氧烷改性环氧树脂是除了硅基以外的二胺的共聚物和化学式1的硅氧烷改性的二胺。
-
公开(公告)号：KR1020090001039A
公开(公告)日：2009-01-08
申请号：KR1020070065102
申请日：2007-06-29
Applicant: 도레이첨단소재 주식회사
Abstract: A shielding filter for plasma display panel is provided to reduce its thickness by simplifying a shielding filter structure and efficiently shield electromagnetic waves, near infrared rays and neon lights. A filter formed in a front side of a PDP panel blocks electromagnetic waves, near infrared rays and neon light which are income from the PDP panel. The filter comprises an electromagnetic wave shielding layer and reflection barrier layer(252). The electromagnetic wave shielding layer is made of a metal mesh(242) and a bonding layer(261). Conductive material is formed in a mesh type so that the metal mesh blocks the electromagnetic wave. The bonding layer has a blocking function for blocking near infrared rays and neon light within the bonding layer for bonding the metal mesh and transparent supporting body(241). The reflection barrier layer is coated in one-side of the electromagnetic wave shielding layer, and blocks reflection of light applied from the outside. An adhesion layer(260) is formed in the other side of the electromagnetic wave shielding layer, and facilitates adhesion with the PDP panel.
Abstract translation: 提供了一种用于等离子体显示面板的屏蔽滤波器，通过简化屏蔽滤波器结构并有效地屏蔽电磁波，近红外线和霓虹灯来减小其厚度。 形成在PDP面板的前侧的过滤器阻挡从PDP面板收入的电磁波，近红外线和氖光。 滤波器包括电磁波屏蔽层和反射阻挡层（252）。 电磁波屏蔽层由金属网（242）和接合层（261）制成。 导电材料以网状形成，使得金属网阻挡电磁波。 接合层具有用于阻挡接合层内的近红外线和氖光的粘合功能，用于粘合金属网和透明支撑体（241）。 反射阻挡层被涂覆在电磁波屏蔽层的一侧，并且阻止从外部施加的光的反射。 在电磁波屏蔽层的另一侧形成粘合层（260），便于与PDP面板的粘合。
-
公开(公告)号：KR101595047B1
公开(公告)日：2016-02-18
申请号：KR1020100007336
申请日：2010-01-27
Applicant: 도레이첨단소재 주식회사
IPC: C09J175/02 , C09J163/00 , C09J175/00 , H05K1/02
Abstract: 본발명은연성회로기판용열경화성접착제조성물에관한것으로서, 보다상세하게는낮은압력하에서단시간동안가열하여도강한접착력과높은내열성을갖는연성회로기판용열경화성접착제조성물에관한것이다. 이를위해본 발명에따른연성회로기판용열경화성접착제조성물은이소시아네이트말단기를가진우레탄고분자와실리콘변성디아민공중합물로서, 실리콘기를가지지않는디아민과하기화학식 1의실리콘변성디아민의공중합물인실리콘변성디아민공중합물의반응에의해얻어진산가가 3-30mg KOH/g이고, Si함량이 500~12,000ppm인실리콘변성폴리우레탄우레아수지및 실리콘변성에폭시화합물을포함하되, [화학식 1]여기서, R, R는각각독립적으로페닐렌기또는탄소수 1~5의알킬렌기(다만, n이 1일때는탄소수 4~5의알킬렌기)이고, R, R, R, R는각각독립적으로탄소수 1~5의알킬기, 탄소수 1~5의알콕시기, 페닐기또는페녹시기이며, n은 1~50의정수인것을특징으로한다.
-
公开(公告)号：KR1020120000196A
公开(公告)日：2012-01-02
申请号：KR1020100060401
申请日：2010-06-25
Applicant: 도레이첨단소재 주식회사
IPC: C09J11/06 , C09J7/02 , C09J201/00 , B32B7/12
CPC classification number: C09J11/06 , B32B7/12 , C09J7/22 , C09J7/35 , C09J201/005 , C09J2201/61 , C09J2203/30 , C09J2205/102
Abstract: PURPOSE: A thermo-setting adhesive film is provided to have excellent adhesive force and heat resistance at high temperature and high humidity environments, thereby increasing the reliability and the yield of product. CONSTITUTION: A thermo-setting adhesive film comprises a release film, and a thermoplastic resin, a thermosetting resin, an amine-based curing agent and a polyfunctional polythiol hardener, as an adhesive layer coated on at least one side of the release film. The adhesive composition comprises 50-200 parts by weight thermosetting resin, 1-15 parts by weight amine-based curing agent and 0.1-5 parts by weight polyfunctional polythiol hardener on the basis of 100.0 parts by weight thermoplastic resin.
Abstract translation: 目的：提供一种热固性粘合膜，以在高温高湿环境下具有优异的粘合力和耐热性，从而提高产品的可靠性和产率。 构成：热固性粘合剂膜包括剥离膜，热塑性树脂，热固性树脂，胺基固化剂和多官能多硫醇硬化剂，作为涂覆在剥离膜的至少一面上的粘合剂层。 基于100.0重量份热塑性树脂，粘合剂组合物包含50-200重量份热固性树脂，1-15重量份胺基固化剂和0.1-5重量份多官能多硫醇硬化剂。
-
公开(公告)号：KR1020110015874A
公开(公告)日：2011-02-17
申请号：KR1020090073310
申请日：2009-08-10
Applicant: 도레이첨단소재 주식회사
CPC classification number: C09J11/04 , C08K3/08 , C08K2003/0812 , C08K2201/005 , C09J9/00
Abstract: PURPOSE: A thermosetting adhesive composition is provided to ensure heat resistance corresponding to Pb free soldering and also high heat resistance even in the high temperature and high humidity environment, thereby enhancing the reliability and yield of products. CONSTITUTION: A thermosetting adhesive composition comprises thermoplastic resins, thermosetting resins, hardeners and inorganic aluminum particles. The inorganic aluminum particle has the size of 0.1~10 micron. The thermosetting adhesive composition includes, 100 parts by weight of the thermoplastic resin, 50~300 parts by weight of thermosetting resin, 1~20 parts by weight of hardener, and 0.1~20 parts by weight of inorganic aluminum particles.
Abstract translation: 目的：提供热固性粘合剂组合物，以确保相应于无铅焊接的耐热性，并且即使在高温高湿环境下也具有高耐热性，从而提高产品的可靠性和产率。 构成：热固性粘合剂组合物包含热塑性树脂，热固性树脂，硬化剂和无机铝颗粒。 无机铝颗粒的大小为0.1〜10微米。 热固性粘合剂组合物包括100重量份的热塑性树脂，50〜300重量份的热固性树脂，1〜20重量份的硬化剂和0.1〜20重量份的无机铝颗粒。
-
-
-
-
-
-
-
-
Search Results
9
records
(took 0.022 seconds)
