公开(公告)号：KR1020110045953A

公开(公告)日：2011-05-04

申请号：KR1020090102725

申请日：2009-10-28

Applicant: 도레이첨단소재 주식회사

Inventor： 김영섭 ,  전은욱 ,  박종용 ,  김정모

IPC: H05K3/18 ,  H05K1/05

Abstract: PURPOSE: A flexible cupper laminated film for a flexible circuit board and a manufacturing method the same are provided to minimize a problem due to a dimensional change by minimizing the dimensional change in a thermal process. CONSTITUTION: In a flexible cupper laminated film for a flexible circuit board and a manufacturing method the same, a polymer film is surface-treated by using polyimide. A conductive layer is deposited in the surface of the polymer film. The conductive layer is comprised of a tie layer and a metal seed layer. A plating layer is formed on the polymer film. A plating liquid contains an additive and a corrective substance. The polyimide has a specific coefficient of thermal expansion.

Abstract translation: 目的：提供一种用于柔性电路板的柔性铜层压膜及其制造方法，以通过最小化热处理中的尺寸变化来最小化由尺寸变化引起的问题。 构成：在柔性电路板用柔性铜层压膜及其制造方法中，使用聚酰亚胺对聚合物膜进行表面处理。 导电层沉积在聚合物膜的表面中。 导电层由连接层和金属种子层组成。 在聚合物膜上形成镀层。 电镀液含有添加剂和矫正剂。 聚酰亚胺具有特定的热膨胀系数。