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公开(公告)号：KR1020150045026A
公开(公告)日：2015-04-28
申请号：KR1020130123914
申请日：2013-10-17
Applicant: 도레이첨단소재 주식회사
IPC: C23F1/16
Abstract: 본발명은도금장치의전도체로사용되는도금전극에생성된구리를용이하게박리할수 있는구리박리용용액, 그제조방법및 이를사용하여박리조 내에외부공기를유입하여표면활성화를통하여전극의구리를박리하는방법에관한것으로, 상기한본 발명의도금전극의구리박리용용액은도금전극의구리박리용용액으로서, 상기용액은황산, 염산및 순수(pure water)를일정비율로혼합하여얻어진것임을특징으로한다. 상기와같이구성되는본 발명의도금전극의구리박리용용액및 이를이용한구리박리방법은황산과염산의농도를특정한조건으로구리박리용용액을제조하고, 그리고이를사용하여외부공기를유입하여도금전극의구리를박리하는방법을제공함으로써, 도금전극표면에흡착된구리를보다효과적으로용이하게박리시킬수 있게하고, 또한부가하여종래에주로해외수입에의존하여사용되었던고가의구리박리액보다우수한효과를나타내는구리박리용용액을보다저렴한비용으로그리고적기에조달할수 있게하므로, 종래의문제점을해결하였다.
Abstract translation: 本发明涉及一种铜剥离组合物，其可以容易地剥离在用作电镀装置的导体的电镀电极上产生的铜，其方法，以及通过引入外部空气来激活表面的方法来剥离电极的铜 使用上述方法进入剥离组。 本发明的电镀电极的铜剥离组合物由于硫酸，盐酸和纯水以固定比率混合而产生。 本发明的电镀用铜剥离组合物及其制造方法，提供了通过硫酸和盐酸的一定浓度条件制造铜剥离组合物的电镀铜电极的方法， 通过使用它，通过引入外部空气来剥离电镀电极的铜。 因此，本发明能够有效且容易地剥离吸附在电镀电极表面的铜。 此外，本发明通过使得具有比依赖于过去进口的昂贵的铜剥离组合物具有更好的效果的铜剥离组合物能够按时和低成本运输来解决现有问题。
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公开(公告)号：KR1020120136521A
公开(公告)日：2012-12-20
申请号：KR1020110055504
申请日：2011-06-09
Applicant: 도레이첨단소재 주식회사
IPC: G06F3/041
CPC classification number: G06F3/0412 , G06F3/045 , G06F2203/04103
Abstract: PURPOSE: An electrode for a tactile sensor and manufacturing method thereof are provided to offer flexibility by obtaining etching property in an etching process. CONSTITUTION: A surface is processed by using polyimide which is a base film through a vacuum apparatus. A copper layer for plating copper with an Ni-Cr layer and a conductive layer which execute a role of a resistance pattern is gradually laminated on a surface of a polyimide film by using a PVD(physical vapor deposition method). Copper which utilizes electrolyte plating is laminated on the polyimide film laminated on the conductive layer.
Abstract translation: 目的：提供一种用于触觉传感器的电极及其制造方法，以通过在蚀刻工艺中获得蚀刻性能来提供灵活性。 构成：通过使用通过真空装置的基膜的聚酰亚胺处理表面。 通过使用PVD（物理气相沉积法）在聚酰亚胺膜的表面上逐渐层压用于镀Ni-Cr层的铜层和执行电阻图案的导电层。 使用电解电镀的铜层压在层叠在导电层上的聚酰亚胺膜上。
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公开(公告)号：KR1020120035611A
公开(公告)日：2012-04-16
申请号：KR1020100097244
申请日：2010-10-06
Applicant: 도레이첨단소재 주식회사
Abstract: PURPOSE: A method for manufacturing a laminate structure of a printed circuit board and the laminate structure manufactured by the same are provided to prevent a lead crack due to vibration and bending by forming a thin polyimide film with a thickness of 25 um used as a base film. CONSTITUTION: Polyimide is changed to a hydrophilic surface by using a vacuum device. Cu is successively deposited on the surface of a polyimide film with the hydrophilic surface. A tie layer is formed to improve adhesion between polyimide and metal. A Cu layer is formed by electroplating the polyimide with metal.
Abstract translation: 目的：制造印刷电路板和由其制造的层压结构体的层压结构体的制造方法，通过形成厚度为25μm的薄的聚酰亚胺膜作为基底来防止由于振动和弯曲引起的引线裂纹 电影。 构成：使用真空装置将聚酰亚胺改为亲水性表面。 Cu依次沉积在具有亲水表面的聚酰亚胺膜的表面上。 形成粘结层以改善聚酰亚胺和金属之间的粘附。 通过用金属电镀聚酰亚胺形成Cu层。
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公开(公告)号：KR1020130016851A
公开(公告)日：2013-02-19
申请号：KR1020110079014
申请日：2011-08-09
Applicant: 도레이첨단소재 주식회사
Abstract: PURPOSE: A flexible copper foil laminated film and a manufacturing method thereof capable of an etching ability modulation are provided to secure a fine and stable pattern by controlling a form of pattern according to an affinity to etching inhibitor of the etchant. CONSTITUTION: A polyimide film is plasma processed under vacuum condition. The plasma processing uses Ar, O2 and N2 gas as input gas. The polyimide film's adhesive strength of the metal and the affinity to etching the inhibitor are controlled. A tie layer and a seed layer are successively vacuum evaporated on the polyimide film using a sputtering method. An additive and a correcting agent are electrodeposited to the polyimide film.
Abstract translation: 目的：提供一种柔性铜箔层叠膜及其能够进行蚀刻能力调制的制造方法，以通过根据与蚀刻剂的蚀刻抑制剂的亲和性控制图案的形式来确保细微且稳定的图案。 构成：聚酰亚胺膜在真空条件下进行等离子体处理。 等离子体处理使用Ar，O2和N2气体作为输入气体。 控制聚酰亚胺膜对金属的粘合强度和蚀刻抑制剂的亲和力。 使用溅射法在聚酰亚胺膜上连续地真空蒸发连接层和籽晶层。 将添加剂和校正剂电沉积到聚酰亚胺膜上。
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公开(公告)号：KR1020110045952A
公开(公告)日：2011-05-04
申请号：KR1020090102724
申请日：2009-10-28
Applicant: 도레이첨단소재 주식회사
Abstract: PURPOSE: A laminated structure for a flexible circuit board having an improved elasticity and a manufacturing method the same are provided to prevent a crack by having excellent elasticity corresponding to the short circuit of a detour wire. CONSTITUTION: In a laminated structure for a flexible circuit board having an improved elasticity and a manufacturing method the same, a polymer film is surface-treated. A conductive layer is deposited on the surface of the polymer film. The conductive layer is comprised of a tie layer and a metal seed layer. A plating layer(4) is formed by using a plating liquid on the polymer film. The tie layer is formed by using an alloy of Ni-Cr.
Abstract translation: 目的：提供一种具有改进的弹性的柔性电路板的叠层结构及其制造方法，以通过具有与迂回线短路相对应的优异弹性来防止裂纹。 构成：在具有改善弹性的柔性电路板的层压结构及其制造方法中，对聚合物膜进行表面处理。 导电层沉积在聚合物膜的表面上。 导电层由连接层和金属种子层组成。 通过在聚合物膜上使用电镀液形成镀层（4）。 通过使用Ni-Cr合金形成粘结层。
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Patent Agency Ranking
公开(公告)号：KR1020130023519A
公开(公告)日：2013-03-08
申请号：KR1020110086337
申请日：2011-08-29
Applicant: 도레이첨단소재 주식회사
Abstract: PURPOSE: A semi additive flexible copper foil laminated film using the size of a plating particle and the etching ability and a manufacturing method thereof are provided to properly control the size of a plating particle to prevent the undercut caused by the high speed of etching. CONSTITUTION: A polyimide film is treated by plasma. The surface cleaning and the surface roughness are improved. Ni-Cr of a tie layer carrying out a role as a conductor layer and Cu on a seed layer are deposited through a sputtering method of the PVD(physical vapor deposition) method. The Cu layer is plated in the copper sulfate solution by the use of the electrolytic plating method. Cu is electrically plated through several steps based on the is the electric current density.
Abstract translation: 目的：提供使用电镀粒子的尺寸和蚀刻能力的半添加性柔性铜箔层叠膜及其制造方法，以适当地控制电镀粒子的尺寸，以防止由于高速蚀刻引起的底切。 构成：通过等离子体处理聚酰亚胺膜。 表面清洁和表面粗糙度得到改善。 通过PVD（物理气相沉积）方法的溅射法沉积作为导体层的作用的连接层的Ni-Cr和种子层上的Cu。 通过使用电解电镀法将Cu层镀在硫酸铜溶液中。 基于电流密度，Cu通过几个步骤电镀。
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公开(公告)号：KR1020130001923A
公开(公告)日：2013-01-07
申请号：KR1020110062850
申请日：2011-06-28
Applicant: 도레이첨단소재 주식회사
Abstract: PURPOSE: A flexible copper clad laminate film for semi-additive and a method for preparing the same are provided to remove a space for generating migration. CONSTITUTION: A polyimide film is treated with plasma in a vacuum condition. The adhesive force between a polyimide film and a metal film and a polyimide film and a potting device is guaranteed through the improvement of surface chemical activity, surface cleaning, and roughness. A tie layer and a seed layer are successively evaporated on the non-conductive polyimide film surface. A polyimide film is deposited while maintaining the concentration of an anteed reagent and an additive.
Abstract translation: 目的：提供一种用于半添加剂的柔性覆铜层压膜及其制备方法，以去除用于产生迁移的空间。 构成：在真空条件下用等离子体处理聚酰亚胺膜。 通过提高表面化学活性，表面清洁度和粗糙度，可以保证聚酰亚胺膜与金属膜，聚酰亚胺膜和灌封装置之间的粘合力。 在非导电聚酰亚胺膜表面上依次蒸发连接层和种子层。 在保持浓度的前体试剂和添加剂的同时沉积聚酰亚胺膜。
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公开(公告)号：KR1020120083032A
公开(公告)日：2012-07-25
申请号：KR1020110004456
申请日：2011-01-17
Applicant: 도레이첨단소재 주식회사
Abstract: PURPOSE: A flexible copper clad laminate for a semi-additive and a producing method thereof are provided to prevent the generation of sunken portions on a pattern when copper plating. CONSTITUTION: A producing method of a flexible copper clad laminate for a semi-additive comprises the following steps: processing the surface of polyimide using active gas of oxygen and nitrogen; vacuum-evaporating a copper seed layer and tie layer Ni-Cr on the surface of the polyimide as a conductive layer using a DC magnetron sputtering method; and applying a plating solution containing a copper sulfate solution and a carrier on the polyimide with the copper conductive layer, to obtain copper using an electroplating method. The plating solution contains chlorine in the concentration of 1-60mg/L, and a brighter in the concentration of 5-17mg/L.
Abstract translation: 目的：提供一种用于半添加剂的柔性覆铜层压板及其制造方法，以防止在镀铜时在图案上产生凹陷部分。 构成：用于半添加剂的柔性覆铜层压板的制造方法包括以下步骤：使用氧和氮的活性气体处理聚酰亚胺的表面; 使用直流磁控溅射法在聚酰亚胺的表面上真空蒸发铜籽晶层和粘结层Ni-Cr作为导电层; 并将含有硫酸铜溶液和载体的电镀液与铜导电层一起涂覆在聚酰亚胺上，使用电镀法得到铜。 电镀溶液含有浓度为1-60mg / L的氯，浓度为5-17mg / L时更亮。
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公开(公告)号：KR1020120053195A
公开(公告)日：2012-05-25
申请号：KR1020100114341
申请日：2010-11-17
Applicant: 도레이첨단소재 주식회사
Abstract: PURPOSE: A copper foil laminated structure for a flexible circuit board having improved heat resistant adhesive strength and a manufacturing method thereof are provided to prevent a copper oxide film from being formed on a polyimide interface corresponding to a base film by forming a specific buffer layer between a tie layer and a seed layer. CONSTITUTION: A polyimide film is used as a base film(1). An Ni-Cr(Nickel Chromium) alloy layer corresponding to a tie layer(2), an ITO layer corresponding to a buffer layer(3), and a seed layer(4) which sputters copper on a conductive layer, are laminated on the polyimide film. A copper plated layer(5) is laminated since electroplating is used on a laminated structure. Polyimide corresponding to the base film is surface-treated by RF plasma for improving an adhesive force in vacuum.
Abstract translation: 目的：提供一种具有改进的耐热粘合强度的柔性电路板的铜箔叠层结构及其制造方法，以防止在对应于基膜的聚酰亚胺界面上形成氧化铜膜， 连结层和种子层。 构成：使用聚酰亚胺膜作为基膜（1）。 对应于粘结层（2）的Ni-Cr（镍铬）合金层，对应于缓冲层（3）的ITO层和在导电层上喷铜的种子层（4）层压在 聚酰亚胺薄膜。 层叠铜电镀层（5），因为电镀用于层叠结构。 对应于基膜的聚酰亚胺通过RF等离子体进行表面处理，以提高真空中的粘合力。
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公开(公告)号：KR1020130020242A
公开(公告)日：2013-02-27
申请号：KR1020110082749
申请日：2011-08-19
Applicant: 도레이첨단소재 주식회사
CPC classification number: C08J5/18 , B29B13/023 , B29D7/01 , C08J3/00 , C08L79/08
Abstract: PURPOSE: A drying method of a polyimide film is provided to reduce the generation of unnecessary compounds and oxides in a sputtering process and to provide a polyimide film with improved adhesion and insulation. CONSTITUTION: A drying method of a polyimide film comprises a step of vacuum and dry treating the polyimide film for 40 hours or more in a vacuum tank(1) of 10^(-4) - 10^(-2) torr to manufacture a COF(Chip On Film) with adhesion and insulation. The polyimide film is winded around a core in a roll state and is dried by being fixed by a supporting plate, which is connectable to a core, to prevent the contact to the inner side of the vacuum tank.
Abstract translation: 目的：提供一种聚酰亚胺薄膜的干燥方法，以减少在溅射过程中不需要的化合物和氧化物的产生，并提供具有改善的粘附性和绝缘性的聚酰亚胺薄膜。 构成：聚酰亚胺膜的干燥方法包括在10 ^（ - 4）-10 ^（ - 2）托的真空槽（1）中真空干燥处理聚酰亚胺膜40小时以上的步骤，制造 COF（贴片胶片）具有附着力和绝缘性。 聚酰亚胺薄膜以卷状卷绕在芯上，并通过可连接到芯的支撑板固定而干燥，以防止与真空罐的内侧接触。
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