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    세미-애디티브용 연성 구리 박막 적층 필름 및 그 제조방법
    5.
    发明公开
    세미-애디티브용 연성 구리 박막 적층 필름 및 그 제조방법 审中-实审
    用于半自动添加剂的柔性铜箔层压膜及其制备方法

    公开(公告)号：KR1020130001923A

    公开(公告)日：2013-01-07

    申请号：KR1020110062850

    申请日：2011-06-28

    Applicant: 도레이첨단소재 주식회사

    Inventor： 전해상 ,  김영섭 ,  전은욱 ,  박종용 ,  한종헌

    IPC: H05K1/02 ,  H05K3/46 ,  B32B27/34

    Abstract: PURPOSE: A flexible copper clad laminate film for semi-additive and a method for preparing the same are provided to remove a space for generating migration. CONSTITUTION: A polyimide film is treated with plasma in a vacuum condition. The adhesive force between a polyimide film and a metal film and a polyimide film and a potting device is guaranteed through the improvement of surface chemical activity, surface cleaning, and roughness. A tie layer and a seed layer are successively evaporated on the non-conductive polyimide film surface. A polyimide film is deposited while maintaining the concentration of an anteed reagent and an additive.

    Abstract translation: 目的：提供一种用于半添加剂的柔性覆铜层压膜及其制备方法，以去除用于产生迁移的空间。 构成：在真空条件下用等离子体处理聚酰亚胺膜。 通过提高表面化学活性，表面清洁度和粗糙度，可以保证聚酰亚胺膜与金属膜，聚酰亚胺膜和灌封装置之间的粘合力。 在非导电聚酰亚胺膜表面上依次蒸发连接层和种子层。 在保持浓度的前体试剂和添加剂的同时沉积聚酰亚胺膜。

    내열접착력을 개선한 연성회로기판용 동박 적층 구조체 및 그의 제조방법
    6.
    发明公开
    내열접착력을 개선한 연성회로기판용 동박 적층 구조체 및 그의 제조방법 无效
    具有改进耐热性的柔性电路板的层压结构粘合强度及其制造方法

    公开(公告)号：KR1020120053195A

    公开(公告)日：2012-05-25

    申请号：KR1020100114341

    申请日：2010-11-17

    Applicant: 도레이첨단소재 주식회사

    Inventor： 전은욱 ,  김영섭 ,  박종용

    IPC: H05K1/03 ,  B32B15/08 ,  H05K3/18

    Abstract: PURPOSE: A copper foil laminated structure for a flexible circuit board having improved heat resistant adhesive strength and a manufacturing method thereof are provided to prevent a copper oxide film from being formed on a polyimide interface corresponding to a base film by forming a specific buffer layer between a tie layer and a seed layer. CONSTITUTION: A polyimide film is used as a base film(1). An Ni-Cr(Nickel Chromium) alloy layer corresponding to a tie layer(2), an ITO layer corresponding to a buffer layer(3), and a seed layer(4) which sputters copper on a conductive layer, are laminated on the polyimide film. A copper plated layer(5) is laminated since electroplating is used on a laminated structure. Polyimide corresponding to the base film is surface-treated by RF plasma for improving an adhesive force in vacuum.

    Abstract translation: 目的：提供一种具有改进的耐热粘合强度的柔性电路板的铜箔叠层结构及其制造方法，以防止在对应于基膜的聚酰亚胺界面上形成氧化铜膜， 连结层和种子层。 构成：使用聚酰亚胺膜作为基膜（1）。 对应于粘结层（2）的Ni-Cr（镍铬）合金层，对应于缓冲层（3）的ITO层和在导电层上喷铜的种子层（4）层压在 聚酰亚胺薄膜。 层叠铜电镀层（5），因为电镀用于层叠结构。 对应于基膜的聚酰亚胺通过RF等离子体进行表面处理，以提高真空中的粘合力。

    표면조도의 하향을 통한 가스차단성이 우수한 베리어 필름의 제조방법
    7.
    发明授权
    표면조도의 하향을 통한 가스차단성이 우수한 베리어 필름의 제조방법 有权
    通过向下的表面粗糙度制造阻气性优异的阻隔膜的制造方法

    公开(公告)号：KR101793639B1

    公开(公告)日：2017-11-03

    申请号：KR1020160074467

    申请日：2016-06-15

    Applicant: 도레이첨단소재 주식회사

    Inventor： 김종학 ,  박종용 ,  김병재 ,  류효곤 ,  김영섭

    IPC: C08J7/04 ,  C23C14/02 ,  C23C14/08 ,  C23C14/34 ,  C08J5/18 ,  C08L67/00 ,  C08J7/12

    CPC classification number: C08J7/045 ,  C08J5/18 ,  C08J7/123 ,  C08L67/00 ,  C23C14/022 ,  C23C14/08 ,  C23C14/34

    Abstract: 본발명은표면조도의하향을통한가스차단성이우수한베리어필름의제조방법에관한것이다. 본발명의제조방법은프라이머층이코팅된기재필름을열처리후 플라즈마처리하여기재필름의표면을저조도화하는제1공정및 상기플라즈마처리된기재필름상에물리기상증착법에무기산화층을증착하는제2공정으로수행하는것으로서, 베리어필름을제조하기에적합하지않은표면조도를가진기재필름을표면조도하향이가능한플라즈마처리공정에의해, 기재필름의표면조도를낮추기위한추가공정을줄여제조원가를낮추고, 제조수율을향상시키며특히, 표면조도의하향을통해무기성막을조밀하게하여가스차단성을개선할수 있다.

    Abstract translation: 本发明涉及一种通过向下的表面粗糙度制造阻气性优异的阻挡膜的方法。 第二沉积在底涂层上的物理气相沉积法的无机层，低光屏幕的第一步骤退火到基膜的表面和等离子体处理涂覆的基膜后的成本到基膜的等离子体处理本发明的制造方法 以执行的过程中，通过具有表面粗糙度是不产生的阻挡膜的表面粗糙度下降等离子体处理过程成为可能，减少降低了基膜的表面粗糙度，以降低生产成本的附加步骤适当hagie基膜，成品率 特别是通过向下的表面粗糙度使无机膜致密化，可以提高气体阻隔性。

    구리패턴 크랙 발생을 개선한 연성회로기판 적층 구조체의 제조방법 및 이 방법에 의해 제조된 적층 구조체
    8.
    发明公开
    구리패턴 크랙 발생을 개선한 연성회로기판 적층 구조체의 제조방법 및 이 방법에 의해 제조된 적층 구조체 无效
    柔性电路板的层压结构改进了裂纹开发弹性和制造方法

    公开(公告)号：KR1020110061825A

    公开(公告)日：2011-06-10

    申请号：KR1020090118337

    申请日：2009-12-02

    Applicant: 도레이첨단소재 주식회사

    Inventor： 박종용 ,  김영섭 ,  전은욱 ,  이정덕

    IPC: H05K3/24 ,  H05K3/18

    Abstract: PURPOSE: A method for manufacturing a structure on flexible circuit boards are laminated capable of reducing cracks on a copper pattern is provided to minimize a repulsive force against external stress. CONSTITUTION: A tie layer(2) is deposited on a polymer film(1) whose surface is processed by a sputtering method. A seed layer(3) is deposited on the tie layer by copper. The amount of applied currents increases in a copper electrolysis plating solution so that an electrolytic plated layer(4) is formed.

    Abstract translation: 目的：提供一种用于制造能够减少铜图案上的裂纹的柔性电路板上的结构的方法，以最小化对外部应力的排斥力。 构成：将粘结层（2）沉积在其表面通过溅射法处理的聚合物膜（1）上。 种子层（3）通过铜沉积在接合层上。 在铜电解电镀溶液中施加的电流量增加，从而形成电解镀层（4）。

    인쇄회로기판용 연성 동박 적층 필름 및 그 제조방법
    9.
    发明公开
    인쇄회로기판용 연성 동박 적층 필름 및 그 제조방법 无效
    柔性电路板柔性铜层压膜及其制造方法相同

    公开(公告)号：KR1020110045953A

    公开(公告)日：2011-05-04

    申请号：KR1020090102725

    申请日：2009-10-28

    Applicant: 도레이첨단소재 주식회사

    Inventor： 김영섭 ,  전은욱 ,  박종용 ,  김정모

    IPC: H05K3/18 ,  H05K1/05

    Abstract: PURPOSE: A flexible cupper laminated film for a flexible circuit board and a manufacturing method the same are provided to minimize a problem due to a dimensional change by minimizing the dimensional change in a thermal process. CONSTITUTION: In a flexible cupper laminated film for a flexible circuit board and a manufacturing method the same, a polymer film is surface-treated by using polyimide. A conductive layer is deposited in the surface of the polymer film. The conductive layer is comprised of a tie layer and a metal seed layer. A plating layer is formed on the polymer film. A plating liquid contains an additive and a corrective substance. The polyimide has a specific coefficient of thermal expansion.

    Abstract translation: 目的：提供一种用于柔性电路板的柔性铜层压膜及其制造方法，以通过最小化热处理中的尺寸变化来最小化由尺寸变化引起的问题。 构成：在柔性电路板用柔性铜层压膜及其制造方法中，使用聚酰亚胺对聚合物膜进行表面处理。 导电层沉积在聚合物膜的表面中。 导电层由连接层和金属种子层组成。 在聚合物膜上形成镀层。 电镀液含有添加剂和矫正剂。 聚酰亚胺具有特定的热膨胀系数。

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