접착력이 향상된 투명 도전성 필름 및 그 제조방법
    1.
    发明公开
    접착력이 향상된 투명 도전성 필름 및 그 제조방법 审中-实审
    具有改善粘合强度的透明导电薄膜及其制造方法

    公开(公告)号:KR1020140078350A

    公开(公告)日:2014-06-25

    申请号:KR1020120147622

    申请日:2012-12-17

    CPC classification number: H01B5/14 G06F3/041 H01B13/00

    Abstract: The present invention relates to a transparent conductive film having improved adhesive strength which secures the initial and long-term reliability of adhesive strength by a vacuum deposition method of depositing Si on the interface of a transparent conductive film and a transparent film and improves transparency and transmission, and a manufacturing method thereof. For this, the transparent conductive film having improved adhesive strength according to the present invention includes a transparent substrate, a first dielectric layer which is an SiOx layer which is formed on the transparent substrate (x is 1

    Abstract translation: 本发明涉及一种具有改进的粘合强度的透明导电膜,其通过在透明导电膜和透明膜的界面上沉积Si的真空沉积方法来确保粘合强度的初始和长期可靠性,并提高透明度和透射率 ,及其制造方法。 为此,根据本发明的具有改善的粘合强度的透明导电膜包括透明基板,形成在透明基板上的SiO x层的第一介电层(x为1

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