公开(公告)号：KR101609885B1

公开(公告)日：2016-04-06

申请号：KR1020100007844

申请日：2010-01-28

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 후지무라고오지 ,  마스나가다까히로

IPC: H01L21/027

Abstract: 본발명의과제는도포노즐로부터기판으로의액 적하의발생을억제하는것이다. 상기도포노즐(5)이대기하기위해, 서로인접하는액처리부(3A 내지 3C)끼리의사이에중간대기위치(62, 63)를설정하고, 각액처리부(3A 내지 3C)로반입된웨이퍼(W)에대해도포액의공급을행하기위해, 미리결정된웨이퍼(W)의반입순서에따라서, 상기도포노즐(5)을각 액처리부(3A 내지 3C)의도포위치로순차적으로이동시키는동시에, 도포액의공급이종료된제1 액처리부와, 다음에도포액의공급을행하는제2 액처리부사이에, 도포액의공급이행해진웨이퍼(W)가놓인제3 액처리부가개재될때에는, 그웨이퍼(W)가당해제3 액처리부로부터반출될때까지상기제1 액처리부와제3 액처리부사이의중간대기위치에서상기도포노즐(5)을대기시키도록그 구동을제어한다.

Abstract translation: 本发明的目的是抑制从涂布喷嘴到基材的液滴的产生。 中间等待位置62和63设置在彼此相邻的液体处理单元3A到3C之间，使得涂敷喷嘴5延伸并且晶圆W被供应到液体处理单元3A到3C 为了向液体供应单元5供应涂布液，涂布喷嘴5依照预定的晶片W的输送顺序依次移动到液体处理单元3A至3C的形成位置， 当其中已经经历不同涂布操作的第一液体处理部分和其次供应涂布液体的第二液体处理部分之间插入其中供应涂布液体的晶片W的第三液体处理部分时， 并且控制施加喷嘴5的驱动，以便在第一液体处理单元和第三液体处理单元之间的中间待用位置处等待，直到液体从第三液体处理单元分配为止。

公开(公告)号：KR1020100088090A

公开(公告)日：2010-08-06

申请号：KR1020100007844

申请日：2010-01-28

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 후지무라고오지 ,  마스나가다까히로

IPC: H01L21/027

CPC classification number: H01L21/6715 ,  G03F7/0025 ,  G03F7/162 ,  H01L21/67017

Abstract: PURPOSE: A liquid treatment device is provided to prevent the dropping of a coating solution from a coating nozzle to a substrate where the coating solution is supplied. CONSTITUTION: A driving device is formed to be moved in a horizontal direction along a guide(55) which is installed to be extended in parallel to the arranging direction of the solution treatment part of a base(22). A controller sequentially moves a coating nozzle to the coating location of each solution treatment part according to the predetermined import order of a wafer in order to supply the coating solution to the wafer. The controller controls the driving device so that the coating nozzle waits in the central waiting location between a first solution treatment part and a third solution treatment part when the third solution treatment part is interposed between the first solution treatment part and the second solution treatment part.

Abstract translation: 目的：提供一种液体处理装置，以防止涂布溶液从涂布喷嘴滴落到提供涂布溶液的基材上。 构成：驱动装置形成为沿着安装成平行于基部（22）的固化处理部的排列方向延伸的引导件（55）在水平方向上移动。 控制器根据晶片的预定导入顺序顺序地将涂布喷嘴移动到每个固化处理部分的涂覆位置，以将涂布溶液供应到晶片。 所述控制器控制所述驱动装置，使得当所述第三固溶处理部插入在所述第一固溶处理部和所述第二固溶处理部之间时，所述涂布喷嘴在所述第一固溶处理部和所述第三固溶处理部之间的中央等待位置等待。