公开(公告)号：KR101215712B1

公开(公告)日：2012-12-26

申请号：KR1020100011716

申请日：2010-02-09

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 쯔끼노끼와따루

IPC: H01L21/00 ,  H01L21/027

CPC classification number: H01L21/67769 ,  H01L21/67276 ,  Y10S414/14

Abstract: 본발명의과제는다른로트에대해우선적으로처리를행하는특급로트가발생한경우에, 당해특급로트의기판이처리개시를대기하는시간을단축하는것이다. 우선적으로처리를행하는특급로트의기판을수납한특급캐리어(E)가캐리어반입부(225)로반입되었을때에, 웨이퍼반입부(211, 212) 모두가캐리어(C)에의해점유되어있으면, 당해캐리어(C) 중하나를퇴피용적재부(22)로이동탑재하고, 이에의해비어있는웨이퍼반입부[211(212)]에상기특급캐리어(E)를적재하도록캐리어이동탑재수단(3)을제어하고, 상기특급캐리어(E)가상기웨이퍼반입부[211(212)]에적재되었을때에는당해특급캐리어(E) 내의웨이퍼를다른캐리어보다도먼저불출하도록전달수단(A1)을제어한다.

Abstract translation: 本发明的目的是当针对另一批次优先执行用于执行处理的特定批次时，缩短限制批次的基材等待处理开始的时间。 如果所有的执行处理时的第一一方壳体精通地块精通载体的底物（E）是输入载波取部225鲁班，晶片搬送单元（211，212）是由一个载体（C）占据， 载体移动和安装装置3安装在空的晶圆装载部分211（212）上，以便将专用载体E装载到空的晶圆装载部分22上 并且控制发送装置A1，使得当晶片被装载在专用载体（E）虚拟晶片装载部211（212）上时，专用载体（E）中的晶片被装载在其他载体之前。

公开(公告)号：KR1020100091902A

公开(公告)日：2010-08-19

申请号：KR1020100011716

申请日：2010-02-09

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 쯔끼노끼와따루

IPC: H01L21/00 ,  H01L21/027

CPC classification number: H01L21/67769 ,  H01L21/67276 ,  Y10S414/14 ,  G03F7/70716 ,  G03F7/70775 ,  H01L21/67346 ,  H01L21/67363 ,  H01L21/67703

Abstract: PURPOSE: The substrate processing apparatus loads the emergency carrier to the waiting time [waiting time] of little in the load stock for transmission. The substrate of the emergency carrier is not emit done rapidly with vehicle. CONSTITUTION: A plurality of load stock for escapes loads the carrier(C). The load stock for import carries in the carrier. The carrier movement loading means is proceed the movement loading of the carrier between the load stock for the load stock for escape and import. In the carrier station(2), the load stock for the load stock for escape and import are installed in multi-stage. The vehicle(A1) is proceed the transmission of wafer between carrier and the processing block(B2) putting on the load stock(21) for transmission.

Abstract translation: 目的：基板处理装置将应急载体加载到负载库中进行传输的等待时间[等待时间]。 应急载体的基板不能用车辆快速发射。 构成：多个用于逃逸的负载储存装载载体（C）。 进口货物载运货物。 承载件移动装载装置进行承载件的负载库存之间的运载装载，用于货物的卸载和进口。 在承运站（2）中，进出货负荷库存多级安装。 车辆（A1）进行载体和加载载体（21）之间的加工块（B2）之间的晶片的传输以进行传输。

公开(公告)号：KR1020100097610A

公开(公告)日：2010-09-03

申请号：KR1020100016883

申请日：2010-02-25

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 야노미쯔떼루 ,  마하라고오지 ,  쯔끼노끼와따루

IPC: H01L21/027 ,  H01L21/02

CPC classification number: G03F7/168 ,  G03F7/70616 ,  G03F7/70733 ,  H01L21/6715 ,  H01L21/67276 ,  H01L21/67288 ,  H01L21/67712

Abstract: PURPOSE: A substrate processing apparatus and a substrate processing method are provided to remarkably reduce the occupied area for the bottom surface of a heat treatment unit by processing a substrate vertically while transferring the substrate in vertical state. CONSTITUTION: A carrier block(S1) for carrying a carrier(20) inward and outward is prepared. A loading table(21) for loading a carrier and an opening and closing part are installed to match each carrier, and a transfer arm(C1) is installed on the carrier block. A processing block(S2) comprises a thermal process block(G1-G5), an inspection measurement block(G6), two transport blocks, and a liquid processing block.

Abstract translation: 目的：提供一种基板处理装置和基板处理方法，通过在垂直状态下转印基板的同时垂直地处理基板来显着地减少热处理单元的底面的占用面积。 构成：准备用于向内和向外运送托架（20）的承载块（S1）。 安装用于装载托架和打开和关闭部件的装载台（21）以匹配每个托架，并且将传送臂（C1）安装在承载块上。 处理块（S2）包括热处理块（G1-G5），检查测量块（G6），两个传送块和液体处理块。