公开(公告)号：KR1020130132786A

公开(公告)日：2013-12-05

申请号：KR1020137011210

申请日：2011-10-18

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 히로시로고오키치 ,  니시다카노리 ,  데라다쇼이치 ,  기타노다카히로

IPC: H01L21/027

CPC classification number: B29C33/58 ,  B29C33/60 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/0273

Abstract: The present invention is a method for modifying the surface of a substrate such that the adhesiveness between the surface of the substrate and an object to be bonded thereto is improved. The surface of the substrate is modified by supplying a surface modification solution such as a tertiary alcohol, an alkaline solution or a hydrogen peroxide solution to the surface of a substrate while irradiating the surface of the substrate with ultraviolet rays, and by imparting a large amount of hydroxyl groups to the surface of the substrate. The surface of the substrate begins to be irradiated with ultraviolet rays while the surface modification solution is being supplied.