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公开(公告)号：KR1020090105594A
公开(公告)日：2009-10-07
申请号：KR1020080031142
申请日：2008-04-03
Applicant: 삼성전기주식회사
IPC: H04N5/225
CPC classification number: H04N5/2251 , H01L27/14623 , H01L27/14625 , H01L27/14632 , H05K2203/049
Abstract: PURPOSE: A camera module and a manufacturing method thereof mounting a wafer lens on a second molding unit are provided to reduce manufacturing cost and the number of manufacturing processes and manufacture the camera module of a simple structure. CONSTITUTION: A camera module includes a lead frame(10), a first molding unit, an image sensor, a second molding unit, and a lens. The first molding unit is molding formed between the lead frames. The image sensor is mounted on the first molding unit. The second molding unit is formed on the top surface of the lead frame of the image sensor outer side with the sidewall type.
Abstract translation: 目的：提供将晶片透镜安装在第二成型单元上的相机模块及其制造方法，以降低制造成本和制造工艺的数量，并且制造简单结构的相机模块。 构成：相机模块包括引线框架（10），第一模制单元，图像传感器，第二模制单元和透镜。 第一成型单元是在引线框架之间形成的。 图像传感器安装在第一模制单元上。 第二成型单元形成在图像传感器外侧的引线框架的顶面上，具有侧壁型。
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公开(公告)号：KR100826380B1
公开(公告)日：2008-05-02
申请号：KR1020070057816
申请日：2007-06-13
Applicant: 삼성전기주식회사
IPC: H04B1/40
CPC classification number: H04M1/22 , H04M1/0264 , H04M2250/12 , H04N5/2256
Abstract: A mobile communication terminal having illumination units for controlling brightness is provided to comprise at least two illumination units whose brightness is controlled according to intensity of peripheral illumination, thereby taking a picture by illuminating an object with the controlled brightness. A sensor unit(114) detects intensity of illumination around an object by being comprised on a body. Illumination units(130,130') provide light to the object by being mounted on the other end of an extending unit whose one end is rotatively equipped on the body. A controller(111) sets brightness of the illumination units according to an illumination measurement value received from the sensor unit. The object is taken with a camera(113) in uniform illumination by the light provided from the illumination units.
Abstract translation: 具有用于控制亮度的照明单元的移动通信终端被提供以包括至少两个照明单元，其亮度根据外围照明的强度来控制，从而通过以受控的亮度照亮对象来拍摄照片。 传感器单元（114）通过包括在身体上来检测物体周围的照明强度。 照明单元（130,130'）通过安装在其一端被旋转地装配在主体上的延伸单元的另一端上来向对象提供光。 控制器（111）根据从传感器单元接收的照明测量值来设置照明单元的亮度。 通过由照明单元提供的光均匀地照射对象物体（113）。
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公开(公告)号：KR1020070009151A
公开(公告)日：2007-01-18
申请号：KR1020050064215
申请日：2005-07-15
Applicant: 삼성전기주식회사
IPC: G02B7/02
CPC classification number: G02B7/023 , G02B9/04 , G02B13/003 , H02N2/006
Abstract: A lens adjusting apparatus and a body tube assembly manufacturing method using the same are provided to properly apply the lens adjusting apparatus for a small image pick-up optical device and to improve the yield rate of a body tube assembly by adjusting the position of a lens while measuring MTF(Modulation Transfer Function) of the lenses. A lens adjusting apparatus(100) includes a body tube support(160) holding a body tube(210) to restrict the movement of the body tube equipped with a plurality of lenses(L1,L2,L3); a frame(110) positioned at the upper side of the body tube support and provided with side parts(115) formed on the outer periphery of the body tube; and a lens adjusting unit installed at the side parts of the frame to adjust the eccentricity of a first lens positioned closely to an object and composed of at least two fine adjusters(130) supplying pressurizing force to finely adjust the position of the first lens and at least one elastic member(140) supplying elastic force to hold the position of the first lens transferred by the fine adjuster.
Abstract translation: 提供一种透镜调节装置和使用其的体管组件制造方法，以适当地应用用于小型摄像光学装置的透镜调节装置，并且通过调节透镜的位置来提高体管组件的屈服率 同时测量透镜的MTF（调制传递函数）。 透镜调节装置（100）包括保持体管（210）的体管支架（160），以限制配备有多个透镜（L1，L2，L3）的主体管的运动; 定位在所述主体管支撑体的上侧的框架（110），并且设置有形成在所述主体管的外周上的侧部（115） 以及透镜调节单元，其安装在所述框架的侧部，以调节位于物体附近的第一透镜的偏心，并且由至少两个提供加压力的微调节器（130）组成，以精细调节第一透镜的位置;以及 至少一个弹性构件（140），其提供弹性力以保持由所述微调节器传送的所述第一透镜的位置。
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公开(公告)号：KR1020060090333A
公开(公告)日：2006-08-10
申请号：KR1020050011094
申请日：2005-02-07
IPC: G11B7/09
CPC classification number: G11B7/004 , G11B5/4992 , G11B20/10 , G11B33/12 , G11B2007/0006 , H05K1/147
Abstract: 본 발명은 광픽업의 데이터 라인 스위칭 회로에 관한 것으로, 서로 다른 포멧의 멀티 광디스크를 구동하기 위하여 전기적으로 접속되는 광픽업 제어신호 및 데이터 신호에서 제어부의 제어신호에 의하여 해당 포멧의 데이터라인만을 공통의 접속 커넥터를 통하여 인가하게 함으로써, 커넥터의 단자수를 최소화하여 광픽업 장치를 소형화 및 슬림화할 수 있다.
광픽업, 커넥터, FPCB, 소형화, 슬림화-
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Patent Agency Ranking
公开(公告)号：KR200098694Y1
公开(公告)日：1996-08-09
申请号：KR2019930022435
申请日：1993-10-29
Applicant: 삼성전기주식회사
Inventor： 김형진
IPC: G11B15/087
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公开(公告)号：KR1020100010171A
公开(公告)日：2010-02-01
申请号：KR1020080071042
申请日：2008-07-22
Applicant: 삼성전기주식회사
CPC classification number: H04N5/2251 , H01L27/14632
Abstract: PURPOSE: A wafer level camera module is provided to form a cutting unit corresponding to a recognition mark of a wafer lens formed on the upper part of a spacer stick to an image sensor and spread a bonding layer on the upper part of the spacer except the cutting unit, thereby protecting hide of the recognition mark by the bonding layer. CONSTITUTION: An image sensor(10) includes a phototransistor. A lens assembly(100) includes a spacer(40) and a wafer lens(50). The spacer is stick to the lower part of the image sensor, includes a window(45) exposing the phototransistor and a cutting unit(40a) on the upper part of an edge. The wafer lens is stick to the lower part of the spacer and includes a recognition mark for arranging the image sensor at the location corresponding to the cutting unit. The cutting unit is formed on one part or entire part of an edge unit of the spacer.
Abstract translation: 目的：提供晶片级相机模块，以形成对应于形成在图像传感器的间隔棒的上部上的晶片透镜的识别标记的切割单元，并将粘结层扩展在间隔物的上部，除了 切割单元，从而通过粘合层保护识别标记的隐藏。 构成：图像传感器（10）包括光电晶体管。 透镜组件（100）包括间隔物（40）和晶片透镜（50）。 间隔件粘附在图像传感器的下部，包括将光敏晶体管和在边缘上部的切割单元（40a）暴露的窗口（45）。 晶片透镜粘贴到间隔件的下部，并且包括用于将图像传感器布置在与切割单元相对应的位置处的识别标记。 切割单元形成在间隔件的边缘单元的一部分或全部上。
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公开(公告)号：KR100939764B1
公开(公告)日：2010-01-29
申请号：KR1020080031142
申请日：2008-04-03
Applicant: 삼성전기주식회사
IPC: H04N5/225
Abstract: 본 발명은 카메라 모듈 및 그 제조방법에 관한 것으로서, 리드 프레임; 상기 리드 프레임 사이의 공간에 몰딩 형성된 제1 몰딩부; 상기 제1 몰딩부 상에 탑재된 이미지 센서; 상기 이미지 센서 외측의 상기 리드 프레임의 상면에 측벽 형태로 몰딩 형성된 제2 몰딩부; 및 상기 제2 몰딩부 상에 안착되어 지지되는 렌즈;를 포함하는 카메라 모듈을 제공하고, 또한 본 발명은 상기 카메라 모듈의 제조방법을 제공한다.
카메라 모듈, 무조정, 몰딩, 리드 프레임, 웨이퍼 렌즈-
公开(公告)号：KR1020080111842A
公开(公告)日：2008-12-24
申请号：KR1020070060289
申请日：2007-06-20
Applicant: 삼성전기주식회사
Abstract: An image sensor and a camera module using the same are provided to prevent damage of a sensor due to the foreign material by placing the bottom of the housing to be settled in the outer edge part of the image sensor. An image sensor(100) of a camera module comprises a light receiving part(110), a housing settling portion(130), and a plurality of pads(212). An image is displayed on the light receiving part. The housing settling portion is located at the outer part of the light receiving part. The plurality of pads are arranged having the same interval between the light receiving part, and the outer housing settling portion.
Abstract translation: 提供图像传感器和使用其的摄像机模块，以通过将要沉降的壳体的底部放置在图像传感器的外缘部分中来防止由于异物而导致的传感器损坏。 照相机模块的图像传感器（100）包括光接收部分（110），壳体沉降部分（130）和多个焊盘（212）。 在受光部上显示图像。 壳体沉降部分位于光接收部分的外部。 多个焊盘被布置成在光接收部分和外壳体沉降部分之间具有相同的间隔。
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