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公开(公告)号:KR101310431B1
公开(公告)日:2013-09-24
申请号:KR1020120051550
申请日:2012-05-15
Applicant: 삼성전기주식회사
Inventor: 나광렬
IPC: H04N5/225
CPC classification number: H04N5/2253 , H04N5/2252 , H04N5/2254
Abstract: PURPOSE: A camera module is provided to lower the total height of the camera module by inserting and installing an IR cutoff filter inside a light transmissive substrate. CONSTITUTION: An image sensor module (110) includes an image sensor (112) and a light transmissive substrate (111). The image sensor is mounted on the bottom of the light transmissive substrate. A groove (111a) is located at the center of the top of the light transmissive substrate. An IR cutoff filter (140) is installed inside the groove. A housing (120) has an opening at the top of the image sensor. A plurality of lenses are stacked inside a lens barrel (130). The lens barrel is combined with the housing at the center of the housing.
Abstract translation: 目的:提供相机模块,通过在透光基板内插入和安装IR截止滤光片来降低相机模块的总高度。 构成:图像传感器模块(110)包括图像传感器(112)和透光基板(111)。 图像传感器安装在透光基板的底部。 凹槽(111a)位于透光基底顶部的中心。 IR槽截止过滤器(140)安装在槽内。 壳体(120)在图像传感器的顶部具有开口。 多个透镜被堆叠在透镜镜筒内(130)内。 透镜筒与外壳的中心处的外壳结合。
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公开(公告)号:KR1020130109407A
公开(公告)日:2013-10-08
申请号:KR1020120031119
申请日:2012-03-27
Applicant: 삼성전기주식회사
IPC: H01L27/14
CPC classification number: H04N5/2253 , H01L27/14618 , H01L31/02005 , H01L31/02325 , H04N5/2252 , H04N5/2254
Abstract: PURPOSE: A chip on glass package and a camera module including the same are provided to minimize a camera module by arranging an infrared ray blocking film on a step part that is formed on the upper surface of a glass substrate. CONSTITUTION: A lens assembly (100) consists of several lenses. A housing (200) accommodates the lens assembly. A chip on glass package consists of a transparent substrate (310) and an image sensor (320) mounted on the transparent substrate. A step part (311) is formed on the upper part of the transparent substrate. The image sensor condenses incident light to produce image signals. A light receiving part (321) is formed on the upper center of the image sensor.
Abstract translation: 目的:提供玻璃封装的芯片和包括该芯片的相机模块,以通过在形成在玻璃基板的上表面上的台阶上布置红外线阻挡膜来最小化相机模块。 构成:透镜组件(100)由多个透镜组成。 壳体(200)容纳透镜组件。 玻璃封装的芯片由透明基板(310)和安装在透明基板上的图像传感器(320)组成。 在透明基板的上部形成台阶部(311)。 图像传感器会凝结入射光以产生图像信号。 在图像传感器的上部中心形成有光接收部(321)。
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公开(公告)号:KR1020100042445A
公开(公告)日:2010-04-26
申请号:KR1020080101595
申请日:2008-10-16
Applicant: 삼성전기주식회사
IPC: H01L27/146 , H01L23/28
CPC classification number: H01L2224/97 , H01L31/1876 , H01L27/14618 , H01L27/14687 , H01L31/0203 , H04N5/2254
Abstract: PURPOSE: A method for manufacturing a camera module using a wafer level package is provided to increase durability and abrasion resistance of a dicing blade by reducing a region to be diced with a dicing blade. CONSTITUTION: An image sensor is mounted on the upper side of a wafer and an external connection unit is included in the lower side of the wafer. An image sensor wafer(110) mounting a transparent unit is prepared for sealing the image sensor on the wafer. A lens wafer(130) is bonded on the image sensor wafer. A plurality of lenses and a spacer wafer with the dicing groove are successively stacked on the surface of a lens wafer. The spacer wafer is separated to a unit module by being diced along a dicing groove.
Abstract translation: 目的:提供一种使用晶片级封装制造相机模块的方法,通过减少切割刀片切割的区域来增加切割刀片的耐久性和耐磨性。 构成:图像传感器安装在晶片的上侧,外部连接单元包含在晶片的下侧。 准备安装透明单元的图像传感器晶片(110)以将图像传感器密封在晶片上。 透镜晶片(130)接合在图像传感器晶片上。 多个透镜和具有切割槽的间隔晶片依次层叠在透镜晶片的表面上。 间隔晶片通过沿着切割槽切块分离成单元模块。
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公开(公告)号:KR101310579B1
公开(公告)日:2013-09-23
申请号:KR1020110144816
申请日:2011-12-28
Applicant: 삼성전기주식회사
Inventor: 나광렬
IPC: H04N5/225
Abstract: 본 발명은 이미지 센서가 실장된 기판에 구비되는 가이드; 및 내부에 렌즈가 장착되며, 상기 가이드에 지지된 상태에서 수직 이동되어 상기 이미지 센서와 상기 렌즈 사이의 거리 조정에 의한 포커싱 조정 후 상기 기판의 상부에 구비되는 광학 홀더;를 포함하는 카메라 모듈을 개시한다.
본 발명에 따르면, 카메라 모듈의 조립성을 향상 및 이물 불량에 의한 화질 저하를 방지할 수 있으며 카메라 모듈의 제조 비용을 절감하고 생산성을 향상할 수 있다.-
公开(公告)号:KR101147327B1
公开(公告)日:2012-05-22
申请号:KR1020100060176
申请日:2010-06-24
Applicant: 삼성전기주식회사
Abstract: 카메라모듈 및 이를 구비한 감시장치가 개시된다. 감시영역 중에서 원하는 영역을 선택하여 관찰할 수 있는 감시장치로서, 감시영역 중에서 관찰할 영역의 이미지를 선택적으로 제공하는 카메라모듈, 카메라모듈에서 제공된 이미지를 표시하는 디스플레이부, 카메라모듈이 관찰영역의 이미지를 제공하도록 카메라모듈에 관찰영역을 지정해 주는 제어부를 포함하고, 카메라모듈은 감시영역 전체를 커버할 수 있는 시야를 가지는 렌즈부, 렌즈부로 입사된 빛을 촬상하여 감시영역 전체의 이미지 데이터를 생성하는 이미지 촬상부, 전체의 이미지 데이터 중에서 출력할 이미지 데이터를 선택하는 데이터 선택부를 포함하는 것을 특징으로 하는 감시장치는, 기계적인 구동장치가 생략됨으로써 작동의 신뢰성이 보장되고 유지보수가 용이할 수 있으며, 하나의 장치로 넓은 영역에 대하여 효율적인 감시가 가능하며, 컴팩트한 구조로 구성되어 제조단가가 절감되고 설치가 용이해 질 수 있다.
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公开(公告)号:KR1020110140011A
公开(公告)日:2011-12-30
申请号:KR1020100060176
申请日:2010-06-24
Applicant: 삼성전기주식회사
CPC classification number: H04N5/23238 , H04N5/2251 , H04N5/2628 , H04N7/18
Abstract: PURPOSE: A camera module and a monitoring device including the same are provided to improve the reliability of an operation by removing a mechanical driving unit. CONSTITUTION: A camera module(10) selectively provides an image of an observation area(6) among a monitoring area(1). A display unit(20) display the image of the camera module. A control unit(30) designates the observation area to the camera module. An imaging unit of the camera module generates image data of the monitoring area. A data selecting unit of the camera module selects output image data of the whole image data.
Abstract translation: 目的:提供一种相机模块和包括该相机模块的监视装置,以通过去除机械驱动单元来提高操作的可靠性。 构成:相机模块(10)在监视区域(1)中选择性地提供观察区域(6)的图像。 显示单元(20)显示相机模块的图像。 控制单元(30)将相机模块的观察区域指定。 相机模块的成像单元生成监视区域的图像数据。 相机模块的数据选择单元选择整个图像数据的输出图像数据。
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公开(公告)号:KR1020100010171A
公开(公告)日:2010-02-01
申请号:KR1020080071042
申请日:2008-07-22
Applicant: 삼성전기주식회사
CPC classification number: H04N5/2251 , H01L27/14632
Abstract: PURPOSE: A wafer level camera module is provided to form a cutting unit corresponding to a recognition mark of a wafer lens formed on the upper part of a spacer stick to an image sensor and spread a bonding layer on the upper part of the spacer except the cutting unit, thereby protecting hide of the recognition mark by the bonding layer. CONSTITUTION: An image sensor(10) includes a phototransistor. A lens assembly(100) includes a spacer(40) and a wafer lens(50). The spacer is stick to the lower part of the image sensor, includes a window(45) exposing the phototransistor and a cutting unit(40a) on the upper part of an edge. The wafer lens is stick to the lower part of the spacer and includes a recognition mark for arranging the image sensor at the location corresponding to the cutting unit. The cutting unit is formed on one part or entire part of an edge unit of the spacer.
Abstract translation: 目的:提供晶片级相机模块,以形成对应于形成在图像传感器的间隔棒的上部上的晶片透镜的识别标记的切割单元,并将粘结层扩展在间隔物的上部,除了 切割单元,从而通过粘合层保护识别标记的隐藏。 构成:图像传感器(10)包括光电晶体管。 透镜组件(100)包括间隔物(40)和晶片透镜(50)。 间隔件粘附在图像传感器的下部,包括将光敏晶体管和在边缘上部的切割单元(40a)暴露的窗口(45)。 晶片透镜粘贴到间隔件的下部,并且包括用于将图像传感器布置在与切割单元相对应的位置处的识别标记。 切割单元形成在间隔件的边缘单元的一部分或全部上。
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公开(公告)号:KR101140875B1
公开(公告)日:2012-05-03
申请号:KR1020100113519
申请日:2010-11-15
Applicant: 삼성전기주식회사
Inventor: 나광렬
Abstract: PURPOSE: An endoscope camera is provided to improve the convenience of the assembly of an endoscope camera since an imaging part and a connection part of the endoscope camera are connected by using an electrical connector part. CONSTITUTION: An imaging part(210) includes a contact pin part in which a contact pin(212) is installed. An operation part is composed to operate the operation of the imaging part. A connection part(220) is electrically connected to the imaging part while being connected with a contact part and the contact pin. A connection board is composed of a flexible substrate and a rigid substrate(213). A cap covers up a circumference corresponding to the contact part.
Abstract translation: 目的:提供一种内窥镜照相机,以提高内窥镜摄像机的组装的便利性,因为内窥镜摄像机的成像部分和连接部分通过使用电连接器部分连接。 构成:成像部件(210)包括其中安装有接触销(212)的接触销部分。 组合操作部件来操作成像部件的操作。 连接部分(220)在与接触部分和接触销连接的同时与成像部分电连接。 连接板由柔性基板和刚性基板(213)构成。 帽覆盖对应于接触部分的圆周。
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公开(公告)号:KR1020100052966A
公开(公告)日:2010-05-20
申请号:KR1020080111888
申请日:2008-11-11
Applicant: 삼성전기주식회사
CPC classification number: G02B26/101
Abstract: PURPOSE: A three-dimensional space scanner is provided to detect a distance between the scanner and an obstacle by rotating and tilting a reflective mirror and by vertically and horizontally irradiating a laser. CONSTITUTION: A three-dimensional space scanner comprises a rotating unit(100), a mirror holder(200), and an tilting unit(300). The rotating unit generates torque. The mirror holder comprises a tilted reflective mirror(M), and is rotated by the torque of the rotating unit. The tilting unit is arranged on the top of the mirror holder, and is vertically reciprocated along a frame. And the tilting unit tilts the reflective mirror by being connected to the reflective mirror through a rod.
Abstract translation: 目的:提供三维空间扫描器,通过旋转和倾斜反射镜以及垂直和水平照射激光来检测扫描仪与障碍物之间的距离。 构成:三维空间扫描器包括旋转单元(100),反射镜支架(200)和倾斜单元(300)。 旋转单元产生扭矩。 反射镜保持器包括倾斜反射镜(M),并通过旋转单元的扭矩旋转。 倾斜单元布置在镜保持器的顶部上,并且沿着框架垂直往复运动。 并且倾斜单元通过通过杆连接到反射镜而使反射镜倾斜。
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