公开(公告)号：KR102126418B1

公开(公告)日：2020-06-24

申请号：KR1020150153751

申请日：2015-11-03

Applicant: 삼성전기주식회사

Inventor： 유진문

IPC: H01L27/146 ,  H01L23/15 ,  H01L23/31 ,  H01L23/495 ,  H01L23/29 ,  H01L23/488

公开(公告)号：KR1020170108668A

公开(公告)日：2017-09-27

申请号：KR1020160032936

申请日：2016-03-18

Applicant: 삼성전기주식회사

Inventor： 유진문 ,  최영안 ,  이혁기

IPC: G02B7/02 ,  B29C45/14 ,  H04N5/232 ,  H01L23/498

CPC classification number: H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/00014

Abstract: 본발명의일 실시예에따른렌즈배럴어셈블리는, 내부에적어도하나의렌즈가광축방향으로배열되는하우징; 상기하우징에서광축방향으로돌출되는적어도하나의고정돌기; 및상기고정돌기의광축방향하단부에솔더링에의해고정되어매달리게구비되는센서기판;을포함할수 있다.

Abstract translation: 根据本发明的一个方面，提供了一种透镜镜筒组件，其包括：壳体，其具有沿光轴方向布置的至少一个透镜; 至少一个固定突起，从壳体沿光轴方向突出; 并且，传感器基板通过钎焊固定在光轴方向的固定突起的下端。

公开(公告)号：KR1020130013430A

公开(公告)日：2013-02-06

申请号：KR1020110075074

申请日：2011-07-28

Applicant: 삼성전기주식회사

Inventor： 유진문 ,  정호섭

IPC: H04B1/38 ,  H04M1/02 ,  G06F3/02

CPC classification number: H04M1/22 ,  H04M1/23

Abstract: PURPOSE: An optical module for a volume control is provided to sense the movement of a subject by receiving a reflected light reflected to the subject. CONSTITUTION: A sensor(130) selectively receives light reflected to a subject. A separation film(140) surrounds the sensor. The separation film separates a light source and the sensor. An opening is formed in a position of the separation film which light reflected to the subject passes through. A cover plate(150) is arranged in the top of a substrate. The subject is contacted with the cover plate.

Abstract translation: 目的：提供一种用于音量控制的光学模块，用于通过接收反射到被摄体的反射光来感测被摄体的运动。 构成：传感器（130）选择性地接收反射到被摄体的光。 分离膜（140）围绕传感器。 分离膜分离光源和传感器。 在分离膜的位置形成开口，反射到被检体的光通过。 盖板（150）布置在基板的顶部。 被检者与盖板接触。

公开(公告)号：KR101104211B1

公开(公告)日：2012-01-10

申请号：KR1020100007849

申请日：2010-01-28

Applicant: 삼성전기주식회사

Inventor： 유진문 ,  신수길 ,  구원서

IPC: H01L31/04

CPC classification number: H01L31/0516 ,  H01L31/048 ,  H01L31/0504 ,  Y02E10/50

Abstract: PURPOSE: A solar cell module manufacturing method is provided to simplify a manufacturing process of a solar cell module and to embody a compact the solar cell module. CONSTITUTION: A reflection protect layer is formed on the one side of a transparent substrate(S100). A circuit pattern is formed on the one side of the transparent substrate(S200). A junction layer is formed on the one side of the transparent substrate in order to be exposed a part of the circuit patterns(S300). A conductive bump is formed on the circuit pattern(S400). The transparent substrate and a solar cell are welded for welding a conductive pad which is formed in the one side of a bump and the solar cell(S500). A protection resin layer is formed on the one side of the transparent substrate for covering the solar cell(S600).

Abstract translation: 目的：提供一种太阳能电池模块的制造方法，以简化太阳能电池组件的制造过程并体现太阳能电池组件的紧凑性。 构成：在透明基板一侧形成反射保护层（S100）。 在透明基板的一侧形成电路图案（S200）。 在透明基板的一侧上形成接合层以露出一部分电路图案（S300）。 在电路图案上形成导电凸块（S400）。 焊接透明基板和太阳能电池以焊接形成在凸块的一侧的导电焊盘和太阳能电池（S500）。 在用于覆盖太阳能电池的透明基板的一侧上形成保护树脂层（S600）。

公开(公告)号：KR1020110071671A

公开(公告)日：2011-06-29

申请号：KR1020090128298

申请日：2009-12-21

Applicant: 삼성전기주식회사

Inventor： 유진문 ,  정호섭 ,  김태영 ,  김병재 ,  송인택

IPC: H01L31/042

CPC classification number: H01L31/0543 ,  H01L31/02008 ,  H01L31/048 ,  Y02E10/52

Abstract: PURPOSE: A solar cell module and a method for manufacturing thereof are provided to improve light transmittance by forming an air layer having a certain thickness between a solar cell and a transparent substrate. CONSTITUTION: In a solar cell module and a method for manufacturing thereof, a conductive bump is formed in a conductive pad which is formed in one side of a solar cell(S100). An anti-reflective layer is formed in one side of a transparent substrate(S200). A circuit pattern is formed in one side of the transparent substrate corresponding to a bump(S300). A junction layer is formed in one side of the transparent substrate(S400). A solar cell and the transparent substrate are combined with each other to make the bump and the circuit pattern contacted to each other(S500). A protection resin layer is formed on one side of the transparent substrate to cover the solar cell(S600).

Abstract translation: 目的：提供太阳能电池组件及其制造方法，通过在太阳能电池和透明基板之间形成具有一定厚度的空气层来提高透光率。 构成：在太阳能电池模块及其制造方法中，在形成于太阳能电池的一侧的导电焊盘中形成导电凸块（S100）。 在透明基板的一侧形成抗反射层（S200）。 电路图案形成在对应于凸块的透明基板的一侧（S300）。 在透明基板的一侧形成结层（S400）。 太阳能电池和透明基板彼此组合以使凸块和电路图案彼此接触（S500）。 在透明基板的一侧形成保护树脂层以覆盖太阳能电池（S600）。

公开(公告)号：KR1020100070604A

公开(公告)日：2010-06-28

申请号：KR1020080129226

申请日：2008-12-18

Applicant: 삼성전기주식회사

Inventor： 유진문 ,  박병남 ,  김상진

IPC: H04N5/225

CPC classification number: G02B27/0006 ,  G02B7/021 ,  G02B7/04 ,  G02B13/0035 ,  H04N5/2251 ,  H04N5/2254 ,  H04N5/2257 ,  Y10T29/49826

Abstract: PURPOSE: A camera module and a manufacturing method thereof are provided to build a dam of stickiness to which a foreign material is stuck between a substrate and a filter glass. CONSTITUTION: An image sensor imaging light which is incident through a lens is mounted on a substrate(40). The substrate is fixed to housing. A filter glass(60) is arranged on the substrate in the housing. The filter glass forms a space surrounding the image sensor. A dust dam(50) adheres a foreign material which is inserted into the image sensor in the space. The dust dam prevents movement of the foreign material.

Abstract translation: 目的：提供一种相机模块及其制造方法，以在异物粘附在基板和滤光玻璃之间构成粘性坝。 构成：通过透镜入射的图像传感器成像光被安装在基板（40）上。 基板固定在壳体上。 过滤玻璃（60）布置在壳体中的基板上。 过滤玻璃形成图像传感器周围的空间。 灰尘坝（50）将插入图像传感器的异物粘在空间中。 防尘板防止异物移动。

公开(公告)号：KR1020090117238A

公开(公告)日：2009-11-12

申请号：KR1020080043186

申请日：2008-05-09

Applicant: 삼성전기주식회사

Inventor： 유진문

IPC: H04N5/225 ,  H01L27/146 ,  G03B17/00

CPC classification number: H04N5/2251 ,  H01L24/01 ,  H01L27/14685 ,  H01L27/14687

Abstract: PURPOSE: A wafer level camera module and a manufacturing method thereof for obtaining EMI/EMC shield effect without additional metallization process are provided to reduce the size of a camera module, a manufacturing process and a cost. CONSTITUTION: A wafer level camera module(100) includes an image sensor wafer(10), a wafer lens(70), a molding material(90). An image charge coupled device and a transparent member are included in the upper side of the image sensor wafer. An external connection unit is equipped on the lower part of the image sensor wafer. The wafer lens is laminated on the transparent member of the image sensor wafer. The molding material is formed in both sides of the wafer lens and the image sensor wafer including the transparent member.

Abstract translation: 目的：提供一种晶片级相机模块及其制造方法，用于在没有额外的金属化处理的情况下获得EMI / EMC屏蔽效果，以减小相机模块的尺寸，制造工艺和成本。 构成：晶片级相机模块（100）包括图像传感器晶片（10），晶片透镜（70），成型材料（90）。 图像电荷耦合器件和透明元件包括在图像传感器晶片的上侧。 在图像传感器晶片的下部配备有外部连接单元。 晶片透镜层压在图像传感器晶片的透明构件上。 成型材料形成在晶片透镜的两侧和包括透明构件的图像传感器晶片。

公开(公告)号：KR1020090114123A

公开(公告)日：2009-11-03

申请号：KR1020080039910

申请日：2008-04-29

Applicant: 삼성전기주식회사

Inventor： 김보경 ,  박상현 ,  유진문

IPC: H04N5/225 ,  H01L27/146 ,  G03B17/00

CPC classification number: H04N5/2251 ,  H01L27/14625 ,  H01L27/14632 ,  H01L2224/80862 ,  H05K2203/049

Abstract: PURPOSE: A camera module and a manufacturing method thereof are provided to reduce the diffused reflection by attaching an IR glass to a housing after the process is completed. CONSTITUTION: A camera module comprises a substrate, an image sensor wafer(10), a housing(200), an IR glass(40) and a lens(70). The image sensor wafer is mounted on the substrate by the wire bonding. The photo diode(20) is formed at an upper side of the image sensor wafer. The housing is combined on the substrate. A lens receiving part(210) is formed at an upper end of center of the housing. A rib(220) projected from a sidewall is formed at a lower part of the lens receiving part. The IR glass is attached to the lower part of a rib of the housing by being separated from the upper part of the photo diode. The lens is mounted within the lens receiving part of the housing.

Abstract translation: 目的：提供相机模块及其制造方法，以在处理完成之后通过将IR玻璃附接到壳体来减少扩散反射。 构成：相机模块包括基板，图像传感器晶片（10），壳体（200），IR玻璃（40）和透镜（70）。 图像传感器晶片通过引线接合安装在基板上。 光电二极管20形成在图像传感器晶片的上侧。 外壳在基板上组合。 透镜容纳部（210）形成在壳体的中心的上端。 在透镜接收部的下部形成有从侧壁突出的肋（220）。 IR玻璃通过与光电二极管的上部分离而附接到壳体的肋的下部。 透镜安装在外壳的透镜接收部分内。

公开(公告)号：KR100918831B1

公开(公告)日：2009-09-25

申请号：KR1020070138027

申请日：2007-12-26

Applicant: 삼성전기주식회사

Inventor： 유진문

IPC: H04N5/225

Abstract: 본 발명은 제조 공정을 단순화하고 구성요소 간의 조립 공차를 최소화함과 동시에 용이하게 관리하여 제조비용을 절감하고 생산성을 향상하기 위한 것이다.
이를 위해, 본 발명은, 웨이퍼와, 상기 웨이퍼의 상면에 형성되는 마이크로 렌즈와, 상기 웨이퍼의 하면에 형성되는 외부접속단자를 포함하여 구성된 웨이퍼 레벨 패키지; 상기 웨이퍼 레벨 패키지의 상부를 둘러싸도록 조립되며, 하면에 리브가 돌출 형성된 웨이퍼 렌즈가 내부에 장착된 렌즈 홀더; 및 상기 웨이퍼 레벨 패키지는, 상기 마이크로 렌즈를 밀봉하도록 상기 웨이퍼의 상면에 설치되는 글라스를 포함하는 포커싱 무조정 타입의 카메라 모듈 및 그 제조방법을 제공한다.
카메라 모듈, 웨이퍼 레벨 패키지, 렌즈 홀더, 웨이퍼 렌즈, 지그

Abstract translation: 本发明旨在简化制造过程，最小化部件之间的组装公差，并且同时易于管理以降低制造成本并提高生产率。

公开(公告)号：KR1020080086258A

公开(公告)日：2008-09-25

申请号：KR1020070028232

申请日：2007-03-22

Applicant: 삼성전기주식회사

Inventor： 변오성 ,  진화훈 ,  라광열 ,  김형진 ,  유진문 ,  이동우

IPC: H04N5/225

CPC classification number: H04N5/2258 ,  H04N5/2251 ,  H05K1/147 ,  H05K13/0023 ,  H05K2201/10674

Abstract: A method for manufacturing a dual camera module is provided to reduce a space, occupied by two cameras in a mobile communication terminal, into a space occupied by one camera module by assembling and manufacturing independently-prepared two camera modules, thereby reducing its size and thickness. A first substrate(301) and a second substrate(302) face each other. The first substrate is in a first camera module(100). The second substrate is in a second camera module(200) independent from the first substrate. The first and second substrates are electrically connected in a hot bar type by using NCP(Non-Conductive Paste) or ACF(Anisotropic Conductive Film). The first and second substrates comprise an FPCB(Flexible Printed Circuit Board) or a PCB.

Abstract translation: 提供一种用于制造双相机模块的方法，通过组装和制造独立制作的两个相机模块，将移动通信终端中的两个相机所占据的空间减少到由一个相机模块占据的空间，从而减小其尺寸和厚度 。 第一基板（301）和第二基板（302）彼此面对。 第一基板在第一相机模块（100）中。 第二基板位于独立于第一基板的第二相机模块（200）中。 第一和第二基板通过使用NCP（非导电糊）或ACF（各向异性导电膜）以热棒型电连接。 第一和第二基板包括FPCB（柔性印刷电路板）或PCB。