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Patent Agency Ranking
公开(公告)号：KR1020140041045A
公开(公告)日：2014-04-04
申请号：KR1020120107906
申请日：2012-09-27
Applicant: 삼성전기주식회사
Inventor： 반영민
Abstract: The present invention provides a method for manufacturing a circuit board which includes the steps of: preparing an insulation layer; preparing conductive paste; preparing a conductive adhesive film by semi-hardening the conductive paste; attaching the conductive adhesive film on the insulation layer; forming a circuit pattern by etching the conductive adhesive film attached on the insulation layer; and hardening the circuit pattern. [Reference numerals] (S1) Step of preparing an insulation layer; (S2) Step of preparing conductive paste; (S3) Step of preparing a conductive adhesive film by semi-hardening the conductive paste; (S4) Step of attaching the conductive adhesive film on the insulation layer; (S5) Step of forming a circuit pattern by etching the conductive adhesive film; (S6) Step of hardening the circuit pattern
Abstract translation: 本发明提供一种制造电路板的方法，包括以下步骤：制备绝缘层; 制备导电膏; 通过半导电膏来制备导电粘合剂膜; 将导电粘合剂膜附着在绝缘层上; 通过蚀刻附着在绝缘层上的导电粘合膜形成电路图案; 并硬化电路图案。 （附图标记）（S1）制备绝缘层的步骤; （S2）制备导电膏的步骤; （S3）通过半导电性糊料制备导电性粘接膜的工序; （S4）将导电性粘合膜附着在绝缘层上的工序; （S5）通过蚀刻导电性粘合膜形成电路图案的工序; （S6）硬化电路图案的步骤
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公开(公告)号：KR1020140057101A
公开(公告)日：2014-05-12
申请号：KR1020120123786
申请日：2012-11-02
Applicant: 삼성전기주식회사
Inventor： 반영민
Abstract: Disclosed are a printed circuit board and a manufacturing method thereof. According to one aspect of the present invention, provided is the method for manufacturing the printed circuit board, which includes the steps of: preparing a drill device with conductive oil coated on the surface of a drill bit; forming a through hole on a substrate and a conductive layer made of the conductive oil on the inner wall of the through hole.; and forming a via on the inner side of the through hole by performing an electroplating process using the conductive layer as a seed.
Abstract translation: 公开了一种印刷电路板及其制造方法。 根据本发明的一个方面，提供了制造印刷电路板的方法，其包括以下步骤：制备具有涂覆在钻头表面上的导电油的钻孔装置; 在通孔的内壁上形成基板上的通孔和由导电油制成的导电层; 以及通过使用导电层作为种子进行电镀处理，在通孔的内侧形成通孔。
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公开(公告)号：KR101952863B1
公开(公告)日：2019-02-28
申请号：KR1020160112983
申请日：2016-09-02
Applicant: 삼성전기주식회사
IPC: H01L23/31 , H01L23/498 , H01L23/48 , H01L23/525 , H01L23/00
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公开(公告)号：KR1020170143413A
公开(公告)日：2017-12-29
申请号：KR1020160112983
申请日：2016-09-02
Applicant: 삼성전기주식회사
IPC: H01L23/31 , H01L23/498 , H01L23/48 , H01L23/525 , H01L23/00
CPC classification number: H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/18 , H01L2224/73204 , H01L2924/181 , H01L2924/18162 , H01L2924/00012
Abstract: 본개시는관통홀을갖는제1연결부재, 제1연결부재의관통홀에배치되며접속패드가배치된활성면및 활성면의반대측에배치된비활성면을갖는반도체칩, 제1연결부재및 반도체칩의비활성면의적어도일부를봉합하는봉합재, 및제1연결부재및 반도체칩의활성면상에배치된제2연결부재를포함하며, 제1 및제2연결부재는각각접속패드와전기적으로연결된재배선층을포함하고, 반도체칩은접속패드의적어도일부를노출시키는개구부를갖는패시베이션막을포함하며, 제2연결부재의재배선층은비아를통하여접속패드와연결되며, 비아는패시베이션막의적어도일부를덮는, 팬-아웃반도체패키지에관한것이다.
Abstract translation: 本发明是第一连接构件，第一连接设置在贯通孔的半导体芯片bujaeui，第一连接构件和具有设置在所述有源面的相反侧和所述有源表面上的惰性表面的半导体芯片连接到焊盘布置在具有通孔 以及设置在半导体芯片的有源表面上的第一连接构件和第二连接构件，其中第一和第二连接构件各自包括电连接到连接焊盘的重布线层， 包括在内，该半导体芯片包括具有开口的至少暴露所述连接焊盘的一部分的钝化膜，所述第二连接bujaeui再分配层被连接到通过通孔的连接焊盘，所述通孔覆盖所述钝化层至少部分，扇出 到半导体封装。
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公开(公告)号：KR101216164B1
公开(公告)日：2012-12-28
申请号：KR1020110074614
申请日：2011-07-27
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A circuit board and manufacturing method thereof are provided to manufacture a thin type board by controlling a curved state of a circuit board. CONSTITUTION: A circuit board is divided into a circuit area and a dummy area. A circuit is formed on a circuit area(110). A dummy area(120) is arranged around external parts of the circuit area. A plurality of slits is consecutively arranged according to an external end unit of the dummy area. A penetration hole(130) passes through the circuit board for cutting the circuit board as a circuit unit.
Abstract translation: 目的：提供电路板及其制造方法，以通过控制电路板的弯曲状态来制造薄型板。 构成：电路板分为电路区和虚拟区。 电路形成在电路区域（110）上。 虚拟区域（120）围绕电路区域的外部部分布置。 多个狭缝根据虚拟区域的外部端单元连续布置。 穿孔（130）穿过电路板，用于将电路板切割成电路单元。
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