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公开(公告)号：KR1020140025223A
公开(公告)日：2014-03-04
申请号：KR1020120091795
申请日：2012-08-22
Applicant: 삼성전기주식회사
Abstract: Provided is a plating device comprising: a plating tank in which a substrate is stored and a plating solution is charged; an anode arranged inside the plating tank in a state where the bottom is in contact with the bottom surface of the plating tank; an electricity supply part for supplying electricity for plating the substrate to the substrate and the anode; and a plating solution supply part for supplying the plating solution to the plating tank. Also, the present invention provides a substrate plating method comprising: a step of arranging the substrate in a state where the bottom is in contact with the bottom surface of the plating tank; a step of arranging the anode inside the plating tank in a state where the bottom is in contact with the bottom surface of the plating tank; a step of arranging the electricity supply part by which the electricity for plating the substrate is supplied to the substrate and the anode; and a step of supplying the plating solution to the plating tank using the plating solution supply part.
Abstract translation: 本发明提供一种电镀装置，其特征在于，包括：电镀槽，其中存储基板和电镀液; 在底部与镀槽的底面接触的状态下，配置在镀槽内部的阳极; 用于向基板和阳极电镀基板的供电部; 以及用于将电镀液供给到电镀槽的电镀液供给部。 另外，本发明提供一种基板电镀方法，其特征在于，包括：将所述基板配置在所述底部与所述镀槽的底面接触的状态的工序; 在底板与镀槽的底面接触的状态下将阳极配置在电镀槽内的工序; 将用于电镀基板的电力的供电部件配置到基板和阳极的工序; 以及使用电镀液供给部将镀液供给到镀槽的工序。
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公开(公告)号：KR1020130046254A
公开(公告)日：2013-05-07
申请号：KR1020110110731
申请日：2011-10-27
Applicant: 삼성전기주식회사
Abstract: PURPOSE: An inductor is provided to shield electromagnetic interference noise radiating from a pattern for an inductor. CONSTITUTION: An inductor(100) includes an inductor pattern(110), a shielding plate and a plurality of shielding vias(130). The inductor pattern is implemented in a spiral form, and is implemented in a meander or loop form. The inductor pattern includes a plurality of coil patterns(110a-110d), a plurality of coil vias(111a,111b) and two lead-out patterns. The pair of shielding plates are formed in an upper part or a lower part of the inductor pattern. The plurality of shielding vias electrically or mechanically connect the pair of shielding plate located in the upper part or the lower part.
Abstract translation: 目的：提供一个电感器来屏蔽从电感器图案辐射的电磁干扰噪声。 构成：电感器（100）包括电感器图案（110），屏蔽板和多个屏蔽通孔（130）。 电感器图案以螺旋形式实现，并且以曲折或环形式实现。 电感图案包括多个线圈图案（110a-110d），多个线圈通孔（111a，111b）和两个引出图案。 该对屏蔽板形成在电感图案的上部或下部。 多个屏蔽通孔电或机械地连接位于上部或下部的一对屏蔽板。
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公开(公告)号：KR1020140087649A
公开(公告)日：2014-07-09
申请号：KR1020120158175
申请日：2012-12-31
Applicant: 삼성전기주식회사
Abstract: A plating device for a printed circuit board according to an embodiment of the invention comprises a plating bath in which a substrate is installed vertically in a center; an anode which is installed at any one side or both sides of the substrate and is supported through an anode basket; a shielding guide which is formed on and under the anode; and a nozzle which is installed between the substrate and the anode and sprays the plating solution to the substrate. According to the invention, the plating having a uniform thickness can be obtained in a plating process of printed circuit board by preventing the electric field from being concentrated at both ends of the substrate and reducing the plating deviation of the substrate, and the thickness of plating can be controlled partially and differently as needed.
Abstract translation: 根据本发明实施例的用于印刷电路板的电镀装置包括其中基板垂直安装在中心的电镀槽; 阳极，其安装在基板的任一侧或两侧，并通过阳极筐支撑; 形成在阳极上和下面的屏蔽引导件; 以及安装在基板和阳极之间并将电镀溶液喷射到基板的喷嘴。 根据本发明，通过防止电场集中在基板的两端并减小基板的电镀偏差，并且镀层的厚度，可以在印刷电路板的电镀工艺中获得具有均匀厚度的电镀 可以根据需要部分和不同地进行控制。
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公开(公告)号：KR1020130027870A
公开(公告)日：2013-03-18
申请号：KR1020110091369
申请日：2011-09-08
Applicant: 삼성전기주식회사
CPC classification number: H01L2224/11 , H01L2224/13 , H01L23/48 , H01L23/12 , H01L23/488 , H01L2924/00012
Abstract: PURPOSE: A package substrate and a manufacturing method thereof are provided to reduce the number of reflow processes by forming a post bump on a substrate using solder paste melt. CONSTITUTION: A connection pad(140) and a seed layer(150) are formed on the upper side of a substrate(130). The substrate is one of a circuit board, a semiconductor wafer, or an electronic device. A post bump(100) includes a metal post(110) and a solder bump(120). The metal post is formed on the seed layer with one pillar type. The solder bump surrounds both sides of the metal post. The metal post is made of copper.
Abstract translation: 目的：提供一种封装基板及其制造方法，以通过使用焊锡膏熔融在基板上形成凸块来减少回流工艺的数量。 构成：在基板（130）的上侧形成连接焊盘（140）和种子层（150）。 衬底是电路板，半导体晶片或电子器件之一。 凸块（100）包括金属柱（110）和焊料凸块（120）。 金属柱形成在具有一种柱状的种子层上。 焊料凸块围绕金属柱的两侧。 金属柱由铜制成。
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Patent Agency Ranking
公开(公告)号：KR1020150057194A
公开(公告)日：2015-05-28
申请号：KR1020130140210
申请日：2013-11-18
Applicant: 삼성전기주식회사
Abstract: 도금장치가개시된다. 본발명의일 측면에따른도금장치는피도금체를수용하는도금조및 복수의행과열로도금조에분할설치되어각각독립적으로전류가공급되는복수의양극부를포함하며, 각각의양극부는전부또는일부가원형으로형성되는것을특징으로한다.
Abstract translation: 公开了能够最小化待镀产品的镀层厚度偏差的电镀装置。 根据本发明的一个方面的电镀装置包括用于接收待镀产品的电镀槽和分别安装在镀浴中的多行和多列的多个正负极零件。 每个极部分的一部分或全部是圆形。
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公开(公告)号：KR1020140009797A
公开(公告)日：2014-01-23
申请号：KR1020120076608
申请日：2012-07-13
Applicant: 삼성전기주식회사
CPC classification number: C25D17/008 , C25D17/001
Abstract: A plating apparatus according to an embodiment of the present invention includes: a plating bath to which an object being plated is inserted; Anodes arranged on one or both sides of the object being plated, facing each other; first and second plates, the latter positioned next to the former, arranged in between the anodes and the object being plated; a sheltering member where the first plate or the second plate or the first and second plates move along in parellel to each other.
Abstract translation: 根据本发明实施例的电镀装置包括：镀有被镀物体的电镀槽; 布置在正被电镀的物体的一侧或两侧上的阳极彼此面对; 第一和第二板，后者位于前者旁边，布置在阳极和被镀物体之间; 第一板或第二板或第一板和第二板彼此沿着板坯移动的遮蔽构件。
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公开(公告)号：KR1020150140055A
公开(公告)日：2015-12-15
申请号：KR1020140068275
申请日：2014-06-05
Applicant: 삼성전기주식회사
IPC: C25D17/06
Abstract: 도금장치가개시된다. 본발명의일 측면에따른도금장치는피도금체를수용하는도금조, 피도금체를지지하도록도금조에설치되는지지프레임및 자중에의해피도금체에장력을가하도록지지프레임에설치되는중량부를포함한다.
Abstract translation: 公开了电镀装置。 根据本发明的一个方面，电镀装置包括：容纳待镀物体的电镀槽; 安装在电镀槽中以支撑待镀物体的支撑框架; 以及安装在支撑框架中的重量单元，以通过自载装置向被镀物体施加张力。 根据本发明的实施例，提供了通过防止被镀物体弯曲来提高镀层厚度的均匀度的电镀装置。
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公开(公告)号：KR1020150062008A
公开(公告)日：2015-06-05
申请号：KR1020130146483
申请日：2013-11-28
Applicant: 삼성전기주식회사
Abstract: 도금장치가개시된다. 본발명의일 측면에따른도금장치는피도금체와평행하게배치되어각각독립적으로전류가공급되는복수의양극부및 복수의양극부를서로전기적으로차폐시키도록복수의양극부사이에개재되는차폐부를포함한다.
Abstract translation: 公开了电镀装置。 根据本发明的一个方面，电镀装置包括：多个阳极单元，其被布置成平行镀覆的物体，分别独立地供给电流; 以及插入在阳极单元之间以屏蔽阳极单元的屏蔽单元。
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