公开(公告)号：KR1020140019174A

公开(公告)日：2014-02-14

申请号：KR1020120085824

申请日：2012-08-06

Applicant: 삼성전기주식회사

Inventor： 시모지,테루아키 ,  이은혜 ,  김치성 ,  방정윤 ,  남효승 ,  조성민

IPC: H05K3/00 ,  H05K3/18 ,  H05K3/46 ,  H05K3/06 ,  H05K3/10

CPC classification number: H05K3/0085 ,  H05K3/06 ,  H05K3/108 ,  H05K3/181 ,  H05K3/4608

Abstract: The present invention provides a method for manufacturing a printed circuit board by using catalyst solutions for electroless copper plating including copper salt and iodide compounds. According to the present invention, costs are reduced and stability is improved in comparison with the existing palladium catalyst if electroless plating is performed by using the catalyst solutions made of copper salt and iodide compounds. Also, the yield of a product is improved by preventing an insulation defect or a bridge defect of an electroless Ni/Au process in the final process by removing the residues after an etching process if a printed wiring board is manufactured by using the catalyst solutions.

Abstract translation: 本发明提供一种通过使用包含铜盐和碘化物的化学镀铜的催化剂溶液来制造印刷电路板的方法。 根据本发明，通过使用由铜盐和碘化物形成的催化剂溶液进行化学镀，与现有的钯催化剂相比，降低了成本并提高了稳定性。 此外，如果通过使用催化剂溶液制造印刷线路板，则通过在蚀刻工艺之后除去残留物来防止最终工艺中的无电解Ni / Au工艺的绝缘缺陷或桥接缺陷，从而提高产品的产率。

公开(公告)号：KR1020140019175A

公开(公告)日：2014-02-14

申请号：KR1020120085825

申请日：2012-08-06

Applicant: 삼성전기주식회사

Inventor： 시모지,테루아키 ,  이은혜 ,  김치성 ,  방정윤 ,  남효승 ,  조성민

IPC: C23C18/38 ,  C23C18/16 ,  C23C18/40

CPC classification number: C23C18/38 ,  C23C18/1655 ,  C23C18/40

Abstract: Provided in the present invention are a catalyst solution for electroless copper plating, a manufacturing method thereof, and an electroless plating method using the same. When performing electroless plating using a catalyst solution which compounds copper salt with an iodine compound, the catalyst solution has relatively low costs and high safety compared to the conventional palladium catalyst. In addition, when manufacturing a printed circuit board using the catalyst solution, residues do not exist after an etching process. Therefore, the catalyst solution can prevent insulation defects, or bridge defects of an electroless Ni/Au process in the final process, thereby improving the yield rate of products.

Abstract translation: 在本发明中提供了一种用于化学镀铜的催化剂溶液，其制造方法和使用其的化学镀方法。 当使用与碘化合物一起化合铜盐的催化剂溶液进行化学镀时，与常规的钯催化剂相比，催化剂溶液具有相对低的成本和高的安全性。 此外，当使用催化剂溶液制造印刷电路板时，在蚀刻工艺之后不存在残留物。 因此，催化剂溶液可以防止最终工艺中的无电Ni / Au工艺的绝缘缺陷或桥接缺陷，从而提高产品的产率。

公开(公告)号：KR101184558B1

公开(公告)日：2012-09-19

申请号：KR1020100111134

申请日：2010-11-09

Applicant: 삼성전기주식회사

Inventor： 조성민 ,  시모지,테루아키 ,  전동주 ,  김치성 ,  이동준

IPC: C23C18/22 ,  C23C18/32 ,  H05K3/18

Abstract: 본 발명은 무전해 금속 도금의 전처리제 및 이를 이용한 회로 기판의 제조방법에 관한 것으로서, 질소 화합물과 계면 활성제와 유황 화합물과 부촉매를 포함하는 무전해 금속 도금의 전처리제가 개시된다.

公开(公告)号：KR1020120049727A

公开(公告)日：2012-05-17

申请号：KR1020100111134

申请日：2010-11-09

Applicant: 삼성전기주식회사

Inventor： 조성민 ,  시모지,테루아키 ,  전동주 ,  김치성 ,  이동준

IPC: C23C18/22 ,  C23C18/32 ,  H05K3/18

Abstract: PURPOSE: A primer for electroless metal plating and a circuit board manufacturing method using the same are provided to improve the catalyst residue removing performance of a primer and prevent bridge between patterns of a circuit caused by the precipitation of electroless plating. CONSTITUTION: A method for manufacturing a circuit board comprises the steps of: spreading an electroless metal plating catalyst on a base plate, removing the catalyst from the insulating layer of the base plate using a primer for electroless metal plating, and forming a metal plated layer on the base plate through electroless metal plating. The primer comprises nitrogen compound(101), surfactant(102), sulfur compound(103), and anti-catalyst(104).

Abstract translation: 目的：提供一种无电金属电镀底漆和使用该底漆的电路板制造方法，以提高底漆的催化剂残渣去除性能，并防止化学镀沉淀引起的电路图案之间的桥接。 一种电路板的制造方法，其特征在于，包括以下步骤：在基板上涂布无电金属电镀催化剂，使用无电金属电镀用底漆从基板的绝缘层除去催化剂，形成金属镀层 通过无电金属电镀在基板上。 底漆包括氮化合物（101），表面活性剂（102），硫化合物（103）和抗催化剂（104）。