-
公开(公告)号：KR1020130055956A
公开(公告)日：2013-05-29
申请号：KR1020110121656
申请日：2011-11-21
Applicant: 삼성전기주식회사
CPC classification number: C23C18/44 , C23C18/1879
Abstract: PURPOSE: A non-electrolytic palladium plating solution is provided to improve the contact reliability of a solder or wire bonding by improving the adhesion between metal and palladium by gold-plating on the metal a single time. CONSTITUTION: A non-electrolytic palladium plating solution contains a water-soluble palladium salt, the complexing agent, and the reducing agent. The complexing agent ignites palladium. The water-soluble palladium salt contains one or more among palladium chloride, palladium bromide, palladium sulfate, palladium nitrate, and palladium acetate.
Abstract translation: 目的：提供一种非电解镀钯溶液，通过单次金属镀金，改善金属和钯之间的粘合力，提高焊料或引线接合的接触可靠性。 构成：非电解镀钯溶液含有水溶性钯盐，络合剂和还原剂。 络合剂点燃钯。 水溶性钯盐含有氯化钯，溴化钯，硫酸钯，硝酸钯和乙酸钯中的一种或多种。
-
公开(公告)号：KR1020130007022A
公开(公告)日：2013-01-18
申请号：KR1020110062944
申请日：2011-06-28
Applicant: 삼성전기주식회사
CPC classification number: C23C18/1651 , C23C18/1806 , C23C18/1827 , H01L24/45 , H01L24/48 , H01L2224/45015 , H01L2224/45144 , H01L2224/48644 , H01L2224/85444 , H01L2924/00014 , H05K3/244 , H05K2203/072 , H01L2924/00 , H01L2924/207
Abstract: PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve workability of a wire bonding work process connected with an external device. CONSTITUTION: A polymer resin layer(120) is formed in a part except for a copper pad(110). A plating layer(130) for protecting the copper pad includes Ni(131)/Pd(132)/Au(133). The inter connection between metals is formed. A surface of the copper pad is processed in a pitch period of 0.1-1.0 micrometer in order to increase roughness. The non-electrolytic surface process plating layer of the Ni/Pd/Au is formed on the copper pad.
Abstract translation: 目的：提供一种印刷电路板及其制造方法，以提高与外部装置连接的引线接合工作过程的可加工性。 构成：除了铜垫（110）以外的部分中形成聚合物树脂层（120）。 用于保护铜焊盘的镀层（130）包括Ni（131）/ Pd（132）/ Au（133）。 形成金属间的相互连接。 为了增加粗糙度，铜衬垫的表面以0.1-1.0微米的间距加工。 Ni / Pd / Au的非电解表面处理镀层形成在铜垫上。
-
公开(公告)号：KR101055561B1
公开(公告)日：2011-08-08
申请号：KR1020090069597
申请日：2009-07-29
Applicant: 삼성전기주식회사
IPC: H05K1/02
Abstract: 본 발명에 따른 캐비티를 구비한 인쇄회로기판은 하부회로층이 형성된 하부절연층, 및 상기 하부회로층 사이에 캐비티가 형성되도록, 상기 하부회로층 상에 적층되며, 상기 하부회로층과 연결된 비아를 포함하는 상부회로층이 형성된 상부절연층을 포함하여 구성되며, 인쇄회로기판에 캐비티를 채용함으로써, 캐비티의 내부에 공기층이 형성되고 공기는 진공에 가까운 낮은 유전상수(약 1.0005)를 갖기 때문에 회로 사이의 신호간섭을 방지할 수 있는 장점이 있다.
캐비티, 상부절연층, 하부절연층, 하부회로층, 초음파 접합법, 접착층-
公开(公告)号：KR100815361B1
公开(公告)日：2008-03-19
申请号：KR1020070010028
申请日：2007-01-31
Applicant: 삼성전기주식회사
IPC: H05K3/20
CPC classification number: H05K3/3452 , H05K3/0055 , H05K3/027 , H05K2203/0361
Abstract: A method for fabricating a printed circuit board is provided to acquire a uniform process of a solder resist opening unit with a shortened process time by processing a polygonal solder resist opening unit through an imprinting process using a hard mold and processing a circular solder resist opening unit using a laser. A method for fabricating a printed circuit board includes the steps of: providing a printed circuit board having a circular pad and a polygonal pad(S101); forming a solder resist layer on the printed circuit board(S102); providing an imprinting mold of which a structure of a corresponding shape to the polygonal type pad unit of the printed circuit board is formed on a surface(S103); forming a first solder resist opening unit on the solder resist of the polygonal type pad unit of the printed circuit board through an imprinting process using the mold(S104); forming a second solder resist opening unit by removing the solder resist of the circular pad unit of the printed circuit board through a direct laser process(S105); and exposing the pad unit by removing the residue of the first and second solder resist opening units through a desmear process(S106).
Abstract translation: 提供了一种制造印刷电路板的方法，通过使用硬模具进行压印加工处理多边形阻焊剂开口单元，以缩短处理时间来获得阻焊剂开口单元的均匀处理，并处理圆形阻焊剂开口单元 使用激光。 一种制造印刷电路板的方法包括以下步骤：提供具有圆形焊盘和多边形焊盘的印刷电路板（S101）; 在印刷电路板上形成阻焊层（S102）; 提供在表面上形成与印刷电路板的多边形焊盘单元相对应的形状的结构的压印模具（S103）; 通过使用该模具的印刷工艺在印刷电路板的多边形焊盘单元的阻焊剂上形成第一阻焊剂开口单元（S104）; 通过直接激光处理去除印刷电路板的圆形焊盘单元的阻焊剂，形成第二阻焊剂开口单元（S105）; 以及通过去污处理（S106）除去第一和第二阻焊剂开口单元的残留物来暴露焊盘单元。
-
公开(公告)号：KR100807471B1
公开(公告)日：2008-02-25
申请号：KR1020060119074
申请日：2006-11-29
Applicant: 삼성전기주식회사
IPC: H05K3/14
CPC classification number: H05K3/143 , H05K3/3452
Abstract: A method for fabricating a printed circuit board is provided to reduce cost and enhance productivity by forming a solder-resist opening unit without a separate solder-resist opening process. A method for fabricating a printed circuit board(101) includes the steps of: providing the printed circuit board with a circuit pattern(103) including a pad unit(102) to install a semiconductor and to connect with an external component; providing a panel(104) having a pattern shape corresponding to the pad unit; stacking the panel on the printed circuit board after arranging the panel so as to place the pattern of the panel on the pad unit of the printed circuit board; applying and charging a liquid thermosetting solder-resist between the panel and the printed circuit board; forming a solder-resist layer(105) by thermally curing the solder-resist; and separating the panel from the printed circuit board and exposing the pad unit through a solder-resist opening unit.
Abstract translation: 提供了一种用于制造印刷电路板的方法，通过在不具有单独的阻焊剂打开工艺的情况下形成阻焊剂开口单元来降低成本并提高生产率。 一种用于制造印刷电路板（101）的方法，包括以下步骤：为印刷电路板提供包括用于安装半导体并与外部部件连接的焊盘单元（102）的电路图案（103） 提供具有对应于所述垫单元的图案形状的面板（104）; 在布置面板之后将面板堆叠在印刷电路板上，以将面板的图案放置在印刷电路板的垫单元上; 在面板和印刷电路板之间施加和充填液体热固性阻焊剂; 通过热固化所述阻焊剂形成阻焊层（105）; 以及将所述面板与所述印刷电路板分离并通过阻焊剂开口单元暴露所述衬垫单元。
-
Patent Agency Ranking
公开(公告)号：KR1020130056629A
公开(公告)日：2013-05-30
申请号：KR1020110122342
申请日：2011-11-22
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A substrate and a manufacturing method thereof are provided to improve stability of electroless palladium by including a surface plating layer which is plated with reduced electroless gold on wirings of the substrate. CONSTITUTION: A substrate includes a circuit pattern(10), a nickel layer(20), a gold layer(30), a palladium layer(40), and a surface gold plating layer(50). The circuit pattern is formed with copper or silver. The substrate includes a connection terminal to the outside. The connection terminal is formed by solder bonding or wire bonding.
Abstract translation: 目的：提供一种基板及其制造方法，以通过包括在基板的布线上镀有还原的无电金的表面镀层来提高化学镀钯的稳定性。 构成：基板包括电路图案（10），镍层（20），金层（30），钯层（40）和表面镀金层（50）。 电路图案由铜或银形成。 基板包括到外部的连接端子。 连接端子通过焊接或引线键合形成。
-
-
公开(公告)号：KR1020120078181A
公开(公告)日：2012-07-10
申请号：KR1020100140398
申请日：2010-12-31
Applicant: 삼성전기주식회사
Abstract: PURPOSE: An electroless Ni/Pd/Au plated structure is provided to improve soldering reliability by controlling the content of P in electroless Ni-plated and Pd-plated films. CONSTITUTION: An electroless Ni/Pd/Au plated structure comprises an electroless Ni-plated film, an electroless Pd-plated film, and an electroless Au-plated film. The thickness of the electroless Ni, Pd, and Au-plated films is 0.01-0.1 micrometers. Less than 5 weight% of phosphorus is contained in the electroless Ni and Pd plated films.
Abstract translation: 目的：提供无电Ni / Pd / Au镀层结构，通过控制无电解镀镍和镀Pd膜中的P含量来提高焊接的可靠性。 构成：无电Ni / Pd / Au镀层结构包括无电解镀镍膜，无电解Pd镀膜和无电镀金膜。 化学镀Ni，Pd和镀Au膜的厚度为0.01-0.1微米。 化学镀镍和Pd镀膜中含有少于5重量％的磷。
-
公开(公告)号：KR1020120049727A
公开(公告)日：2012-05-17
申请号：KR1020100111134
申请日：2010-11-09
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A primer for electroless metal plating and a circuit board manufacturing method using the same are provided to improve the catalyst residue removing performance of a primer and prevent bridge between patterns of a circuit caused by the precipitation of electroless plating. CONSTITUTION: A method for manufacturing a circuit board comprises the steps of: spreading an electroless metal plating catalyst on a base plate, removing the catalyst from the insulating layer of the base plate using a primer for electroless metal plating, and forming a metal plated layer on the base plate through electroless metal plating. The primer comprises nitrogen compound(101), surfactant(102), sulfur compound(103), and anti-catalyst(104).
Abstract translation: 目的：提供一种无电金属电镀底漆和使用该底漆的电路板制造方法，以提高底漆的催化剂残渣去除性能，并防止化学镀沉淀引起的电路图案之间的桥接。 一种电路板的制造方法，其特征在于，包括以下步骤：在基板上涂布无电金属电镀催化剂，使用无电金属电镀用底漆从基板的绝缘层除去催化剂，形成金属镀层 通过无电金属电镀在基板上。 底漆包括氮化合物（101），表面活性剂（102），硫化合物（103）和抗催化剂（104）。
-
公开(公告)号：KR101109216B1
公开(公告)日：2012-01-30
申请号：KR1020100018901
申请日：2010-03-03
Applicant: 삼성전기주식회사
Abstract: 본 발명은 인쇄회로기판의 제조방법에 관한 것으로, (A) 적어도 일면에 금속박이 형성된 캐리어를 준비하는 단계, (B) 상기 금속박에 제1 보호층을 형성하고, 상기 제1 보호층에 제1 오픈부를 형성하는 단계, (C) 상기 제1 오픈부가 형성된 상기 제1 보호층에 회로층을 형성하는 단계, (D) 상기 회로층이 형성된 상기 제1 보호층에 빌드업층을 형성하고, 상기 빌드업층에 제2 보호층을 형성하는 단계, 및 (E) 상기 금속박을 상기 캐리어로부터 분리하고, 상기 금속박을 제거하는 단계를 포함하는 것을 특징으로 하며, 캐리어와 인쇄회로기판을 분리하기 전 제1 보호층에 제1 오픈부를 형성하여, 인쇄회로기판이 휘거나 파손되는 것을 방지하는 인쇄회로기판의 제조방법을 제공한다.
-
-
-
-
-
-
-
-
-
Search Results
42
records
(took 0.023 seconds)
