公开(公告)号：KR1020140043955A

公开(公告)日：2014-04-14

申请号：KR1020120105298

申请日：2012-09-21

Applicant: 삼성전기주식회사

Inventor： 방정윤 ,  시모지테루아키 ,  이은혜 ,  조성민 ,  김치성

IPC: H01L23/00 ,  H05K3/24 ,  H01L23/12 ,  B32B15/01 ,  B32B15/04 ,  C22C5/02 ,  C22C5/04

CPC classification number: B32B15/018 ,  B32B15/043 ,  C22C5/02 ,  C22C5/04 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1844 ,  C23C18/42 ,  C23C18/44 ,  C23C18/54 ,  C23C28/021 ,  C23C28/023 ,  C25D5/10 ,  H01L24/00 ,  H05K3/244 ,  H05K2201/09472 ,  Y10T428/12396 ,  Y10T428/12514 ,  Y10T428/12868 ,  Y10T428/12875 ,  H01L24/81 ,  H01L23/12 ,  H01L24/11 ,  H01L2224/2746 ,  H01L2224/32225

Abstract: The present invention relates to an electrode pad, a printed circuit board using the same pad, and a method for manufacturing the printed circuit board. According to one embodiment of the present invention, the electrode pad includes a connection terminal part; a first plating layer including palladium phosphorus (Pd-P); and a second plating layer including palladium (Pd). According to one embodiment of the present invention, the first plating layer including palladium phosphorus (Pd-P) is formed on the connection terminal part. The second plating layer including palladium (Pd) is formed on the first plating layer.

Abstract translation: 本发明涉及电极焊盘，使用该焊盘的印刷电路板以及印刷电路板的制造方法。 根据本发明的一个实施例，电极焊盘包括连接端子部分; 包括钯磷（Pd-P）的第一镀层; 和包含钯（Pd）的第二镀层。 根据本发明的一个实施例，在连接端子部分上形成包括钯磷（Pd-P）的第一镀层。 包括钯（Pd）的第二镀层形成在第一镀层上。

公开(公告)号：KR1020120078181A

公开(公告)日：2012-07-10

申请号：KR1020100140398

申请日：2010-12-31

Applicant: 삼성전기주식회사

Inventor： 이동준 ,  시모지테루아키 ,  김치성 ,  전동주 ,  조성민 ,  방정윤 ,  김정석

IPC: C23C18/31 ,  C23C18/16

Abstract: PURPOSE: An electroless Ni/Pd/Au plated structure is provided to improve soldering reliability by controlling the content of P in electroless Ni-plated and Pd-plated films. CONSTITUTION: An electroless Ni/Pd/Au plated structure comprises an electroless Ni-plated film, an electroless Pd-plated film, and an electroless Au-plated film. The thickness of the electroless Ni, Pd, and Au-plated films is 0.01-0.1 micrometers. Less than 5 weight% of phosphorus is contained in the electroless Ni and Pd plated films.

Abstract translation: 目的：提供无电Ni / Pd / Au镀层结构，通过控制无电解镀镍和镀Pd膜中的P含量来提高焊接的可靠性。 构成：无电Ni / Pd / Au镀层结构包括无电解镀镍膜，无电解Pd镀膜和无电镀金膜。 化学镀Ni，Pd和镀Au膜的厚度为0.01-0.1微米。 化学镀镍和Pd镀膜中含有少于5重量％的磷。

公开(公告)号：KR1020130055956A

公开(公告)日：2013-05-29

申请号：KR1020110121656

申请日：2011-11-21

Applicant: 삼성전기주식회사

Inventor： 시모지테루아키 ,  이은혜 ,  이동준 ,  전동주 ,  김치성 ,  방정윤 ,  김정석 ,  조성민

IPC: C23C18/44 ,  C23C18/48

CPC classification number: C23C18/44 ,  C23C18/1879

Abstract: PURPOSE: A non-electrolytic palladium plating solution is provided to improve the contact reliability of a solder or wire bonding by improving the adhesion between metal and palladium by gold-plating on the metal a single time. CONSTITUTION: A non-electrolytic palladium plating solution contains a water-soluble palladium salt, the complexing agent, and the reducing agent. The complexing agent ignites palladium. The water-soluble palladium salt contains one or more among palladium chloride, palladium bromide, palladium sulfate, palladium nitrate, and palladium acetate.

Abstract translation: 目的：提供一种非电解镀钯溶液，通过单次金属镀金，改善金属和钯之间的粘合力，提高焊料或引线接合的接触可靠性。 构成：非电解镀钯溶液含有水溶性钯盐，络合剂和还原剂。 络合剂点燃钯。 水溶性钯盐含有氯化钯，溴化钯，硫酸钯，硝酸钯和乙酸钯中的一种或多种。

公开(公告)号：KR1020140032244A

公开(公告)日：2014-03-14

申请号：KR1020120098910

申请日：2012-09-06

Applicant: 삼성전기주식회사

Inventor： 김치성 ,  남효승 ,  이은혜 ,  방정윤 ,  시모지테루아키 ,  조성민

IPC: H05K3/28 ,  H05K3/18 ,  B32B15/088

CPC classification number: H05K3/284 ,  B32B15/088 ,  H05K3/181 ,  H05K2201/0154 ,  H05K2203/1383

Abstract: According to the present invention, provided is a method for manufacturing a PCB, which includes the steps of: providing a substrate which includes pads on both sides thereof and solder resists to expose each pad on both sides thereof; forming a first protection film with chemical resistance and heat resistance on one side of the substrate to cover the pad; firstly treating the surface of the pad formed on the other side of the substrate; forming a second protection film with chemical resistance and heat resistance on the other side of the substrate to cover the pad; separating the first protection film; and secondly treating the surface of the pad formed on one side of the substrate.

Abstract translation: 根据本发明，提供了一种用于制造PCB的方法，其包括以下步骤：提供包括其两侧的焊盘和阻焊剂的衬底，以暴露其两侧的每个焊盘; 在所述基板的一侧上形成具有耐化学性和耐热性的第一保护膜以覆盖所述垫; 首先处理形成在基板的另一侧上的焊盘的表面; 在所述基板的另一侧上形成具有耐化学性和耐热性的第二保护膜以覆盖所述垫; 分离第一保护膜; 并且其次处理形成在衬底的一侧上的衬垫的表面。