公开(公告)号：KR1020140055094A

公开(公告)日：2014-05-09

申请号：KR1020120121434

申请日：2012-10-30

Applicant: 삼성전기주식회사

Inventor： 김종만 ,  홍창섭 ,  임순규 ,  장경란

IPC: H01L27/16

Abstract: The present invention relates to a thermal conduction module. A thermal conduction module according to an embodiment of the present invention may include a frame for thermal conduction which includes a first surface and a second surface which face each other; a lead frame which is located on the first surface of the frame for thermal conduction and is attached by a lead frame bonding member which includes thermal conduction filler; a device which is attached onto the lead frame by a conductive bonding member; and a heat sink which is attached to the second surface of the frame for thermal conduction.

Abstract translation: 本发明涉及一种导热模块。 根据本发明的实施例的热传导模块可以包括用于热传导的框架，其包括彼此面对的第一表面和第二表面; 引线框架，其位于用于热传导的框架的第一表面上，并且通过包括导热填料的引线框架接合构件附接; 通过导电接合构件附接到引线框架上的装置; 以及附接到框架的第二表面以用于热传导的散热器。

公开(公告)号：KR101443970B1

公开(公告)日：2014-09-23

申请号：KR1020120121184

申请日：2012-10-30

Applicant: 삼성전기주식회사

Inventor： 김종만 ,  홍창섭 ,  임순규 ,  장경란

IPC: H01L23/15 ,  H01L23/12

CPC classification number: H01L2924/0002 ,  H01L2924/00

Abstract: 본 발명에 따른 전력 모듈 패키지는 일면 및 타면을 갖고, 상기 일면에 두께 방향으로 적어도 하나 이상의 홈이 형성된 금속판, 상기 금속판 일면에 접합된 세라믹판, 상기 금속판 타면에 형성된 절연층, 상기 절연층 상에 형성된 회로패턴 및 상기 회로패턴 상에 실장된 반도체칩을 포함한다.

公开(公告)号：KR101474067B1

公开(公告)日：2014-12-17

申请号：KR1020120121434

申请日：2012-10-30

Applicant: 삼성전기주식회사

Inventor： 김종만 ,  홍창섭 ,  임순규 ,  장경란

IPC: H01L27/16

Abstract: 본발명은열전도모듈에관한것으로서, 본발명의일 실시형태에따른열전도모듈은서로대향하는제1면및 제2면을포함하는열전도용프레임; 상기열전도용프레임의제1면상에위치하며, 열전도필러를포함하는리드프레임접착부재에의해부착된리드프레임; 상기리드프레임상에도전성접착부재에의해부착된소자; 및상기열전도용프레임의제2면에부착되는히트싱크; 를포함할수 있다.

公开(公告)号：KR1020140055000A

公开(公告)日：2014-05-09

申请号：KR1020120121184

申请日：2012-10-30

Applicant: 삼성전기주식회사

Inventor： 김종만 ,  홍창섭 ,  임순규 ,  장경란

IPC: H01L23/15 ,  H01L23/12

CPC classification number: H01L2924/0002 ,  H01L2924/00

Abstract: A power module package according to the present invention comprises a metal plate which comprises one side and the other side and which has at least one groove on one side in the thickness direction; a ceramic plate joined to one side of the metal plate; an insulation layer on the other side of the metal plate; a circuit pattern formed on the insulation layer; and a semiconductor chip mounted on the circuit pattern.

Abstract translation: 根据本发明的功率模块封装包括金属板，其包括一侧和另一侧，并且在厚度方向的一侧具有至少一个槽; 连接到金属板的一侧的陶瓷板; 金属板另一侧的绝缘层; 形成在所述绝缘层上的电路图案; 以及安装在电路图案上的半导体芯片。

公开(公告)号：KR1020140040883A

公开(公告)日：2014-04-04

申请号：KR1020120107093

申请日：2012-09-26

Applicant: 삼성전기주식회사

Inventor： 장경란 ,  이강현

IPC: G01R1/04 ,  G01R31/26

Abstract: Disclosed is a jig for a performance tester of a semiconductor package, including: a body provided with a guide section; a mounting stand disposed on the guide section to be able to slide and on which the semiconductor package is mounted; and a pin block disposed on an external side of the mounting stand to be able to slide in the guide section and having a plurality of pins connected to a connection pin which is mounted on the semiconductor package.

Abstract translation: 公开了一种用于半导体封装的性能测试器的夹具，包括：本体，其设置有引导部分; 设置在所述引导部上以能够滑动并且所述半导体封装被安装在其上的安装台; 以及销块，其设置在所述安装台的外侧上，以能够在所述引导部分中滑动并且具有连接到安装在所述半导体封装上的连接销的多个销。