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公开(公告)号：KR1020130002124A
公开(公告)日：2013-01-07
申请号：KR1020110063176
申请日：2011-06-28
Applicant: 삼성전기주식회사
Inventor： 정종술
Abstract: PURPOSE: An apparatus and a method for separating a substrate are provided to remove a junction part for prevent the penetration of foreign materials. CONSTITUTION: A substrate support part(110) comprises a laminate. A laminated substrate is formed on a carrier member. A plate corner separating part(120) comprises a substrate cutting unit and a substrate bending unit. The substrate cutting unit cuts the laminated substrate edge portion of the laminate. The substrate bending unit forms a gap between the laminated substrate and carrier member. A substrate separation part(130) is inserted into a gap formed between the laminated substrate and carrier member. The substrate separation part separates the laminated substrate from carrier member. [Reference numerals] (125) Air storage unit; (127) Control part; (127a) First driving unit; (127b) Second driving unit; (127c) Third driving unit
Abstract translation: 目的：提供用于分离基板的装置和方法，以去除接合部分以防止异物渗透。 构成：衬底支撑部分（110）包括层压体。 层叠基板形成在承载构件上。 板角分离部（120）包括基板切割单元和基板弯曲单元。 基板切割单元切割层压体的层叠基板边缘部分。 基板弯曲单元在层压基板和承载构件之间形成间隙。 将基板分离部（130）插入形成在层叠基板和承载部件之间的间隙中。 基板分离部将层叠基板与载体部件分离。 （附图标记）（125）空气存储单元; （127）控制部分; （127a）第一驱动单元; （127b）第二驱动单元; （127c）三驱动单元
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公开(公告)号：KR1020130008488A
公开(公告)日：2013-01-22
申请号：KR1020120101496
申请日：2012-09-13
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A method for manufacturing a carrier member, and a printed circuit board manufacturing method using the same are provided to prevent a release layer form being separated caused by external shock as the release layer is not exposed to the outside. CONSTITUTION: An insulating material(101) is prepared. A second metal layer(103b) is formed on a first metal layer(103a). The first metal layer is in contact with the surface of the insulating material. The metal layers are laminated on the upper or lower surface of the insulating material. The outer edge of the second metal layer is removed. The outer edge of the first metal layer is removed.
Abstract translation: 目的：提供一种用于制造载体部件的方法和使用该方法的印刷电路板制造方法，以防止由于剥离层不暴露于外部而由外部冲击引起的剥离层形式分离。 构成：制备绝缘材料（101）。 在第一金属层（103a）上形成第二金属层（103b）。 第一金属层与绝缘材料的表面接触。 金属层层叠在绝缘材料的上表面或下表面上。 去除第二金属层的外边缘。 去除第一金属层的外边缘。
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公开(公告)号：KR1019950017066A
公开(公告)日：1995-07-20
申请号：KR1019930032214
申请日：1993-12-31
Applicant: 삼성전기주식회사
Inventor： 정종술
IPC: B23P15/00
Abstract: 이 발명은 튜너샤시용 잭 삽입장치에 관한 것으로서, 잭에 형성된 리드의 방향을 맞추어 튜너샤시에 수작업으로 일일히 삽입고정함으로써 조립작업이 번거롭고 단조로워 작업능률 및 생산성의 향상을 기할 수 없으며, 수작업으로 이루어지기 때문에 균일한 튜너를 얻기 어려워 제품의 신뢰성 및 품질향상을 꾀할 수 없는 종래의 문제점을 해결하고자 한다. 이를 해결하기 위하여 이 발병은, 잭을 부품공급용 피이더로 분리하고 잭 반전장치로 반전시킨 후 잭의 리드위치를 리드검출용 센서와 스텝핑 모터로 잭을 회전시켜 일정한 위치에서 정지하여 튜너샤시에 삽입함으로써 잭이 자동으로 연속적인 일괄작업으로 이루어지고 이에 따라서 작업능률 및 생산성의 향상은 물론 품질향상을 꾀할 수 있으며, 잭의 리드를 일정한 방향으로 선별하여 삽입하는 조립작업의 어려움이 없도록 한 것이다.
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公开(公告)号：KR101216926B1
公开(公告)日：2012-12-28
申请号：KR1020110069024
申请日：2011-07-12
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A carrier member, manufacturing method, and PCB(printed circuit board) manufacturing method using the same are provided to prevent a gap from being generated in a release layer by preventing the release layer from being exposed to the outside. CONSTITUTION: A first metal plate(103a) is formed on an upper surface or a lower surface of an insulation material. A second metal plate(103b) is exposed to a boundary of the first metal plate. A second insulation material is formed on a first insulation material. A release film is formed on an inner surface where the first insulation material faces to the second insulation material. A release layer(103c) is formed between the first metal plate and the second metal plate.
Abstract translation: 目的：提供一种使用其的载体构件，制造方法和PCB（印刷电路板）制造方法，以通过防止剥离层暴露于外部来防止在剥离层中产生间隙。 构成：第一金属板（103a）形成在绝缘材料的上表面或下表面上。 第二金属板（103b）暴露于第一金属板的边界。 在第一绝缘材料上形成第二绝缘材料。 在第一绝缘材料面向第二绝缘材料的内表面上形成剥离膜。 在第一金属板和第二金属板之间形成剥离层（103c）。
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Patent Agency Ranking
公开(公告)号：KR1020110045961A
公开(公告)日：2011-05-04
申请号：KR1020090102735
申请日：2009-10-28
Applicant: 삼성전기주식회사
Inventor： 정종술
Abstract: PURPOSE: A dust removing apparatus of a circuit board is provided to prevent scratch from becoming left on the circuit board since the height of a brush is automatically controlled regardless of the thickness of the circuit board. CONSTITUTION: A dust removing apparatus(100) of a circuit board(10) comprises a dust collecting unit(110), a vacuum unit(120) and a removing unit(130). The dust collecting unit is formed on the moving path of the circuit board. The dust collecting unit comprises a space. The vacuum unit sucks dust from the inside of the dust collecting unit and the top of the circuit board and discharges it from the inside to the outside of the dust collecting unit. The removing unit comprises a brush(132) and an elastic member(134). The brush makes contact with the circuit board and separates dust from the circuit board. For the brush not to leave a scratch on the circuit board, the elastic member controls tension.
Abstract translation: 目的：提供一种电路板的除尘装置，以防止划痕在电路板上残留，因为电刷的高度与电路板的厚度无关地被自动控制。 构成：电路板（10）的除尘装置（100）包括集尘单元（110），真空单元（120）和拆卸单元（130）。 集尘单元形成在电路板的移动路径上。 集尘单元包括一个空间。 真空单元从集尘单元的内部和电路板的顶部吸入灰尘，并将其从集尘单元的内部排放到外部。 除去单元包括刷子（132）和弹性构件（134）。 电刷与电路板接触，并与电路板分离灰尘。 为了刷子不要在电路板上划伤，弹性部件控制张力。
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公开(公告)号：KR100875237B1
公开(公告)日：2008-12-19
申请号：KR1020070094159
申请日：2007-09-17
Applicant: 삼성전기주식회사
IPC: B29C43/02
CPC classification number: B29C43/56 , B29C43/34 , B29C43/52 , B29C2043/3422 , B29C2043/561 , B29C2043/5808
Abstract: A press apparatus for molding an electronic component package is provided to maintain constant molding temperature in a mold and automatically control the pressure of the mold by adjusting the mold pressure through a pressure sensor. A press apparatus for molding an electronic component package comprises an upper support(100) in which an upper mold(10) having a chip fixing chamber(12) is combined, a lower support(200) in which a lower mold(20) having a molding chamber(22) is combined, a vertical support(300) in which the upper and lower supports are mounted, a pressurization transfer part(400) which vertically transfers the lower support to the top, and a vacuum pump(600) delivering the vacuum pressure to the chip fixing chamber and the molding chamber of the mold through a vacuum control valve(30) connected to one sides of the upper and lower molds mounted on the upper and lower supports.
Abstract translation: 提供了一种用于模制电子部件封装的压制装置，以在模具中保持恒定的模制温度，并通过压力传感器调节模具压力来自动控制模具的压力。 一种用于模制电子部件封装的压制装置，包括：上部支撑件（100），其中组合有具有芯片固定室（12）的上模具（10），下部支撑件（200），下部模具（20） 组合成型室（22），安装有上下支撑件的垂直支撑件（300），将下支撑件垂直地传递到顶部的加压转移部件（400）和输送 通过连接到安装在上下支架上的上模具和下模具的一侧的真空控制阀（30）向模具固定室和模具的模腔提供真空压力。
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公开(公告)号：KR100790729B1
公开(公告)日：2008-01-02
申请号：KR1020060125826
申请日：2006-12-11
Applicant: 삼성전기주식회사
IPC: C23C16/00 , H01L21/205
CPC classification number: C23C16/458
Abstract: A chemical vapor deposition apparatus is provided to manufacture a large quantity of substrates having uniform growth rate and composition by increasing the stacking number of the substrates as deposition objects in limited internal space without expanding outer diameters of substrate holding parts. A chemical vapor deposition apparatus(100) comprises an external chamber(110) having a gas inflow part(111) and a gas exhaust part(113), an internal chamber(120) which has disposition holes(122) formed in an outer surface thereof correspondingly to a vertical surface of the external chamber and is disposed inside the external chamber, a heating part(130) disposed inside the internal chamber to provide the internal chamber with heat, substrate holding parts(140) which are rotatably disposed in the disposition holes to hold at least one substrate(2), and a drive part(150) which is connected to the substrate holding parts by means of power transfer unit to provide the substrate holding parts with power to rotate the substrate holding parts.
Abstract translation: 提供了一种化学气相沉积装置，用于通过在不扩大基板保持部件的外径的情况下，将有限的内部空间中作为沉积物体的基板的堆叠数量增加而制造具有均匀生长速度和组成的大量基板。 化学气相沉积装置（100）包括具有气体流入部分（111）和气体排出部分（113）的外部室（110），内部室（120），其具有形成在外表面 并且设置在所述外部室内，加热部（130），其设置在所述内部室内部以向所述内部室提供热量的基板保持部（140），所述基板保持部（140）可旋转地配置在所述外部室 用于保持至少一个基板（2）的孔，以及通过动力传递单元连接到基板保持部分的驱动部分（150），以向基板保持部分提供转动基板保持部分的动力。
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公开(公告)号：KR1020130008487A
公开(公告)日：2013-01-22
申请号：KR1020120101495
申请日：2012-09-13
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A carrier member is provided to prevent a release layer from being exposed to the outside by forming a build-up layer. CONSTITUTION: A first metal layer(103a) is formed on the upper surface or lower surface of an insulating material(101). A second metal layer(103b) is formed on the first metal layer. The outer edge of the first metal layer is exposed to the outside.
Abstract translation: 目的：提供一种载体构件，用于通过形成堆积层来防止释放层暴露于外部。 构成：在绝缘材料（101）的上表面或下表面上形成第一金属层（103a）。 在第一金属层上形成第二金属层（103b）。 第一金属层的外边缘暴露于外部。
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