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    회로 기판 제조 방법
    2.
    发明公开
    회로 기판 제조 방법 无效
    一种用于制造电路板的方法

    公开(公告)号：KR1020130041527A

    公开(公告)日：2013-04-25

    申请号：KR1020110105835

    申请日：2011-10-17

    Applicant: 삼성전기주식회사

    Inventor： 김승락 ,  김병찬 ,  이상민 ,  조기희

    IPC: H05K3/46 ,  H05K1/18

    Abstract: PURPOSE: A method for manufacturing a circuit board is provided to prevent a short by uniformly supplying illuminance to the inner bottom of a cavity. CONSTITUTION: A processing block layer(120) is formed in an insulation layer(110). A circuit pattern(114) and a solder resist(112) are formed on the surface of the insulation layer. A cavity(130) is formed in the insulation layer. The processing block layer is removed by etching the cavity.

    Abstract translation: 目的：提供一种用于制造电路板的方法，以通过均匀地向腔体的内底部提供照度来防止短路。 构成：在绝缘层（110）中形成处理阻挡层（120）。 在绝缘层的表面上形成电路图案（114）和阻焊剂（112）。 在绝缘层中形成空腔（130）。 通过蚀刻空腔去除加工块层。

    솔더레지스트 시프트 쿠폰이 삽입된 인쇄회로기판 및 그 제조방법, 및 인쇄회로기판의 검사방법
    3.
    发明授权
    솔더레지스트 시프트 쿠폰이 삽입된 인쇄회로기판 및 그 제조방법, 및 인쇄회로기판의 검사방법 失效
    具有耐焊接移位机的印刷电路板及其制造方法以及使用其测试基板的方法

    公开(公告)号：KR101084931B1

    公开(公告)日：2011-11-17

    申请号：KR1020100064365

    申请日：2010-07-05

    Applicant: 삼성전기주식회사

    Inventor： 임병욱 ,  윤경로 ,  이상민 ,  조기희 ,  허혁

    IPC: H05K1/02 ,  H05K3/28 ,  H05K13/08

    Abstract: PURPOSE: A printed circuit board with solder-resist shift coupon and a method of manufacturing the thereof, and a method for testing substrate using the same are provided to determine whether a position for forming a solder resist by manufacturing a printed circuit board having a solder resist shift coupon inserted therein. CONSTITUTION: In a printed circuit board with solder-resist shift coupon and a method of manufacturing the thereof, and a method for testing substrate using the same, at least one solder resist shift coupons is included in a dummy part. The shift coupon is a polygonal conductive metal. A solder resist layer(11) is formed in the inner side of a polygonal coupon pattern. A surface processing layer(13) forms on the shift coupon pattern.

    Abstract translation: 目的：提供一种具有阻焊移位优惠券的印刷电路板及其制造方法，以及使用其制造基板的方法，以通过制造具有焊料的印刷电路板来确定形成阻焊剂的位置 抵抗偏移券插入其中。 构成：在具有阻焊移位试样的印刷电路板及其制造方法中，以及使用其制造基板的方法，至少一个阻焊层偏移试样被包括在虚拟部分中。 转移券是多边形导电金属。 在多边形试样图案的内侧形成阻焊层（11）。 在换板券图案上形成表面处理层（13）。

    회로 기판 및 그 제조 방법, 그리고 상기 회로 기판을 구비하는 반도체 패키지 및 그 제조 방법
    4.
    发明公开
    회로 기판 및 그 제조 방법, 그리고 상기 회로 기판을 구비하는 반도체 패키지 및 그 제조 방법 失效
    用于制造电路板的电路板和方法以及与电路板的半导体封装以及用于制造半导体封装的方法

    公开(公告)号：KR1020120017602A

    公开(公告)日：2012-02-29

    申请号：KR1020100080299

    申请日：2010-08-19

    Applicant: 삼성전기주식회사

    Inventor： 이상민 ,  윤경로 ,  허혁 ,  조기희 ,  임병욱

    IPC: H05K3/34 ,  H01L21/60

    CPC classification number: H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/00014

    Abstract: PURPOSE: A circuit board, and a manufacturing method thereof, a semiconductor package with the circuit board, and a method for manufacturing the semiconductor package are provided to improve the degree of the integration of a semiconductor package by bonding a part of an outer connecting terminal, which enters a core substrate, to the core substrate. CONSTITUTION: A concave depression(112) of a dimple shape is formed at a core substrate(110). An external bonding pad(144) covers a surface of the depression at an uniform thickness. A solder resist pattern(150) covers the core substrate to expose the external bonding pad. A circuit pattern(146) is formed on the surface of the core substrate. A conductive via(142) is electrically connected to the circuit pattern and the external bonding pad.

    Abstract translation: 目的：提供一种电路板及其制造方法，具有电路板的半导体封装以及半导体封装的制造方法，以通过将外部连接端子的一部分进行接合来提高半导体封装的集成度 ，其进入芯基板。 构成：在芯基板（110）处形成凹坑形状的凹陷（112）。 外部接合焊盘（144）以均匀的厚度覆盖凹部的表面。 阻焊剂图案（150）覆盖芯基板以暴露外部接合焊盘。 在芯基板的表面上形成电路图案（146）。 导电通孔（142）电连接到电路图案和外部接合焊盘。

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