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公开(公告)号：KR1020120010413A
公开(公告)日：2012-02-03
申请号：KR1020100071933
申请日：2010-07-26
Applicant: 삼성전기주식회사
Inventor： 허혁
CPC classification number: H01L23/481 , H01L23/28 , H01L23/522 , H01L24/26
Abstract: PURPOSE: A package using printed circuit board with a through hole is provided to improve the reliability of a package by discharging an air in the interface between a chip mounting area and a molding area outside. CONSTITUTION: A circuit pattern(120) and a solder resist layer(130) are formed in the top side and bottom of an insulating layer(110). A vertical through hole(102) for air extrusion is formed in the chip mounting range(101) of a printed circuit substrate(100). The vertical through hole comprise a penetration hole having a diameter of 50~150μm. A chip(150) is mounted in the chip mounting region of the printed circuit board. An adhesive film(160) is arranged between the top side and bottom side of the chip mounting region in the printed circuit board.
Abstract translation: 目的：提供使用具有通孔的印刷电路板的封装，以通过在芯片安装区域和外部的模制区域之间的界面中排出空气来提高封装的可靠性。 构成：在绝缘层（110）的顶侧和底部形成电路图案（120）和阻焊层（130）。 在印刷电路基板（100）的芯片安装范围（101）中形成用于空气挤压的垂直通孔（102）。 垂直通孔包括直径为50〜150μm的贯通孔。 芯片（150）安装在印刷电路板的芯片安装区域中。 在印刷电路板的芯片安装区域的顶侧和底侧之间布置粘合膜（160）。
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2.发明公开
公开(公告)号：KR1020120017602A
公开(公告)日：2012-02-29
申请号：KR1020100080299
申请日：2010-08-19
Applicant: 삼성전기주식회사
CPC classification number: H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/00014
Abstract: PURPOSE: A circuit board, and a manufacturing method thereof, a semiconductor package with the circuit board, and a method for manufacturing the semiconductor package are provided to improve the degree of the integration of a semiconductor package by bonding a part of an outer connecting terminal, which enters a core substrate, to the core substrate. CONSTITUTION: A concave depression(112) of a dimple shape is formed at a core substrate(110). An external bonding pad(144) covers a surface of the depression at an uniform thickness. A solder resist pattern(150) covers the core substrate to expose the external bonding pad. A circuit pattern(146) is formed on the surface of the core substrate. A conductive via(142) is electrically connected to the circuit pattern and the external bonding pad.
Abstract translation: 目的：提供一种电路板及其制造方法，具有电路板的半导体封装以及半导体封装的制造方法，以通过将外部连接端子的一部分进行接合来提高半导体封装的集成度 ，其进入芯基板。 构成：在芯基板（110）处形成凹坑形状的凹陷（112）。 外部接合焊盘（144）以均匀的厚度覆盖凹部的表面。 阻焊剂图案（150）覆盖芯基板以暴露外部接合焊盘。 在芯基板的表面上形成电路图案（146）。 导电通孔（142）电连接到电路图案和外部接合焊盘。
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公开(公告)号：KR1020100043997A
公开(公告)日：2010-04-29
申请号：KR1020080103278
申请日：2008-10-21
Applicant: 삼성전기주식회사
CPC classification number: H05K3/425 , H05K1/115 , H05K3/181 , H05K2203/1438
Abstract: PURPOSE: A method for manufacturing a printed circuit board is provided to prevent the eccentricity of a via by forming a via hole on the center of an upper land. CONSTITUTION: A substrate has a first circuit layer and a second circuit layer. A first circuit layer is formed on one side of an insulation material(100). The first circuit layer comprises a lower land(510). The second circuit layer is formed in the other side of the insulation material. The second circuit layer includes an upper land(310) corresponding to the lower land. The land hole is formed on the center of the upper land. A via hole is formed under the land hole of the upper land to expose the lower land. A via(900) is formed by filing the conductive metal in a via hole.
Abstract translation: 目的：提供一种制造印刷电路板的方法，以通过在上部焊盘的中心形成通孔来防止通孔的偏心。 构成：衬底具有第一电路层和第二电路层。 第一电路层形成在绝缘材料（100）的一侧上。 第一电路层包括较低的焊盘（510）。 第二电路层形成在绝缘材料的另一侧。 第二电路层包括对应于下部焊盘的上部焊盘（310）。 地面洞形成在上地的中心。 在上部焊盘的地面孔下方形成通孔，露出下部焊盘。 通孔（900）通过将导电金属填充在通孔中而形成。
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公开(公告)号：KR1020150111682A
公开(公告)日：2015-10-06
申请号：KR1020140035338
申请日：2014-03-26
Applicant: 삼성전기주식회사
CPC classification number: H05K3/243 , H05K3/244 , H05K3/4007
Abstract: 본발명은인쇄회로기판및 그제조방법에관한것으로, 절연층의상면에형성된시드층과시드층의상면에형성된금속층으로구성된접속패드와, 상기접속패드를감싸도록형성된제1도금층및 상기제1도금층의측면을제외한제1도금층의상면에형성된제2도금층을포함한다.
Abstract translation: 印刷电路板及其制造方法技术领域本发明涉及印刷电路板及其制造方法。 印刷电路板包括：连接焊盘，其由形成在绝缘层的上侧的种子层和形成在种子层的上侧的金属层构成; 围绕连接垫的第一镀层; 以及第二镀层，其形成在所述第一镀层的除了所述第一镀层的侧面以外的上侧。
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公开(公告)号：KR101084931B1
公开(公告)日：2011-11-17
申请号：KR1020100064365
申请日：2010-07-05
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A printed circuit board with solder-resist shift coupon and a method of manufacturing the thereof, and a method for testing substrate using the same are provided to determine whether a position for forming a solder resist by manufacturing a printed circuit board having a solder resist shift coupon inserted therein. CONSTITUTION: In a printed circuit board with solder-resist shift coupon and a method of manufacturing the thereof, and a method for testing substrate using the same, at least one solder resist shift coupons is included in a dummy part. The shift coupon is a polygonal conductive metal. A solder resist layer(11) is formed in the inner side of a polygonal coupon pattern. A surface processing layer(13) forms on the shift coupon pattern.
Abstract translation: 目的：提供一种具有阻焊移位优惠券的印刷电路板及其制造方法，以及使用其制造基板的方法，以通过制造具有焊料的印刷电路板来确定形成阻焊剂的位置 抵抗偏移券插入其中。 构成：在具有阻焊移位试样的印刷电路板及其制造方法中，以及使用其制造基板的方法，至少一个阻焊层偏移试样被包括在虚拟部分中。 转移券是多边形导电金属。 在多边形试样图案的内侧形成阻焊层（11）。 在换板券图案上形成表面处理层（13）。
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Patent Agency Ranking
公开(公告)号：KR100731604B1
公开(公告)日：2007-06-22
申请号：KR1020060054425
申请日：2006-06-16
Applicant: 삼성전기주식회사
IPC: H05K3/06
Abstract: A method for manufacturing a printed circuit board having reinforced stiffness is provided to prevent jamming or damage of the board by reinforcing the stiffness of the board during assembly of a thin film chip scale package. A method for manufacturing a printed circuit board having reinforced stiffness includes the steps of: stacking a metallic layer on an insulation layer, and providing a mother substrate divided into a unit region and a dummy region(ST10); removing a part of the metallic layer corresponding to the unit region so that a thickness of the unit region is thinner than that of the dummy region(ST20); and forming a circuit pattern on a substrate region(ST30). The removing step includes the steps of stacking a photosensitive film layer on the mother substrate; selectively exposing and developing the photosensitive film layer corresponding to the unit region, and removing a part of the exposed and developed photosensitive film layer; half-etching the metallic layer corresponding to the unit region; and removing the photosensitive film layer remaining on the mother substrate.
Abstract translation: 提供一种用于制造具有增强刚度的印刷电路板的方法，以通过在组装薄膜芯片级封装期间增强板的刚度来防止卡板的卡住或损坏。 用于制造具有增强刚度的印刷电路板的方法包括以下步骤：在绝缘层上堆叠金属层，并提供被分成单位区域和虚设区域的母基板（ST10）; 除去与单位区域对应的金属层的一部分，使得单位区域的厚度比伪区域的厚度薄（ST20）; 并在基板区域上形成电路图案（ST30）。 除去步骤包括在母基板上层叠感光膜层的步骤; 选择性地曝光和显影对应于单位区域的感光膜层，并去除曝光和显影的感光膜层的一部分; 半蚀刻对应于单位区域的金属层; 并去除残留在母基板上的感光膜层。
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公开(公告)号：KR100567092B1
公开(公告)日：2006-03-31
申请号：KR1020030095648
申请日：2003-12-23
Applicant: 삼성전기주식회사
Abstract: 본 발명은 반도체 기판 및 그 제조 방법에 관한 것으로서, 회로패턴이 형성된 다수의 반도체 패키지로 구성된 스트립 시트와, 상기 스트립 시트의 이송 및 휨 현상을 방지하기 위하여 상기 스트립 시트의 일측면에 부착되는 보강부재를 포함하여 구성되고, 상기 보강부재는 에폭시 수지로 형성된 더미 시트인 것을 특징으로 한다.
따라서, 본 발명은 반도체 패키기자 형성된 스트립 시트의 일측면상에 더미 시트를 부착시킴으로써, 반도체 제작 공정중에 발생하는 휨불량을 저감시킬 뿐 아니라 생산성을 향상시키는 효과를 제공한다.
반도체 패키지, 스트립 시트, 보강부재, 더미 시트(dummy sheet), 접착부재-
公开(公告)号：KR1020050064292A
公开(公告)日：2005-06-29
申请号：KR1020030095648
申请日：2003-12-23
Applicant: 삼성전기주식회사
Abstract: 본 발명은 반도체 기판 및 그 제조 방법에 관한 것으로서, 회로패턴이 형성된 다수의 반도체 패키지로 구성된 스트립 시트와, 상기 스트립 시트의 이송 및 휨 현상을 방지하기 위하여 상기 스트립 시트의 일측면에 부착되는 보강부재를 포함하여 구성되고, 상기 보강부재는 에폭시 수지로 형성된 더미 시트인 것을 특징으로 한다.
따라서, 본 발명은 반도체 패키기자 형성된 스트립 시트의 일측면상에 더미 시트를 부착시킴으로써, 반도체 제작 공정중에 발생하는 휨불량을 저감시킬 뿐 아니라 생산성을 향상시키는 효과를 제공한다.-
9.发明授权
公开(公告)号：KR101118878B1
公开(公告)日：2012-03-12
申请号：KR1020100080299
申请日：2010-08-19
Applicant: 삼성전기주식회사
CPC classification number: H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/00014
Abstract: 본 발명은 집적도를 향상시킨 회로 기판에 관한 것이다. 본 발명에 따른 회로 기판은 외부를 향해 오목한 딤플(dimple) 형상의 함몰부를 갖는 코어 기판, 함몰부 표면을 균일한 두께로 덮는 외부 본딩 패드(outer bonding pad), 그리고 외부 본딩 패드가 선택적으로 노출되도록 코어 기판을 덮는 솔더 레지스트 패턴을 포함한다.
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公开(公告)号：KR1020110034509A
公开(公告)日：2011-04-05
申请号：KR1020090092051
申请日：2009-09-28
Applicant: 삼성전기주식회사
Inventor： 허혁
Abstract: PURPOSE: A printed circuit board and a manufacturing method thereof are provided to facilitate an under-fill process by securing a space between an electronic device and the printed circuit board through a protruded land. CONSTITUTION: A substrate including a circuit pattern with a pad is provided(S110). A land which is more protrusive than the outermost layer of the substrate is formed by plating the pad(S120). A solder layer is formed on the upper side of the land(S130).
Abstract translation: 目的：提供印刷电路板及其制造方法，以通过突出的地面固定电子设备和印刷电路板之间的空间来促进填充过程。 构成：提供包括具有垫的电路图案的基板（S110）。 通过对所述垫进行电镀而形成比所述基板的最外层更突出的平台（S120）。 在焊盘的上侧形成焊料层（S130）。
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